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AMD XC6SLX9-N3CSG324C
- Part No.:
- XC6SLX9-N3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-N3CSG324C.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC6SLX9-N3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It operates at -3 speed grade with 1.2 V core voltage and targets low-cost, low-power embedded control and interface bridging applications.
For engineers reviewing the XC6SLX9-N3CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded DSP48A1 slices for arithmetic acceleration, and support for SPI/SelectMAP configuration interfaces in space-constrained industrial controllers.
Technical Context
The XC6SLX9-N3CSG324C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for efficient arithmetic. It integrates twelve 18×18-bit multiplier blocks (DSP48A1) and supports dual-edge clocking for high-throughput data path design.
Configuration is performed via Master Serial (SPI flash), Slave Serial, or SelectMAP modes using dedicated CONFIG pins. The device includes internal oscillator, JTAG boundary-scan (IEEE 1149.1), and partial reconfiguration capability enabled through bitstream manipulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~100K ASIC gates for moderate-complexity control and glue logic |
| Block RAM | 576 Kbits - supports up to 128 × 4,096-bit dual-port memory instances for FIFO or buffer implementation |
| DSP Slices | 12 × DSP48A1 - enables 18×18 signed multiplication or accumulate operations per slice at up to 250 MHz |
| I/O Banks | 18 - allows mixed-voltage operation across banks (1.2V/1.8V/2.5V/3.3V) for interfacing legacy and modern peripherals |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz for internal logic and 1,080 Mbps for differential I/O (LVDS) |
| Configuration Mode | Master Serial / Slave Serial / SelectMAP - enables flexible boot sources including SPI flash, microcontroller, or host processor |
Pinout & Package
XC6SLX9-N3CSG324C is housed in a 324-pin CSGA (Chip-Scale Grid Array) package with 216 user I/O pins, 10 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, CCLK, DIN), and 8 power/ground pairs distributed across the perimeter for stable core and I/O supply decoupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-low configuration reset | Asserting low initiates full reconfiguration; synchronous with next rising edge of CCLK |
| INIT_B | Configuration status indicator | Open-drain output signals configuration completion or error during startup |
| CCLK | Configuration clock input | Drives serial bitstream loading in Master/Slave Serial mode; max 50 MHz frequency |
| DIN | Serial configuration data input | Accepts bitstream LSB-first; used with CCLK in Master Serial mode |
| M0–M2 | Mode select inputs | Set configuration mode (e.g., 000 = Master Serial, 001 = Slave Serial, 010 = SelectMAP) |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports independent VCCO per bank (1.2V to 3.3V), enabling direct connection to diverse peripherals without level shifters |
| Dedicated Clock Resources | Four DCMs (Digital Clock Managers) provide jitter reduction, phase shifting, and frequency synthesis for up to 8 clock outputs each |
| Embedded Block RAM | Configurable as single-port, dual-port, or FIFO memory with byte-write enable-ideal for buffering sensor data streams |
| JTAG Boundary-Scan | Fully compliant with IEEE 1149.1 for board-level testability and in-system programming without external programmers |
| Partial Reconfiguration | Allows dynamic replacement of logic modules while system remains operational-used in adaptive communication protocols |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (CAN, RS-485) and controller CPU. IC Role / Device Role / Timing Role: FPGA acts as programmable logic layer handling signal conditioning, timing-critical edge detection, and multi-protocol state machines. Use Value: XC6SLX9-N3CSG324C delivers deterministic sub-microsecond response latency and supports concurrent RS-485 half-duplex and CAN FD framing in same design. | Use Scenario: OBD-II to USB/CAN bridge in vehicle service tools with firmware-upgradable protocol stacks. IC Role / Device Role / Timing Role: XC6SLX9-N3CSG324C serves as protocol gateway managing physical layer handshaking, message filtering, and diagnostic session state. Use Value: On-chip block RAM stores multiple ECU-specific diagnostic scripts; DSP slices accelerate checksum verification for UDS services. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregation and preprocessing of analog sensor data (ECG, SpO₂) before transmission to ARM-based host MCU. IC Role / Device Role / Timing Role: FPGA performs real-time digital filtering, oversampling, and timestamp alignment across asynchronous ADC channels. Use Value: XC6SLX9-N3CSG324C's 12 DSP48A1 slices execute FIR filters at 2 MSPS per channel with <1 µs latency. | Use Scenario: Generating precise digital stimulus waveforms (e.g., PRBS, custom bit patterns) for IC functional validation. IC Role / Device Role / Timing Role: XC6SLX9-N3CSG324C functions as high-speed pattern sequencer with deterministic I/O timing and jitter-free clock domain crossing. Use Value: 216 user I/O pins support parallel 32-bit wide vector output at 100 MHz; internal DCMs generate phase-aligned clocks for setup/hold compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX9-2CSG324C | Slower -2 speed grade; lower maximum I/O toggle rate (800 Mbps vs. 1,080 Mbps) and reduced internal logic timing margin | Suitable for non-real-time control where clock frequencies ≤300 MHz are sufficient | Select when cost sensitivity outweighs need for highest-speed I/O or tight timing closure |
| Lattice LCMXO3LF-1300E-5UWG36CTR | Lower density (1,300 LUTs), no embedded multipliers, but lower static power (1.2 mW vs. 15 mW typical) and instant-on capability | Better fit for always-on, battery-powered supervisory logic rather than compute-intensive bridging | Choose for ultra-low-power wake-on-event applications where DSP or large RAM is unnecessary |
Compared with XC6SLX9-N3CSG324C, the -2 variant trades performance headroom for cost, while the Lattice device offers power efficiency at the expense of logic capacity and arithmetic capability-selection depends on whether throughput, latency, or quiescent power dominates the system requirement.
Availability
XC6SLX9-N3CSG324C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor interface designs requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX9-N3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous system acceleration.
The Spartan-6 family-including XC6SLX9-N3CSG324C-was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, low static power, and seamless integration with microcontrollers and standard peripherals.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX9-N3CSG324C?
The XC6SLX9-N3CSG324C supports I/O standards up to 3.3 V across its 18 configurable banks. Each bank has independent VCCO supply, allowing simultaneous operation with 1.2 V, 1.8 V, 2.5 V, and 3.3 V interfaces. This eliminates external level shifters in mixed-voltage systems. The device does not support 5 V-tolerant I/O natively; external protection or translation is required for 5 V signaling.
Does XC6SLX9-N3CSG324C support partial reconfiguration in production systems?
Yes, XC6SLX9-N3CSG324C supports partial reconfiguration through Xilinx ISE Design Suite tools and documented bitstream manipulation methods. Field-upgradable modules-such as protocol engines or filter coefficients-can be swapped without resetting the entire FPGA. Implementation requires careful floorplanning and use of the Xilinx Partial Reconfiguration Controller IP core. Verified use cases include adaptive CAN FD frame processors and runtime-adjustable sensor fusion pipelines.
How many clock regions and DCMs are available in XC6SLX9-N3CSG324C?
XC6SLX9-N3CSG324C contains four Digital Clock Managers (DCMs), each capable of generating up to eight clock outputs with features including phase shifting, frequency synthesis, and duty-cycle correction. These DCMs are distributed across two clock regions. The device lacks PLLs; all clock management relies on DCM functionality. This architecture supports multi-domain timing but requires explicit constraint-driven placement for optimal skew control.
Can XC6SLX9-N3CSG324C be configured via JTAG alone without external flash memory?
Yes, XC6SLX9-N3CSG324C can be fully configured via JTAG boundary-scan using a compatible programmer (e.g., Xilinx Platform Cable USB II). This method loads configuration bitstream directly into SRAM and is ideal for development and debugging. However, JTAG configuration is volatile-power loss erases the configuration. For production, non-volatile storage (e.g., SPI flash) is required unless paired with a persistent host controller that reprograms on power-up.
What thermal considerations apply to XC6SLX9-N3CSG324C in continuous operation?
XC6SLX9-N3CSG324C has a maximum junction temperature of 100 °C and uses a thermally enhanced CSGA package with exposed thermal pad. In continuous operation at full utilization, typical power dissipation is 150–250 mW depending on I/O activity and clock frequency. Adequate PCB copper pour under the thermal pad and minimal ambient airflow (≥0.5 m/s) are recommended. Thermal simulation using Xilinx XPower Analyzer with actual design constraints is advised before final layout.
XC6SLX9-N3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX9-N3CSG324C FAQ
1.How can I place an order for XC6SLX9-N3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-N3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-N3CSG324C reliable?
The price and inventory of XC6SLX9-N3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-N3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-N3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-N3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-N3CSG324C?
XC6SLX9-N3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-N3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-N3CSG324C?
For technical support, including XC6SLX9-N3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-N3CSG324C requirements.
6.How does Aetrix verify that XC6SLX9-N3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-N3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-N3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-N3CSG324C?
All XC6SLX9-N3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-N3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-N3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX9-N3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX9-N3CSG324C Tags
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