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AMD XC6SLX9-N3FT256I
- Part No.:
- XC6SLX9-N3FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-N3FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,374
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Product details
Overview
XC6SLX9-N3FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, configured in a 256-pin FTBGA package with -3 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for embedded control, interface bridging, and real-time signal processing in space-constrained industrial controllers.
For engineers reviewing the XC6SLX9-N3FT256I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (186 user I/Os), LVCMOS/LVTTL/SSTL interface support, internal clock management via DCMs, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX9-N3FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains for arithmetic. It integrates two Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction across multiple clock domains.
It supports SelectIO™ standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18 I/II, and HSTL I/II, with programmable drive strength (2–24 mA) and slew rate control per I/O bank. Configuration is performed via SPIx4 or JTAG using external PROM or processor-controlled mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~100K ASIC gates for moderate-complexity control and datapath logic |
| Block RAM | 576 Kbits - enables on-chip buffering for FIFOs, lookup tables, or small frame buffers without external memory |
| DSP Slices | 24 × DSP48A1 - supports 18×18 signed multiplication and accumulation at up to 250 MHz for filtering or motor control |
| User I/O Pins | 186 - supports multi-protocol interface aggregation (e.g., UART + SPI + parallel bus) in compact layouts |
| DCMs | 2 × Digital Clock Manager - delivers jitter-tolerant clock synthesis and phase alignment for mixed-signal synchronization |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz internal routing and 333 MHz I/O toggle rates under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncooled industrial enclosures and transportation electronics |
Pinout & Package
XC6SLX9-N3FT256I is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-251AC footprint. The package supports automated optical inspection (AOI) and reflow-compatible assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for LVCMOS25 interfaces |
| K1 | GCLK1 | Global clock input - low-skew routing to all CLBs and DCMs; requires matched impedance trace to minimize jitter |
| T1 | M0 | Configuration mode select - sets boot source to Master SPI when pulled high during power-up |
| R2 | TCK | JTAG test clock - synchronizes boundary-scan operations; requires stable 10 MHz max clock for IEEE 1149.1 compliance |
| P3 | INIT_B | Configuration status indicator - open-drain active-low signal asserts during bitstream load failure or CRC error |
| U19 | VCCAUX | Analog auxiliary supply - powers internal PLL/DCM circuitry; requires clean 2.5 V ±3% with <10 mV ripple |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Enables zero-delay clock forwarding and dynamic phase adjustment without external PLL ICs or discrete components |
| SelectIO Technology | Allows mixed-voltage I/O operation across 8 banks - simplifies interfacing with legacy 3.3 V peripherals and modern 1.8 V sensors |
| Configurable I/O Drive | Programmable 2–24 mA output strength per pin - eliminates need for external series resistors in EMI-sensitive applications |
| ISE Design Suite Support | Full toolchain compatibility with Xilinx ISE 14.7 - ensures deterministic timing analysis and bitstream reproducibility for long-lifecycle programs |
| Industrial Temp Rating | Validated operation over full -40°C to +100°C range - avoids derating or thermal margining in fanless edge devices |
Applications
| Industrial PLC I/O Module | Automotive ADAS Sensor Hub |
|---|---|
Use Scenario: Modular digital input/output expansion for DIN-rail mounted programmable logic controllers handling 24 V DC field signals. IC Role / Device Role / Timing Role: Reconfigurable glue logic and protocol translation engine between fieldbus (PROFIBUS DP) and microcontroller subsystem. Use Value: Reduces BOM count by replacing discrete level shifters, isolators, and state machines while maintaining deterministic scan cycle timing. | Use Scenario: Central sensor aggregator in 12 V automotive domain controller, fusing camera, radar, and ultrasonic data streams. IC Role / Device Role / Timing Role: Real-time preprocessing unit performing timestamp alignment, packetization, and CRC generation before CAN FD transmission. Use Value: Enables sub-microsecond timestamp resolution and deterministic latency under ASIL-B constraints without increasing MCU interrupt load. |
| Medical Imaging Front-End | Test & Measurement Pattern Generator |
Use Scenario: Signal conditioning and serialization stage in portable ultrasound beamformer modules with analog front-end ADCs. IC Role / Device Role / Timing Role: High-speed LVDS serializer driving 10-bit parallel ADC outputs to FPGA-based digital backend at 80 MSPS. Use Value: Eliminates need for external serializer ICs and reduces PCB layer count via integrated source-synchronous clock forwarding. | Use Scenario: Programmable digital stimulus generator for validating SoC functional safety monitors and watchdog timers. IC Role / Device Role / Timing Role: Deterministic waveform synthesizer generating precise pulse trains with nanosecond-level edge placement accuracy. Use Value: Supports ISO 26262 diagnostic coverage verification by reproducing fault injection sequences with repeatable timing margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256I | Slower -2 speed grade; lower maximum clock frequency (400 MHz vs. 500 MHz) and reduced I/O toggle rate (250 MHz vs. 333 MHz) | Suitable for cost-sensitive designs where timing margin exceeds requirements and thermal budget is tighter | Select when design operates below 300 MHz system clock and does not require worst-case industrial timing closure |
| XC6SLX16-3CSG324C | Larger device (14,579 logic cells), 324-pin CSBGA package, commercial temp range (0°C to +85°C), higher I/O count (200) | Better suited for designs requiring additional logic resources or more I/Os but lacking industrial temperature qualification | Choose only if logic utilization exceeds 85% on XC6SLX9-N3FT256I and ambient operating temperature stays within commercial range |
Compared with XC6SLX9-2FTG256I, the XC6SLX9-N3FT256I delivers higher timing margin for high-speed I/O and deterministic control loops; compared with XC6SLX16-3CSG324C, it offers verified industrial temperature operation in a smaller footprint but with fewer logic resources and I/Os.
Availability
XC6SLX9-N3FT256I is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and medical device applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-N3FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and industrial reliability - especially in industrial control, vision, and communications infrastructure.
FAQ
What is the configuration method supported by XC6SLX9-N3FT256I?
The XC6SLX9-N3FT256I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Default boot uses Master SPI mode with external serial PROM; JTAG is used for programming and boundary-scan testing. All modes are fully supported in Xilinx ISE 14.7 toolchain, and configuration bitstream loading time is typically 12–18 ms depending on PROM speed and interface mode. The XC6SLX9-N3FT256I does not support PCIe or BPI configuration.
Does XC6SLX9-N3FT256I include built-in memory for firmware storage?
No, the XC6SLX9-N3FT256I contains no non-volatile memory for bitstream storage. It relies on external configuration memory such as SPI flash PROM or processor-controlled loading. On-power-up, the XC6SLX9-N3FT256I reads its configuration bitstream from the selected source; internal SRAM holds the programmed logic state but is volatile and erased on power loss.
What I/O standards are supported by XC6SLX9-N3FT256I?
The XC6SLX9-N3FT256I supports LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18 I/II, and HSTL I/II across eight independent I/O banks. Each bank is independently powered and configurable. Differential standards like LVDS and RSDS are supported only as input-only or limited output modes - true bidirectional LVDS requires external termination and is not natively driven by XC6SLX9-N3FT256I I/O pins.
Is XC6SLX9-N3FT256I pin-compatible with other Spartan-6 devices in FTBGA256 package?
No, XC6SLX9-N3FT256I is not pin-compatible with larger Spartan-6 devices (e.g., XC6SLX16 or XC6SLX25) in the same FTBGA256 package. While package footprint matches, pin functions differ significantly due to varying resource allocation and I/O bank assignments. Migration to higher-density variants requires PCB redesign and I/O constraint revalidation. XC6SLX9-N3FT256I shares pinout only with identical density/speed/temp variants (e.g., XC6SLX9-2FT256I).
What thermal management guidance applies to XC6SLX9-N3FT256I in industrial environments?
XC6SLX9-N3FT256I is rated for -40°C to +100°C junction temperature. In sealed enclosures, a minimum 2-layer PCB with 1 oz copper and thermal vias under the package is recommended. No heatsink is required below 1.2 W typical power dissipation, but airflow >0.5 m/s reduces case temperature by ~8°C. Thermal simulation using Xilinx XPE is advised for designs exceeding 85°C ambient or operating near timing limits.
XC6SLX9-N3FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-N3FT256I FAQ
1.How can I place an order for XC6SLX9-N3FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-N3FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-N3FT256I reliable?
The price and inventory of XC6SLX9-N3FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-N3FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-N3FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-N3FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-N3FT256I?
XC6SLX9-N3FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-N3FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-N3FT256I?
For technical support, including XC6SLX9-N3FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-N3FT256I requirements.
6.How does Aetrix verify that XC6SLX9-N3FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-N3FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-N3FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-N3FT256I?
All XC6SLX9-N3FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-N3FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-N3FT256I part is unused and in its original packaging.
Return procedure for XC6SLX9-N3FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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