Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC6SLX9-L1FT256I

Part No.:
XC6SLX9-L1FT256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-LBGA
Datasheet:
AetrixXC6SLX9-L1FT256I.pdf
Description:
IC FPGA 186 I/O 256FTBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,725

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC6SLX9-L1FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards in a 256-pin FTBGA package. It targets low-cost, low-power embedded control and interface bridging applications.

For engineers reviewing the XC6SLX9-L1FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), -1 speed grade timing performance, industrial temperature range (-40°C to +100°C), and integrated clock management via DCM blocks.

Technical Context

The XC6SLX9-L1FT256I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated arithmetic carry logic and distributed RAM. It integrates two Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and frequency multiplication/division.

Configuration is performed via Master Serial mode using an external SPI PROM or JTAG boundary-scan. The device supports partial reconfiguration and includes built-in system monitor functionality for on-chip temperature and supply voltage measurement.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells9,152 - provides gate count equivalent to ~100K ASIC gates for moderate-complexity control logic
Block RAM576 Kbits - supports dual-port FIFOs, data buffering, or small lookup tables without external memory
I/O Banks18 - enables mixed-voltage operation across different interface domains (e.g., 3.3 V MCU + 1.8 V sensor)
DCM Units2 - delivers jitter-tolerant clock generation, deskew, and dynamic phase adjustment
Speed Grade-1 - guarantees maximum operating frequency up to 667 Mbps for DDR2 interfaces at industrial temp
Operating Temp-40°C to +100°C - qualified for industrial environments without derating
Package256-pin FTBGA (17×17 mm, 1.0 mm pitch) - compatible with standard PCB assembly processes

Pinout & Package

XC6SLX9-L1FT256I is housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch and 17×17 array configuration. Thermal pad exposed on underside improves power dissipation for sustained logic activity.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 output supply - sets voltage level for all pins in bank 0 (supports 1.2/1.5/1.8/2.5/3.3 V)
K1GCLK1Global clock input - low-skew routing to all logic regions for synchronous design timing closure
T1M0Configuration mode select - determines boot source (e.g., Master Serial PROM vs. JTAG)
R2INIT_BOpen-drain initialization status - signals configuration success/failure to system controller
P3CCLKConfiguration clock - generated internally during Master Serial mode or driven externally during Slave modes
Y2VCCAUXAnalog auxiliary supply - powers internal PLL/DCM circuitry and must be stable at 3.3 V ±5%

Key Features

FeatureDesign Value
Dedicated DSP48A1 slices16 - enables hardware-accelerated multiply-accumulate operations for filtering or motor control
SelectIO technologySupports 18 I/O standards including SSTL18, HSTL, and LVDS - eliminates level-shifter components
Embedded Block RAM576 Kbits distributed across 24 blocks - allows independent read/write ports for dual-clock FIFOs
Digital Clock Manager (DCM)Two fully independent DCMs - provide clock doubling, duty-cycle correction, and phase alignment without external PLL ICs
System MonitorOn-die temperature and VCCINT/VCCAUX sensors - enables real-time thermal throttling or supply health monitoring

Applications

Industrial PLC I/O ModuleAutomotive Diagnostic Interface

Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus (CAN/RS-485) and host microcontroller.

IC Role / Device Role / Timing Role: FPGA acts as glue logic and interface bridge with deterministic latency under 50 ns.

Use Value: XC6SLX9-L1FT256I replaces discrete logic and multiple level shifters while maintaining industrial temperature operation.

Use Scenario: Translating UDS (Unified Diagnostic Services) messages between OBD-II connector and ECU debug port.

IC Role / Device Role / Timing Role: Protocol-aware state machine implementing ISO 15765-2 framing and error handling.

Use Value: XC6SLX9-L1FT256I leverages SelectIO to interface directly with 3.3 V CAN transceivers and 5 V legacy diagnostic tools.

Medical Sensor HubTest Equipment Pattern Generator

Use Scenario: Aggregating analog sensor data (ECG, SpO₂) via ADC interfaces and applying real-time digital filtering before transmission.

IC Role / Device Role / Timing Role: Configurable logic handles time-critical sampling synchronization and FIR filter execution.

Use Value: XC6SLX9-L1FT256I uses embedded DSP48A1 slices to execute 16-tap FIR filters at 1 MS/s without CPU intervention.

Use Scenario: Generating precise multi-channel digital stimulus waveforms for IC functional validation.

IC Role / Device Role / Timing Role: High-speed parallel I/O bank drives 32-bit pattern bus with sub-nanosecond skew control.

Use Value: XC6SLX9-L1FT256I achieves 125 MHz parallel output using DCM-based clock domain crossing and output register alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX9-2TQG144CSlower -2 speed grade, smaller 144-pin TQFP package, no thermal pad, commercial temp only (0°C to +85°C)Limited to cost-sensitive consumer or lab equipment where industrial temp and BGA assembly are unnecessaryChoose when board space permits larger footprint and ambient conditions remain benign
XC7S6-1CSGA225CArtix-7 architecture, higher logic density (6,200 LUTs), 12-bit SAR ADC, integrated PCIe block, but requires 1.0 V core supplyBetter suited for designs needing analog integration or high-speed serial connectivity beyond Spartan-6 capabilityChoose when migrating to newer architecture with enhanced peripherals and lower static power

Compared with XC6SLX9-L1FT256I, the XC6SLX9-2TQG144C trades industrial reliability and I/O scalability for simpler assembly, while the XC7S6-1CSGA225C offers architectural upgrades at the cost of increased power complexity and toolchain migration effort.

Availability

XC6SLX9-L1FT256I is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor hub applications requiring stable component supply over extended production lifecycles.

Supply support for XC6SLX9-L1FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families for adaptive computing solutions.

The Spartan-6 family, including XC6SLX9-L1FT256I, was designed for cost-sensitive, low-power embedded control, bridging, and interface consolidation in industrial and automotive systems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX9-L1FT256I?

XC6SLX9-L1FT256I supports I/O voltages from 1.2 V to 3.3 V across its 18 selectable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 3.3 V microcontrollers communicating with 1.8 V sensors. VCCO per bank must match the selected I/O standard's required voltage, and all pins within a bank share the same VCCO supply.

Does XC6SLX9-L1FT256I include on-chip clock generation resources?

Yes, XC6SLX9-L1FT256I integrates two Digital Clock Managers (DCMs). Each DCM provides clock frequency synthesis, phase shifting, duty cycle correction, and input clock deskewing. These resources eliminate the need for external clock ICs in many timing-critical applications, including DDR2 memory interfaces and synchronized data acquisition systems.

Can XC6SLX9-L1FT256I be configured via JTAG only?

No, XC6SLX9-L1FT256I supports multiple configuration modes including JTAG, Master Serial (SPI PROM), Slave Serial, and Slave SelectMAP. JTAG is used primarily for debugging and programming during development, while Master Serial is typical for production deployment. Mode selection is controlled by M0–M2 pins at power-up.

What is the purpose of the VCCAUX supply pin on XC6SLX9-L1FT256I?

VCCAUX supplies power to internal analog circuitry including the Digital Clock Managers (DCMs), configuration logic, and JTAG controller. It must be regulated at 3.3 V ±5% and decoupled with low-ESR capacitors near the package. Failure to maintain stable VCCAUX can cause configuration failure or clock instability, even if VCCINT and VCCO are within specification.

Is XC6SLX9-L1FT256I qualified for industrial temperature operation?

Yes, XC6SLX9-L1FT256I is rated for operation from -40°C to +100°C and is marked with the "I" suffix indicating industrial temperature qualification. This rating applies to all logic, I/O, and embedded resources including DCMs and Block RAM, with full timing specifications guaranteed across the range without derating.

XC6SLX9-L1FT256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
715
Number of Logic Elements/Cells:
9152
Total RAM Bits:
589824
Number of I/O:
186
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FTBGA (17x17)

XC6SLX9-L1FT256I FAQ

1.How can I place an order for XC6SLX9-L1FT256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX9-L1FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX9-L1FT256I reliable?

The price and inventory of XC6SLX9-L1FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-L1FT256I is usually 5 days.

3.What payment methods are accepted for XC6SLX9-L1FT256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-L1FT256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX9-L1FT256I?

XC6SLX9-L1FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX9-L1FT256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX9-L1FT256I?

For technical support, including XC6SLX9-L1FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-L1FT256I requirements.

6.How does Aetrix verify that XC6SLX9-L1FT256I is sourced from the original manufacturer or authorized distributors?

All XC6SLX9-L1FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-L1FT256I meets industry standards.

7.What is the process for return or replacement of XC6SLX9-L1FT256I?

All XC6SLX9-L1FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-L1FT256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX9-L1FT256I part is unused and in its original packaging.

Return procedure for XC6SLX9-L1FT256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX9-L1FT256I Tags

  • XC6SLX9-L1FT256I
  • XC6SLX9-L1FT256I PDF
  • XC6SLX9-L1FT256I Datasheet
  • XC6SLX9-L1FT256I Specifications
  • XC6SLX9-L1FT256I Images
  • AMD
  • AMD XC6SLX9-L1FT256I
  • Buy XC6SLX9-L1FT256I
  • XC6SLX9-L1FT256I Price
  • XC6SLX9-L1FT256I Distributor
  • XC6SLX9-L1FT256I Supplier
  • XC6SLX9-L1FT256I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER