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AMD XC6SLX9-N3FT256C
- Part No.:
- XC6SLX9-N3FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-N3FT256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,489
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Product details
Overview
XC6SLX9-N3FT256C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices. It operates at -3 speed grade with 1.2 V core voltage and supports LVCMOS/LVTTL/I²C interfaces. It targets low-cost, low-power embedded control and industrial interface bridging.
For engineers reviewing the XC6SLX9-N3FT256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (186 user I/Os), thermal performance in FT256 package, configuration via SPI/BPI, and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX9-N3FT256C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO™ technology supporting single-ended standards up to 1.8 V and differential standards including LVDS and RSDS.
Configuration is performed via Master Serial (SPI flash), Slave Serial, or JTAG modes. The device includes internal oscillator, startup clock, and power-on reset circuitry - all fixed and non-user-configurable per DS160 specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit dual-port RAM blocks for data buffering |
| DSP Slices | 24 × DSP48A1 - each supports 18×18-bit multiply-accumulate with pre-adder for filtering |
| User I/O Pins | 186 - configurable as input/output/bidirectional with programmable slew rate and drive strength |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial temperature |
| Core Voltage | 1.2 V ±3% - requires tight regulation; impacts static/dynamic power and timing margin |
Pinout & Package
The XC6SLX9-N3FT256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA256, RoHS-compliant, 17×17 mm, 1.0 mm pitch). Package dimensions and thermal characteristics align with Xilinx specification DS160 (v1.9).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - must be set to match connected interface voltage (1.2–3.3 V) |
| P2 | CCLK | Configuration clock input - driven by external master or internal oscillator during startup |
| T12 | INIT_B | Open-drain status output - asserted low during configuration, high when complete and valid |
| R15 | PROGRAM_B | Active-low asynchronous reset - forces reconfiguration and clears configuration memory |
| Y16 | DONE | Open-drain output - goes high when configuration completes and internal logic is released from reset |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential LVDS - enables direct interfacing with diverse peripherals without level shifters |
| Embedded Memory | 576 Kbits of true dual-port block RAM - allows simultaneous read/write access for FIFOs, frame buffers, or lookup tables |
| DSP48A1 Slice | 24 dedicated arithmetic units each with 18×18 multiplier, 48-bit accumulator, and pipeline registers - accelerates FIR filters and motor control algorithms |
| Configuration Security | Bitstream encryption via AES-256 key stored in on-chip eFUSE - prevents reverse engineering of programmed logic |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (CAN, RS-485) and host controller. IC Role / Device Role / Timing Role: FPGA acts as programmable glue logic and protocol bridge; handles timing-critical edge detection and bit-banging. Use Value: XC6SLX9-N3FT256C provides 186 user I/Os and deterministic latency under 5 ns for input sampling - enabling sub-millisecond response in safety-critical loops. | Use Scenario: Translating UDS (ISO 14229) commands between USB-CDC host and legacy vehicle ECUs over K-Line or CAN. IC Role / Device Role / Timing Role: XC6SLX9-N3FT256C serves as protocol-aware bridge with on-the-fly message parsing and checksum generation. Use Value: Built-in I²C and UART-capable I/O banks allow direct connection to microcontroller debug ports; -3 speed grade ensures reliable 500 kbps K-Line timing compliance. |
| Medical Sensor Hub | Test & Measurement Front-End |
Use Scenario: Aggregating analog sensor data (ECG, SpO₂) via ADC interface and performing real-time baseline correction and noise filtering. IC Role / Device Role / Timing Role: XC6SLX9-N3FT256C implements custom digital filters and timestamping logic synchronized to external 1 MHz sample clock. Use Value: 24 DSP48A1 slices enable parallel 4th-order IIR filter execution at 2 MSPS; block RAM stores coefficient sets for adaptive filtering. | Use Scenario: Digitizing and preprocessing analog signals from oscilloscope or spectrum analyzer front-ends before transfer to ARM host. IC Role / Device Role / Timing Role: FPGA performs high-speed data capture, trigger logic, and DDR2 memory controller functions. Use Value: XC6SLX9-N3FT256C supports 186 I/Os with programmable I/O standards - enabling direct connection to 12-bit ADCs and DDR2 SDRAM at 200 MHz data rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256C | Slower -2 speed grade; same logic resources, package, and I/O count | Lower maximum clock frequency (400 MHz vs. 500 MHz); reduced timing margin in high-speed designs | Preferred where cost sensitivity outweighs timing headroom needs and thermal budget permits relaxed speed grade |
| LFE5U-12F-6BG256C | 12K LUTs, 1.2 V core, 192 I/Os, integrated SERDES; different architecture (ECP5 family) | Supports embedded PCIe and Gigabit Ethernet PHY; lacks native I²C but offers more flexible I/O banking | Chosen when serial connectivity or higher logic density is required, accepting toolchain (Lattice Diamond) and IP ecosystem differences |
Compared with XC6SLX9-N3FT256C, the -2 variant trades timing margin for cost, while the ECP5 alternative adds high-speed serial I/O at the expense of Xilinx toolchain compatibility and mature industrial IP availability.
Availability
XC6SLX9-N3FT256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor hub designs requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX9-N3FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, low-power embedded applications requiring programmable logic with integrated memory and DSP resources - targeting industrial control, video processing, and communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC6SLX9-N3FT256C?
The XC6SLX9-N3FT256C has a maximum junction temperature of 100°C under industrial temperature grade (-40°C to +100°C ambient). Thermal design must ensure θJA ≤ 26.5°C/W using the FT256 package's recommended PCB layout - including 4-layer board, thermal vias under the die, and copper pour on inner layers. XC6SLX9-N3FT256C operation beyond this limit risks configuration loss and permanent latch-up.
Does XC6SLX9-N3FT256C support JTAG boundary-scan testing?
Yes, XC6SLX9-N3FT256C fully supports IEEE 1149.1 (JTAG) boundary-scan for interconnect testing and in-system programming. TDI, TDO, TMS, TCK, and TCK pins are assigned to dedicated package balls (e.g., T13, U13, T14, U14, V14). XC6SLX9-N3FT256C requires no additional configuration to enable JTAG - it is active immediately after power-up and remains functional throughout operation.
Can XC6SLX9-N3FT256C be configured using a microcontroller over SPI?
Yes, XC6SLX9-N3FT256C supports Master Serial (SPI) configuration mode. A microcontroller can drive the CCLK, MOSI (DIN), and CS_B pins to load bitstream from external SPI flash. XC6SLX9-N3FT256C requires correct INIT_B and DONE pin monitoring to confirm successful configuration; the process is defined in Xilinx UG380 and does not require Xilinx-specific hardware.
Is XC6SLX9-N3FT256C pin-compatible with other Spartan-6 devices in FT256 package?
No, XC6SLX9-N3FT256C is not pin-compatible with larger Spartan-6 devices (e.g., XC6SLX16 or XC6SLX25) in the same FT256 package. While package footprint matches, I/O bank assignments, VCCO pin locations, and configuration pin placements differ across densities. XC6SLX9-N3FT256C pinout is unique to its 9K logic cell variant and must be verified against DS160 Table 1-3.
What configuration modes does XC6SLX9-N3FT256C support?
XC6SLX9-N3FT256C supports three primary configuration modes: Master Serial (SPI flash), Slave Serial (microcontroller-driven), and JTAG (debug/programming). It also supports BPI parallel flash mode with appropriate address/data bus routing. XC6SLX9-N3FT256C does not support Master SelectMAP or network-based configuration - those require larger Spartan-6 variants with additional dedicated pins.
XC6SLX9-N3FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-N3FT256C FAQ
1.How can I place an order for XC6SLX9-N3FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-N3FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-N3FT256C reliable?
The price and inventory of XC6SLX9-N3FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-N3FT256C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-N3FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-N3FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-N3FT256C?
XC6SLX9-N3FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-N3FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-N3FT256C?
For technical support, including XC6SLX9-N3FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-N3FT256C requirements.
6.How does Aetrix verify that XC6SLX9-N3FT256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-N3FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-N3FT256C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-N3FT256C?
All XC6SLX9-N3FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-N3FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-N3FT256C part is unused and in its original packaging.
Return procedure for XC6SLX9-N3FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX9-N3FT256C Tags
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