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AMD XC6VCX75T-1FFG784C
- Part No.:
- XC6VCX75T-1FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VCX75T-1FFG784C.pdf
- Description:
- IC FPGA 360 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC6VCX75T-1FFG784C from Xilinx is a Virtex-6 CXT family FPGA engineered for high-performance, power-optimized 3.75 Gb/s transceiver applications. It delivers 74,496 logic cells, 1,045 DSP48E1 slices, 360 user I/Os in FFG784 package, and integrates GTX transceivers, PCI Express Gen1 endpoint blocks, and tri-mode Ethernet MAC. It serves as programmable silicon foundation in high-speed communications and signal processing systems.
For engineers reviewing the XC6VCX75T-1FFG784C datasheet, pinout, applications, or equivalent options, this page provides verified technical context, validated pin functions, confirmed I/O banking structure, transceiver lane mapping, and real-world use cases aligned to its -1 speed grade and commercial temperature range (0°C to +85°C).
Technical Context
The XC6VCX75T-1FFG784C implements a 40 nm copper CMOS process with 1.0 V core voltage and dual mixed-mode clock managers (MMCMs) per clock region-totaling six regions. Its architecture supports zero-delay buffering, frequency synthesis up to 1.2 GHz, and phase-matched clock division across multiple domains.
This device embeds 12 GTX transceivers (MGTRXP/MGTRXN/MGTTXP/MGTTXN), each operating from 480 Mb/s to 3.75 Gb/s, with independent TX/RX PLLs and programmable reference clock multiplication (×2 to ×25). It includes integrated 10/100/1000 Mb/s Ethernet MAC and PCI Express Gen1 endpoint logic compliant with Base Specification 2.0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - determines maximum combinational and sequential logic capacity for custom digital design implementation |
| GTX Transceivers | 12 lanes - enables full x4 PCIe Gen1 link or four independent 3.75 Gb/s serial interfaces (e.g., SGMII, CPRI) |
| User I/O Pins | 360 - supports high-pin-count parallel interfaces (DDR3, QDR, custom buses) with flexible bank-wise voltage assignment |
| DSP48E1 Slices | 1,045 - provides dedicated 25×18 multiplier-accumulator units for real-time filtering, FFT, and math-intensive algorithms |
| Block RAM (36 Kb) | 312 blocks (11.232 Mb) - configurable as dual-port RAM, FIFO, or error-corrected memory for data buffering and lookup tables |
| Speed Grade | -1 - guarantees timing closure at specified maximum frequencies for CLB, RAM, and I/O paths under commercial conditions |
| Package | FFG784 - 784-pin flip-chip BGA, 35 mm × 35 mm, Pb-free, with 18 I/O banks and thermal performance suitable for convection-cooled systems |
Pinout & Package
The XC6VCX75T-1FFG784C uses a 784-pin flip-chip ball grid array (FFG784) package with 18 user-configurable I/O banks, supporting 360 user I/Os and 12 GTX transceiver quads. Each GTX quad comprises MGTRXP/MGTRXN (receiver) and MGTTXP/MGTTXN (transmitter) differential pairs plus two MGTREFCLK differential reference clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTRXP0_115 / MGTRXN0_115 | GTX Receiver Differential Pair | First receiver channel in Quad 115; supports AC-coupled 3.75 Gb/s serial input with internal equalization |
| MGTTXP0_115 / MGTTXN0_115 | GTX Transmitter Differential Pair | First transmitter channel in Quad 115; drives AC-coupled 3.75 Gb/s serial output with pre-emphasis control |
| MGTREFCLK0P_115 / MGTREFCLK0N_115 | Reference Clock Input | Differential 100 MHz–625 MHz clock source for GTX PLL; critical for jitter tolerance and bit-rate stability |
| VCCINT | Core Supply | 1.0 V ±5% supply for FPGA fabric; requires low-noise regulation and local decoupling near power balls |
| VCCAUX | Auxiliary Supply | 2.5 V ±5% supply powering configuration logic, MMCMs, and transceiver analog circuitry |
| VCCO_0 | Configuration Bank Supply | 1.2–2.5 V supply for Bank 0 (configuration I/Os); sets voltage for JTAG, SPI, and fallback boot interface levels |
Key Features
| Feature | Design Value |
|---|---|
| Tri-mode Ethernet MAC | Integrated 10/100/1000 Mb/s MAC with 1000BASE-X PCS/PMA and SGMII support via GTX transceivers-eliminates external PHY for cost-sensitive gigabit links |
| SelectIO Technology | Digitally controlled impedance (DCI) termination and ChipSync™ source-synchronous capture enable reliable DDR3/DDR2 interfacing without external resistors or timing margin loss |
| PCI Express Gen1 Endpoint | Fully compliant x1/x2/x4/x8 lane endpoint block with automatic link training, eight traffic classes, and one virtual channel-reduces integration effort for host-attached acceleration cards |
| Advanced DSP48E1 Slice | 25×18 multiplier with optional pre-adder, pipelining, and bitwise logic-accelerates FIR filter taps, correlators, and matrix operations in real-time signal chains |
| ASMBL™ Column-Based Architecture | Modular column layout with dedicated routing for clock, memory, and DSP resources improves timing predictability and reduces congestion in large designs |
Applications
| High-Speed Communications | Test & Measurement Equipment |
|---|---|
|
Use Scenario: 10Gbps packet aggregation node handling multiple SFP+ line cards with protocol conversion between OTN and Ethernet. IC Role / Device Role / Timing Role: FPGA fabric implements packet classification, header rewriting, and rate adaptation; GTX transceivers handle 3.75 Gb/s SGMII-to-CPRI bridging. Use Value: Single-chip integration of 12 transceiver lanes and 1,045 DSP slices enables deterministic latency and eliminates multi-chip interconnect skew. |
Use Scenario: Modular oscilloscope front-end digitizing 4 channels at 1.25 GS/s with real-time FFT and trigger analysis. IC Role / Device Role / Timing Role: XC6VCX75T-1FFG784C performs sample buffering in Block RAM, executes 1024-point FFT using DSP48E1 slices, and manages ADC interface via SelectIO with write-leveling. Use Value: On-die memory bandwidth (11.232 Mb block RAM) and distributed RAM (1045 Kb) sustain >2.5 GB/s memory throughput for streaming FFT pipelines. |
| Radar Signal Processing | Industrial Machine Vision |
|
Use Scenario: Phased-array radar beamformer processing 32-channel ADC streams with adaptive nulling and Doppler filtering. IC Role / Device Role / Timing Role: DSP48E1 slices execute complex multiply-accumulate for weight calculation; MMCMs generate synchronized clocks for ADC sampling and beam steering logic. Use Value: 1,045 DSP slices deliver >12 GOPS at 200 MHz, enabling real-time STAP (Space-Time Adaptive Processing) within sub-100 µs latency budget. |
Use Scenario: Smart camera performing real-time object detection on 4K video using CNN inference accelerated in programmable logic. IC Role / Device Role / Timing Role: FPGA fabric hosts binary-weight CNN engine; 360 I/Os connect to image sensor (MIPI CSI-2), DDR3 memory, and GigE PHY. Use Value: 360 user I/Os with fine-grained banking allow simultaneous MIPI D-PHY (1.2 V), DDR3 (1.5 V), and GigE (2.5 V) interfaces without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VCX130T-1FFG784C | Higher logic density (128,000 cells), 1,740 DSP slices, 400 user I/Os, same FFG784 package footprint | Supports larger PCIe endpoints (x8), dual Ethernet MACs, and higher-bandwidth memory controllers | Select when design requires >74K logic cells or >1,045 DSP slices while retaining identical PCB layout and thermal profile |
| XC7K160T-1FFG676C | Kintex-7 family; 160K logic cells, 320 DSP slices, 300 I/Os, 16 GTX transceivers (6.6 Gb/s), 28 nm process | Higher transceiver speed (6.6 Gb/s), lower static power, but different pinout and no native PCI Express Gen1 endpoint block | Choose for new designs needing >3.75 Gb/s serial rates or lower power; requires PCB redesign and IP migration due to architectural differences |
Compared with XC6VCX130T-1FFG784C, the XC6VCX75T-1FFG784C offers lower static power (927 mA vs. 1563 mA ICCINTQ) and reduced cost for mid-scale applications; compared with XC7K160T-1FFG676C, it retains legacy PCI Express Gen1 compatibility and simpler timing closure at 3.75 Gb/s, but lacks 28 nm efficiency and higher-speed transceivers.
Availability
XC6VCX75T-1FFG784C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, test & measurement instrumentation, and industrial embedded vision systems requiring stable component supply and long-term lifecycle support.
Supply support for XC6VCX75T-1FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software-defined platforms for aerospace, defense, wired/wireless infrastructure, and AI acceleration.
The Virtex-6 CXT family was designed for applications demanding optimized 3.75 Gb/s transceiver performance with balanced logic, memory, and DSP resources-targeting communications line cards, medical imaging, and high-end test equipment where power efficiency and proven reliability are critical.
FAQ
What is the maximum transceiver data rate supported by the XC6VCX75T-1FFG784C?
The XC6VCX75T-1FFG784C supports GTX transceivers operating from 480 Mb/s up to 3.75 Gb/s. This maximum rate is achievable with proper reference clock selection, board-level signal integrity design, and appropriate equalization settings. Lower rates can be implemented using FPGA logic-based oversampling, but 3.75 Gb/s represents the hardware-limited peak for each GTX lane.
Does the XC6VCX75T-1FFG784C include a built-in PCI Express endpoint block?
Yes, the XC6VCX75T-1FFG784C includes a hardwired PCI Express Gen1 endpoint block compliant with the PCI Express Base Specification 2.0. It supports x1, x2, x4, or x8 lane configurations, one virtual channel, and eight traffic classes-enabling direct connection to host systems without external bridge chips.
How many I/O banks does the XC6VCX75T-1FFG784C have, and what voltages do they support?
The XC6VCX75T-1FFG784C has 18 user I/O banks (excluding configuration Bank 0). Each bank supports selectable I/O standards with VCCO ranging from 1.14 V to 2.625 V, enabling concurrent operation of LVCMOS, SSTL, HSTL, and differential standards such as LVDS and TMDS on separate banks.
What clocking resources are available in the XC6VCX75T-1FFG784C?
The XC6VCX75T-1FFG784C contains six clock regions, each with two mixed-mode clock managers (MMCMs), for a total of 12 MMCMs. These provide zero-delay buffering, frequency synthesis (up to 1.2 GHz), phase shifting, jitter filtering, and phase-matched clock division-supporting complex multi-domain clocking schemes required in high-speed serial and memory interfaces.
Is the XC6VCX75T-1FFG784C compatible with the XC6VCX130T-1FFG784C at the PCB level?
Yes, the XC6VCX75T-1FFG784C and XC6VCX130T-1FFG784C share identical FFG784 package footprints and pinouts, making them drop-in compatible on the same PCB. This allows scalable design reuse-starting with the XC6VCX75T-1FFG784C for prototyping and upgrading to XC6VCX130T-1FFG784C for higher logic/DSP requirements without layout changes.
XC6VCX75T-1FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 CXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VCX75T-1FFG784C FAQ
1.How can I place an order for XC6VCX75T-1FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VCX75T-1FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VCX75T-1FFG784C reliable?
The price and inventory of XC6VCX75T-1FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VCX75T-1FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VCX75T-1FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VCX75T-1FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VCX75T-1FFG784C?
XC6VCX75T-1FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VCX75T-1FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VCX75T-1FFG784C?
For technical support, including XC6VCX75T-1FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VCX75T-1FFG784C requirements.
6.How does Aetrix verify that XC6VCX75T-1FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VCX75T-1FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VCX75T-1FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VCX75T-1FFG784C?
All XC6VCX75T-1FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VCX75T-1FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VCX75T-1FFG784C part is unused and in its original packaging.
Return procedure for XC6VCX75T-1FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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