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AMD XC6SLX9-N3FTG256C
- Part No.:
- XC6SLX9-N3FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-N3FTG256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,558
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Product details
Overview
XC6SLX9-N3FTG256C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, configured in a 256-pin FTBGA package with 176 user I/Os. It targets low-power, cost-sensitive embedded control and interface bridging applications requiring deterministic timing and multi-standard I/O support.
For engineers reviewing the XC6SLX9-N3FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), -3 speed grade timing performance, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.
Technical Context
The XC6SLX9-N3FTG256C implements a synchronous, SRAM-based programmable logic architecture with six-input LUTs and distributed RAM. It integrates dedicated clock management resources including two DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction across multiple output clocks.
Its I/O bank structure supports mixed-voltage operation with independent VCCO per bank and configurable IOSTANDARDs including LVCMOS, LVTTL, PCI, and SSTL. Configuration is performed via Master Serial (SPI) or JTAG, with bitstream encryption optional using AES-128.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| DSP Slices | 24 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 176 - supports parallel interfaces, sensor buses, and multi-protocol connectivity with bank-wise voltage assignment |
| Speed Grade | -3 - guarantees timing closure for designs operating up to 500 MHz internal clocking with worst-case process/voltage/temperature margins |
| Package | 256-pin FTBGA (17×17 mm, 1.0 mm pitch) - enables high-density PCB routing and thermal dissipation in space-constrained industrial modules |
Pinout & Package
XC6SLX9-N3FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch and 17×17 array. The package supports reflow soldering per IPC/JEDEC J-STD-020 and has a moisture sensitivity level (MSL) of 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be locally decoupled with ≤10 nF ceramic capacitors near the ball |
| A1 | VCCAUX | 2.5 V auxiliary supply for configuration and clock circuitry - requires separate regulation and filtering |
| P1 | VCCO_0 | I/O bank 0 power - sets output voltage level and drive strength for pins A1–D12 |
| R14 | PROGRAM_B | Active-low asynchronous reset - initiates configuration reload when asserted low |
| T15 | INIT_B | Open-drain status indicator - goes high-Z after successful configuration, pulled low during error or reconfiguration |
| U16 | CCLK | Configuration clock input - driven by external master or internal oscillator during SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual DCM clock management | Enables jitter-tolerant clock synthesis and phase alignment across multiple domains without external PLL ICs |
| Multi-standard I/O banks | Allows simultaneous LVCMOS33, LVCMOS25, and SSTL18 signaling on adjacent pins - eliminates level-shifter ICs in mixed-interface systems |
| Embedded Block RAM | Provides 18 Kb dual-port RAM blocks with byte-write enable - supports ping-pong buffering and real-time data streaming |
| AES-128 bitstream encryption | Protects intellectual property against reverse engineering and unauthorized cloning of configured logic |
| JTAG boundary-scan support | Enables IEEE 1149.1-compliant board-level test and in-system programming without dedicated debug headers |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion with isolated field bus communication and watchdog-controlled safety logic. IC Role / Device Role / Timing Role: FPGA fabric executes cyclic scan logic, manages RS-485/RS-232 transceivers, and gates safety-critical outputs based on internal state machines. Use Value: Deterministic sub-microsecond I/O response time and dual DCM-synchronized timer peripherals ensure compliance with IEC 61131-3 scan cycle requirements. | Use Scenario: Protocol translation between UDS (ISO 14229) over CAN FD and legacy K-Line diagnostics in service tools. IC Role / Device Role / Timing Role: Configurable logic implements CAN FD controller, K-Line UART with adjustable slew rate, and protocol parser state machine. Use Value: 176 user I/Os allow concurrent CAN FD PHY interface, K-Line driver, USB 2.0 PHY control lines, and LED/status GPIOs on single device. |
| Medical Sensor Hub | Test & Measurement Front-End |
Use Scenario: Aggregation and preprocessing of analog sensor data from ECG, SpO₂, and temperature channels before transmission to ARM host MCU. IC Role / Device Role / Timing Role: FPGA performs oversampling, digital filtering (CIC/FIR), and timestamped packet framing using block RAM and DSP slices. Use Value: On-chip 576 Kbits block RAM eliminates external FIFO, reducing BOM count and signal integrity risk in compact handheld enclosures. | Use Scenario: High-speed digital pattern generation and acquisition for automated test equipment with precise edge placement. IC Role / Device Role / Timing Role: FPGA generates synchronized multi-channel stimulus waveforms while capturing response data with sub-nanosecond timestamp resolution. Use Value: -3 speed grade ensures setup/hold timing margins for 200+ MHz DDR I/O interfaces used in pattern memory readback paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256C | Slower -2 speed grade; 15% lower maximum clock frequency and longer propagation delays | Suitable for non-real-time control loops and lower-bandwidth bridging where timing margin is relaxed | Select only if design meets timing with -2 grade and cost reduction outweighs need for future timing headroom |
| XC6SLX16-N3CSG324C | Larger device (14,579 logic cells), 324-pin CSBGA package, higher I/O count (204), increased power consumption | Required when expanding logic density beyond 9K cells or adding PCIe Gen1 endpoint, Ethernet MAC, or video processing pipelines | Choose when XC6SLX9-N3FTG256C resource utilization exceeds 85% or additional I/O banks are needed |
Compared with XC6SLX9-2FTG256C, the XC6SLX9-N3FTG256C delivers tighter timing closure for high-throughput data paths; compared with XC6SLX16-N3CSG324C, it offers lower system cost and smaller footprint where logic density and I/O count are sufficient.
Availability
XC6SLX9-N3FTG256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor hub designs requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX9-N3FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family was originally designed by Xilinx for cost-optimized, low-power embedded control and interface bridging - balancing logic density, I/O flexibility, and power efficiency in industrial and automotive subsystems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX9-N3FTG256C?
The XC6SLX9-N3FTG256C supports I/O standards from 1.2 V to 3.3 V per bank, with VCCO configurable independently for each of its eight I/O banks. Valid standards include LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, and SSTL18. Each bank's VCCO must match the selected IOSTANDARD's voltage requirement.
Does XC6SLX9-N3FTG256C support JTAG boundary-scan testing?
Yes, XC6SLX9-N3FTG256C fully supports IEEE 1149.1 JTAG boundary-scan for board-level interconnect testing and in-system programming. The TDI, TDO, TCK, TMS, and TRST_B pins are dedicated for this function and operate at VCCAUX voltage level. No external pull-ups or special configuration is required beyond standard JTAG chain termination.
Can XC6SLX9-N3FTG256C be configured via SPI flash memory?
Yes, XC6SLX9-N3FTG256C supports Master Serial (SPI) configuration mode using industry-standard quad-SPI or standard SPI flash devices. Configuration occurs automatically on power-up when MODE pins are set to 01, and the FPGA reads the bitstream from the connected flash memory starting at address 0x000000.
What is the purpose of the INIT_B pin on XC6SLX9-N3FTG256C?
The INIT_B pin on XC6SLX9-N3FTG256C is an open-drain status output that signals configuration status. It remains low during power-on reset and configuration, goes high-Z upon successful configuration completion, and pulls low again if configuration fails or is reinitiated. External circuitry can monitor INIT_B to detect configuration errors or trigger recovery sequences.
Is XC6SLX9-N3FTG256C compatible with Xilinx ISE Design Suite?
Yes, XC6SLX9-N3FTG256C is fully supported by Xilinx ISE Design Suite version 14.7 - the final official release for Spartan-6 devices. This includes synthesis, implementation, simulation, and bitstream generation. Vivado does not support Spartan-6; migration to 7-series or newer is required for Vivado compatibility.
XC6SLX9-N3FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-N3FTG256C FAQ
1.How can I place an order for XC6SLX9-N3FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-N3FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-N3FTG256C reliable?
The price and inventory of XC6SLX9-N3FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-N3FTG256C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-N3FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-N3FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-N3FTG256C?
XC6SLX9-N3FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-N3FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-N3FTG256C?
For technical support, including XC6SLX9-N3FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-N3FTG256C requirements.
6.How does Aetrix verify that XC6SLX9-N3FTG256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-N3FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-N3FTG256C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-N3FTG256C?
All XC6SLX9-N3FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-N3FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-N3FTG256C part is unused and in its original packaging.
Return procedure for XC6SLX9-N3FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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