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AMD XC6SLX9-L1CSG324I
- Part No.:
- XC6SLX9-L1CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-L1CSG324I.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,079
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Product details
Overview
XC6SLX9-L1CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It operates at -1 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 324-pin CSBGA package. Used in low-cost industrial control interfaces requiring deterministic timing and moderate logic density.
For engineers reviewing the XC6SLX9-L1CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded DSP48A1 slices for filtering, and support for SPI/SelectMAP configuration modes in space-constrained industrial gateways.
Technical Context
The XC6SLX9-L1CSG324I implements a synchronous, SRAM-based FPGA architecture with configurable logic blocks (CLBs), dedicated digital signal processing (DSP48A1) slices, and clock management tiles (CMT) containing DCMs. It supports multi-voltage I/O operation across 12 I/O standards with programmable drive strength and slew rate control.
Configuration is performed via Master SPI, Slave SPI, or SelectMAP mode using external flash or processor. Bitstream security includes optional AES encryption and HMAC authentication to protect design IP in deployed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides sufficient resources for medium-complexity control logic and protocol bridging |
| Block RAM | 576 Kbits - supports dual-port FIFOs, small lookup tables, or data buffering without external memory |
| DSP Slices | 16 × DSP48A1 - enables fixed-point FIR filtering, multiply-accumulate, and math-intensive functions |
| I/O Banks | 18 - allows independent voltage domains per bank for mixed-signal interface consolidation |
| Speed Grade | -1 - guarantees timing closure up to 667 Mbps DDR3 data rates and 250 MHz system clocks |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial environments |
| Core Voltage | 1.2 V ±3% - requires tight regulation; compatible with standard 1.2 V DC-DC converters |
Pinout & Package
XC6SLX9-L1CSG324I is housed in a 15 mm × 15 mm, 324-ball fine-pitch CSP (CSG324) package with 0.8 mm ball pitch and Pb-free solder composition. The package supports reflow-compatible assembly and meets JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank 0 Supply | Configurable 1.2–3.3 V output voltage reference for Bank 0 signals |
| VCCAUX | Auxiliary Supply | Provides 2.5 V bias for configuration circuitry, PLLs, and transceivers |
| GND | Ground Reference | Multiple dedicated balls ensure low-inductance return paths for all power domains |
| PROGRAM_B | Configuration Init | Active-low asynchronous reset that clears configuration memory and restarts boot |
| CCLK | Configuration Clock | Input clock for Master SPI mode; frequency ≤ 50 MHz determines bitstream load time |
| M0/M1/M2 | Mode Select | Three-pin encoding selects configuration interface: SPI, SelectMAP, or JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Multi-standard I/O | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS) within same device - simplifies interface consolidation on single PCB |
| Dedicated DSP Blocks | 16 × DSP48A1 slices with 18×25-bit multipliers and 48-bit accumulators - enables real-time sensor fusion or motor control algorithms without external processors |
| Embedded Memory | 576 Kbits distributed as 18 × 32K-bit block RAMs - allows dual-port RAM access for simultaneous read/write in data acquisition pipelines |
| Configuration Security | AES-256 bitstream encryption and HMAC authentication - prevents unauthorized cloning or firmware tampering in field-deployed equipment |
| Low-Power Architecture | 1.2 V core with dynamic power gating - reduces active power to ~150 mW at 100 MHz toggle rate, suitable for thermally constrained enclosures |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Modular I/O expansion card handling 32-channel digital input with debounce, isolation, and status reporting over RS-485. IC Role / Device Role / Timing Role: FPGA fabric implements synchronized sampling, edge detection, and protocol framing logic; CMT ensures jitter-free UART and SPI clock generation. Use Value: Replaces multiple ASICs and glue logic with single reprogrammable device, reducing BOM count and enabling field-upgradable functionality. | Use Scenario: Pin electronics board generating precise stimulus waveforms and capturing response data from DUTs at 100+ MHz sample rates. IC Role / Device Role / Timing Role: XC6SLX9-L1CSG324I manages high-speed parallel bus interfacing, pattern sequencing, and real-time pass/fail analysis using embedded RAM and DSP slices. Use Value: Achieves sub-5 ns timing resolution for digital vector generation while maintaining deterministic latency through static timing analysis. |
| Medical Imaging Interface | Smart Energy Gateway |
Use Scenario: Front-end interface between ultrasound transducer array and ADC/DAC subsystem, handling channel multiplexing and time-of-flight alignment. IC Role / Device Role / Timing Role: Implements time-aligned sampling control, channel switching, and LVDS serializer/deserializer logic for high-fidelity analog data transport. Use Value: Enables 16-channel parallel acquisition with <100 ps inter-channel skew using dedicated I/O delay calibration and phase-matched clock trees. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, DLMS/COSEM, and MQTT traffic across smart meters, inverters, and sensors. IC Role / Device Role / Timing Role: XC6SLX9-L1CSG324I hosts protocol stacks, secure TLS offload, and hardware-accelerated CRC/SHA-1 for firmware updates. Use Value: Delivers deterministic packet forwarding latency (<50 µs) and cryptographic acceleration without burdening host ARM processor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX9-TQG144C | Same logic capacity and architecture but in 144-pin TQFP package; lower I/O count (102 vs. 220); no multi-voltage I/O banks | Suitable for cost-sensitive prototyping where board area is less constrained and fewer I/O standards are needed | Select when footprint size and thermal dissipation allow larger package and reduced I/O flexibility is acceptable |
| Lattice LCMXO3LF-1300E | Non-volatile FPGA (no external config flash required); 1,300 LUTs; no DSP slices; max I/O = 100; supports only 1.2/3.3 V I/O | Better for ultra-low-power always-on monitoring nodes, not for high-speed data path or complex protocol bridging | Choose for battery-powered edge sensors needing instant-on operation and minimal external components |
Compared with XC6SLX9-L1CSG324I, the XC6SLX9-TQG144C trades I/O flexibility and density for simpler PCB routing, while the LCMXO3LF-1300E sacrifices logic capacity and DSP capability for zero-configuration startup and lower static power - making each suitable for distinct system-level trade-offs.
Availability
XC6SLX9-L1CSG324I is available at Aetrix Electronics and suitable for industrial control, test instrumentation, and medical interface designs requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6SLX9-L1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family under the AMD Adaptive SoC portfolio.
The Spartan-6 family targets cost-sensitive, high-volume applications requiring reliable performance, low power, and flexible I/O - especially in industrial automation, video surveillance, and communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX9-L1CSG324I?
The XC6SLX9-L1CSG324I supports DDR3 SDRAM interfaces up to 667 Mbps data rate (333 MHz clock) in the -1 speed grade. This is verified by Xilinx UG382 timing closure reports and validated using MIG v3.7 IP core. The XC6SLX9-L1CSG324I achieves this using dedicated I/O delay calibration and source-synchronous capture logic, with setup/hold margins meeting JEDEC specifications under worst-case voltage and temperature conditions.
Does XC6SLX9-L1CSG324I support JTAG boundary-scan testing?
Yes, XC6SLX9-L1CSG324I includes IEEE 1149.1-compliant JTAG TAP controller and boundary-scan logic. It supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. The JTAG interface operates at up to 25 MHz and is accessible via dedicated TCK/TMS/TDI/TDO pins, enabling full-board visibility during manufacturing test and in-system debugging of the XC6SLX9-L1CSG324I and surrounding components.
Can XC6SLX9-L1CSG324I be configured using an external microcontroller?
Yes, XC6SLX9-L1CSG324I supports Slave Serial and Slave Parallel (SelectMAP) configuration modes, allowing direct programming by an external microcontroller. In Slave Serial mode, the MCU drives the CCLK and DIN lines; in SelectMAP mode, it writes 8-bit or 16-bit words to the XC6SLX9-L1CSG324I's configuration port. Configuration status is monitored via INIT_B and DONE pins, enabling robust error recovery in field-upgrade scenarios.
What is the purpose of the VCCAUX supply on XC6SLX9-L1CSG324I?
VCCAUX supplies 2.5 V to internal auxiliary circuits including configuration logic, clock management tiles (DCMs), and I/O bank reference generators. It must be powered before or simultaneously with VCCO and VCCINT. The XC6SLX9-L1CSG324I requires stable 2.5 V ±5% regulation; failure to meet this spec may cause configuration failure, clock instability, or I/O calibration errors during XC6SLX9-L1CSG324I operation.
Is XC6SLX9-L1CSG324I RoHS compliant and lead-free?
Yes, XC6SLX9-L1CSG324I is RoHS compliant and manufactured with lead-free (Pb-free) solder finish per JEDEC J-STD-020. The CSG324 package uses matte tin surface finish on copper pillars, and the device meets EU Directive 2011/65/EU requirements. Full compliance documentation, including material declarations and test reports, is available through AMD's Product Change Notification (PCN) archive for XC6SLX9-L1CSG324I.
XC6SLX9-L1CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX9-L1CSG324I FAQ
1.How can I place an order for XC6SLX9-L1CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-L1CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-L1CSG324I reliable?
The price and inventory of XC6SLX9-L1CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-L1CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-L1CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-L1CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-L1CSG324I?
XC6SLX9-L1CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-L1CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-L1CSG324I?
For technical support, including XC6SLX9-L1CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-L1CSG324I requirements.
6.How does Aetrix verify that XC6SLX9-L1CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-L1CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-L1CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-L1CSG324I?
All XC6SLX9-L1CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-L1CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-L1CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX9-L1CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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