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AMD XC6VHX250T-1FFG1154C

Part No.:
XC6VHX250T-1FFG1154C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VHX250T-1FFG1154C.pdf
Description:
IC FPGA 320 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,163

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Product details

Overview

XC6VHX250T-1FFG1154C from AMD is a high-performance Virtex-6 HXT FPGA with 250K logic cells, 12.5 Gb/s transceivers, and FFG1154 flip-chip BGA package. It integrates 16 GTX transceivers, 1,824 DSP48E1 slices, and supports PCIe Gen2 x8 endpoint/root complex operation in wired infrastructure and test equipment.

For engineers reviewing the XC6VHX250T-1FFG1154C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic density, I/O voltage support (1.2 V to 3.3 V), and thermal performance in high-speed serial interface designs.

Technical Context

The XC6VHX250T-1FFG1154C implements a 40 nm HPL process architecture with dedicated clock management tiles (CMT) containing DCMs and PLLs for jitter reduction. It supports multi-gigabit serial protocols including SATA, SRIO, and CPRI via GTX transceivers with programmable pre-emphasis and receiver equalization.

Configuration occurs through SelectMAP or JTAG interfaces with dual-boot capability. The device uses configuration memory with CRC error checking and bitstream encryption support for secure deployment in field-upgradable systems.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells250,000 – determines maximum combinational/sequential logic capacity for protocol stack implementation
GTX Transceivers16 × 12.5 Gb/s – enables 10G Ethernet, CPRI, or dual 5G wireless fronthaul links
DSP Slices1,824 × DSP48E1 – supports real-time FIR filtering, FFT, and digital up/down conversion
I/O StandardsLVCMOS, LVDS, SSTL, HSTL, Differential Signaling – allows direct interfacing to DDR3, ADCs, and SERDES PHYs
PackageFFG1154, 1154-pin flip-chip BGA, 35 mm × 35 mm – provides low-inductance power delivery for high-speed signaling
Max I/O Count600 user I/Os – supports wide parallel buses and multi-lane serial expansion

Pinout & Package

XC6VHX250T-1FFG1154C is housed in a 1154-pin flip-chip BGA (FFG1154) with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Power delivery uses dedicated VCCINT/VCCAUX/VCCO banks with bank-specific voltage control.

Pin/TerminalCircuit RoleDesign Meaning
M27CCLKConfiguration clock input for master SPI and SelectMAP modes
P24DONEOpen-drain status output indicating successful bitstream loading
R23INIT_BActive-low open-drain signal indicating configuration controller readiness
T22PROGRAM_BActive-low asynchronous reset initiating full reconfiguration
A14–A19GTXREFCLK0Dedicated differential reference clock input for GTX0–GTX7 transceiver quad

Key Features

FeatureDesign Value
Integrated GTX Transceivers16 channels supporting 600 Mb/s to 12.5 Gb/s with built-in 8B/10B encoder/decoder
Advanced Clock ManagementMultiple CMTs with dual PLL/DCM per tile enabling sub-100 fs RMS jitter at 125 MHz output
System MonitorOn-die temperature and supply voltage sensing with I²C interface for thermal throttling control
Secure ConfigurationBitstream AES-256 encryption and HMAC authentication prevent unauthorized programming and cloning
Partial Reconfiguration SupportEnables dynamic module swapping without system reset for adaptive radio and radar processing

Applications

Wireless Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time baseband signal processing in LTE-A and 5G NR macrocell base stations.

IC Role / Device Role / Timing Role: FPGA fabric executes layer-1 PHY algorithms while GTX transceivers handle CPRI/OBSAI fronthaul links.

Use Value: 12.5 Gb/s transceivers and 1,824 DSP slices enable simultaneous multi-carrier MIMO processing with <10 µs latency.

Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and Fibre Channel systems.

IC Role / Device Role / Timing Role: Configurable pattern generator and analyzer core with deterministic timing alignment across 600+ I/Os.

Use Value: Programmable I/O standards and precise clock phase control allow accurate eye-diagram capture at 10.3125 Gb/s.

Avionics Data ConcentratorsMedical Imaging Back-End

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control systems.

IC Role / Device Role / Timing Role: Deterministic switch fabric with time-triggered scheduling and dual-redundant transceivers.

Use Value: Built-in CRC checking and ECC on block RAM ensure fault-tolerant packet routing under EMI stress.

Use Scenario: Real-time image reconstruction pipeline in PET/CT scanners using raw detector data streams.

IC Role / Device Role / Timing Role: High-throughput DMA engine and FFT accelerator offloading host CPU during sinogram processing.

Use Value: 250K logic cells and 16 GTX lanes support concurrent acquisition of 32-channel analog front-end data at 125 MSPS.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU3P-2FFVD1760EUltraScale architecture, 16.3 Gb/s GTY transceivers, higher logic density (356K LUTs), 16 nm processBetter suited for 25G+ Ethernet and coherent optical interfaces requiring lower power per Gb/sSelect when migrating to higher serial rates or requiring hardened PCIe Gen4/Gen5 controllers
XC7VX485T-2FFG1761IVirtex-7 architecture, 13.1 Gb/s GTX transceivers, 485K logic cells, -2 speed grade, industrial temp rangeOffers extended temperature operation and larger logic capacity for complex radar beamformingChoose for harsh-environment deployments where -40°C to +100°C operation is mandatory

Compared with XC6VHX250T-1FFG1154C, the XCVU3P-2FFVD1760E delivers higher transceiver bandwidth and lower static power but requires new PCB layout and toolchain migration, while the XC7VX485T-2FFG1761I provides greater logic resources and industrial qualification at the cost of higher thermal design power.

Availability

XC6VHX250T-1FFG1154C is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed test instrumentation, and avionics data concentrators requiring stable component supply and long-term lifecycle support.

Supply support for XC6VHX250T-1FFG1154C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.

The Virtex-6 family was engineered for high-bandwidth, low-latency programmable logic in wired communications, military/aerospace, and scientific computing applications.

FAQ

What is the maximum supported transceiver data rate for XC6VHX250T-1FFG1154C?

The XC6VHX250T-1FFG1154C supports GTX transceivers rated up to 12.5 Gb/s. This rate is validated for protocols including CPRI, SRIO Gen2, and 10GBASE-R over backplane or short-reach copper. Operation at this speed requires proper PCB stackup, controlled impedance routing, and compliance with IBIS-AMI models provided in UG371.

Does XC6VHX250T-1FFG1154C support partial reconfiguration?

Yes, XC6VHX250T-1FFG1154C supports partial reconfiguration through its ICAP interface and hierarchical design flow in Vivado Design Suite. This capability enables runtime swapping of functional modules-such as modulation/demodulation blocks-without resetting the entire device, critical for adaptive wireless and radar systems.

What configuration modes are available for XC6VHX250T-1FFG1154C?

XC6VHX250T-1FFG1154C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Dual-boot capability allows fallback to a secondary bitstream stored in external flash if primary configuration fails, enhancing field reliability in unattended systems.

Is XC6VHX250T-1FFG1154C qualified for automotive applications?

No, XC6VHX250T-1FFG1154C is not AEC-Q100 qualified and is specified for commercial (0°C to +85°C) operation only. For automotive use, AMD offers the XA series derivatives with extended temperature range and qualification testing-XC6VHX250T-1FFG1154C itself is not approved for safety-critical vehicle subsystems.

What I/O standards does XC6VHX250T-1FFG1154C support?

XC6VHX250T-1FFG1154C supports LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and differential signaling standards. Each I/O bank operates independently, allowing mixed-voltage interfaces-for example, DDR3 memory at 1.5 V alongside 2.5 V analog front-end interfaces.

XC6VHX250T-1FFG1154C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 HXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
19680
Number of Logic Elements/Cells:
251904
Total RAM Bits:
18579456
Number of I/O:
320
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VHX250T-1FFG1154C FAQ

1.How can I place an order for XC6VHX250T-1FFG1154C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VHX250T-1FFG1154C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VHX250T-1FFG1154C reliable?

The price and inventory of XC6VHX250T-1FFG1154C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX250T-1FFG1154C is usually 5 days.

3.What payment methods are accepted for XC6VHX250T-1FFG1154C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX250T-1FFG1154C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VHX250T-1FFG1154C?

XC6VHX250T-1FFG1154C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VHX250T-1FFG1154C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VHX250T-1FFG1154C?

For technical support, including XC6VHX250T-1FFG1154C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX250T-1FFG1154C requirements.

6.How does Aetrix verify that XC6VHX250T-1FFG1154C is sourced from the original manufacturer or authorized distributors?

All XC6VHX250T-1FFG1154C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX250T-1FFG1154C meets industry standards.

7.What is the process for return or replacement of XC6VHX250T-1FFG1154C?

All XC6VHX250T-1FFG1154C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX250T-1FFG1154C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VHX250T-1FFG1154C part is unused and in its original packaging.

Return procedure for XC6VHX250T-1FFG1154C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VHX250T-1FFG1154C Tags

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  • XC6VHX250T-1FFG1154C PDF
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  • XC6VHX250T-1FFG1154C Images
  • AMD
  • AMD XC6VHX250T-1FFG1154C
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