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AMD XC6SLX9-L1FTG256I
- Part No.:
- XC6SLX9-L1FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-L1FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,990
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Product details
Overview
XC6SLX9-L1FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It operates at -1 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 256-pin FTBGA package, used in industrial control logic and low-power embedded interface bridging.
For engineers reviewing the XC6SLX9-L1FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded DSP slice count, configuration mode support (Master Serial, Slave SelectMAP), and industrial-grade thermal reliability.
Technical Context
The XC6SLX9-L1FTG256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated digital clock managers (DCMs) for jitter reduction. It supports multi-standard I/O with programmable drive strength (2–24 mA) and slew rate control per bank.
Configuration is performed via SPI flash (Master Serial mode) or external processor (Slave SelectMAP), with bitstream encryption optional using AES-256. The device includes 16 embedded 18×18 multipliers and supports partial reconfiguration in select designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for control state machines or protocol engines |
| Block RAM | 576 Kbits - enables on-chip buffering for video line buffers, FIFOs, or small lookup tables |
| DSP Slices | 16 × 18×18 multipliers - supports fixed-point filtering, motor control PWM generation, or sensor fusion math |
| I/O Banks | 18 - allows independent voltage domain assignment (1.2 V to 3.3 V) per bank for mixed-voltage interfacing |
| DCMs | 2 - provide clock frequency synthesis, phase shifting, and duty-cycle correction without external PLL ICs |
| Speed Grade | -1 - guarantees timing closure up to 667 Mbps DDR3 data rates and 250 MHz system clocks at industrial temp |
| Configuration Mode | Master Serial / Slave SelectMAP - enables boot-from-flash or host-controlled dynamic reconfiguration |
Pinout & Package
XC6SLX9-L1FTG256I is housed in a 256-pin Fine-Pitch Thin Quad Flatpack Ball Grid Array (FTBGA) with 1.0 mm ball pitch, 17×17 array, and 1.2 mm package height. Thermal pad exposed on underside improves power dissipation for sustained 125 mW typical operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - must be decoupled locally for signal integrity at 3.3 V or 2.5 V operation |
| K1 | GND | Ground reference for adjacent I/O and internal logic - connects to PCB ground plane via multiple vias |
| M2 | CCLK | Configuration clock input - driven by PROM or microcontroller during bitstream loading |
| P3 | DIN | Serial configuration data input - receives bitstream LSB-first from SPI flash |
| T1 | PROGRAM_B | Active-low reset - initiates configuration reload and clears internal SRAM upon deassertion |
| R1 | INIT_B | Open-drain status output - signals configuration progress and CRC error detection |
| U1 | DONE | Open-drain completion indicator - pulled high externally when configuration succeeds and I/Os are released |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | 18 independent banks support simultaneous 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling - eliminates level-shifters in mixed-interface systems |
| Dedicated Clock Resources | 2 Digital Clock Managers (DCMs) provide jitter < ±100 ps and enable clock doubling, phase alignment, and spread-spectrum modulation |
| Embedded Memory | 576 Kbits of block RAM organized as 18 Kb blocks - usable as dual-port RAM, ROM, or shift registers without consuming logic cells |
| Configurable I/O Drive | Programmable drive strength (2–24 mA) and slew rate per pin - reduces EMI and matches trace impedance in high-speed interfaces |
| AES Bitstream Encryption | Optional 256-bit AES key storage in on-chip battery-backed RAM - prevents reverse engineering of configuration logic |
Applications
| Industrial PLC Logic | Automotive Camera Interface |
|---|---|
Use Scenario: Real-time ladder logic execution and fieldbus (CAN/RS-485) bridging in compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom I/O scanning, PID loop acceleration, and protocol translation. Use Value: Enables deterministic sub-10 µs I/O update cycles using DCM-synchronized clocks and on-chip RAM-based tag storage. | Use Scenario: MIPI CSI-2 to parallel LVDS conversion for rear-view camera modules in ADAS ECUs. IC Role / Device Role / Timing Role: Serializer/deserializer bridge with pixel clock recovery and frame buffer management. Use Value: Leverages 18 I/O banks to isolate MIPI (1.2 V) and LVDS (3.3 V) domains while using block RAM for line buffering. |
| Medical Sensor Hub | Energy Metering Gateway |
Use Scenario: Aggregation and preprocessing of analog sensor data (ECG, SpO₂) in portable diagnostic devices. IC Role / Device Role / Timing Role: ADC interface controller with oversampling FIR filter implementation in LUTs and DSP slices. Use Value: Achieves >85 dB SNR through 16× oversampling and on-chip 18×18 multiplier-based decimation filtering. | Use Scenario: Multi-tariff energy meter with RS-485, IR, and PLC communication interfaces. IC Role / Device Role / Timing Role: Protocol gateway managing concurrent serial physical layers and secure firmware updates. Use Value: Uses Master Serial configuration with encrypted bitstream to prevent tampering of tariff logic and calibration constants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2TQG144C | Higher speed grade (-2), smaller 144-pin TQFP package, no thermal pad, commercial temp range (0°C to +85°C) | Suitable for cost-sensitive consumer prototypes but lacks industrial temp rating and I/O count | Select only if board space is constrained and ambient operating temperature remains below 85°C |
| LFE5U-12F-6BG256C | 5M Series ECP5 FPGA, 12K LUTs, integrated SERDES, lower static power, -6 speed grade, commercial temp | Better for high-speed serial links (e.g., USB 2.0, PCIe Gen1), but lacks native DDR3 PHY and industrial temp support | Prefer when adding differential I/O or embedded transceivers outweighs need for guaranteed -40°C startup |
Compared with XC6SLX9-L1FTG256I, the XC6SLX9-2TQG144C trades industrial reliability for footprint savings, while the LFE5U-12F-6BG256C offers modern transceiver integration at the expense of guaranteed extended-temperature operation and DDR3 memory controller compatibility.
Availability
XC6SLX9-L1FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and smart energy metering requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6SLX9-L1FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for legacy industrial and aerospace applications requiring long-term availability and proven reliability.
The Spartan-6 family targets cost-sensitive, low-power embedded control and interface bridging where ASIC development cost or FPGA reprogrammability provides decisive advantage over fixed-function ICs.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX9-L1FTG256I?
The XC6SLX9-L1FTG256I supports I/O standards from 1.2 V to 3.3 V across its 18 independent banks. Each bank can be configured for LVCMOS, LVTTL, or SSTL-18/25, with VCCO set individually per bank. This allows direct interfacing with DDR2 memory, microcontrollers, and legacy peripherals without external level shifters. The XC6SLX9-L1FTG256I datasheet specifies absolute maximum VCCO as 3.465 V.
Does XC6SLX9-L1FTG256I support JTAG boundary-scan testing?
Yes, XC6SLX9-L1FTG256I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated and mapped to balls D15, E15, D14, and E14 respectively. The XC6SLX9-L1FTG256I supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions per the JTAG standard.
Can XC6SLX9-L1FTG256I configure from a parallel NOR flash device?
No, XC6SLX9-L1FTG256I does not support parallel NOR flash in Master SelectMAP mode due to lack of dedicated address/data bus pins. It supports Master Serial (SPI flash), Slave SelectMAP (host processor), and JTAG configuration only. The XC6SLX9-L1FTG256I requires external microcontroller or CPLD for parallel interface emulation if NOR flash is mandatory.
What is the thermal resistance (θJA) of XC6SLX9-L1FTG256I in its FTBGA package?
The XC6SLX9-L1FTG256I has a published junction-to-ambient thermal resistance (θJA) of 32.5°C/W under JEDEC JESD51-2 conditions (2s2p test board). With its exposed thermal pad soldered to a 4-layer PCB's internal ground plane, actual θJA can improve to ~24°C/W. The XC6SLX9-L1FTG256I industrial temperature rating assumes proper thermal design meeting these limits.
Is bitstream encryption enabled by default on XC6SLX9-L1FTG256I?
No, AES bitstream encryption is disabled by default on XC6SLX9-L1FTG256I and must be explicitly enabled during bitstream generation using Xilinx ISE Design Suite v14.7 or later. A 256-bit key must be programmed into on-chip battery-backed RAM or external eFUSE. The XC6SLX9-L1FTG256I will not load unencrypted bitstreams when encryption is enabled in the configuration header.
XC6SLX9-L1FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-L1FTG256I FAQ
1.How can I place an order for XC6SLX9-L1FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-L1FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-L1FTG256I reliable?
The price and inventory of XC6SLX9-L1FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-L1FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-L1FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-L1FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-L1FTG256I?
XC6SLX9-L1FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-L1FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-L1FTG256I?
For technical support, including XC6SLX9-L1FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-L1FTG256I requirements.
6.How does Aetrix verify that XC6SLX9-L1FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-L1FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-L1FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-L1FTG256I?
All XC6SLX9-L1FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-L1FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-L1FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX9-L1FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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