AMD XC6VHX250T-1FFG1154C
- Part No.:
- XC6VHX250T-1FFG1154C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VHX250T-1FFG1154C.pdf
- Description:
- IC FPGA 320 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VHX250T-1FFG1154C from AMD is a high-performance Virtex-6 HXT FPGA with 250K logic cells, 12.5 Gb/s transceivers, and FFG1154 flip-chip BGA package. It integrates 16 GTX transceivers, 1,824 DSP48E1 slices, and supports PCIe Gen2 x8 endpoint/root complex operation in wired infrastructure and test equipment.
For engineers reviewing the XC6VHX250T-1FFG1154C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic density, I/O voltage support (1.2 V to 3.3 V), and thermal performance in high-speed serial interface designs.
Technical Context
The XC6VHX250T-1FFG1154C implements a 40 nm HPL process architecture with dedicated clock management tiles (CMT) containing DCMs and PLLs for jitter reduction. It supports multi-gigabit serial protocols including SATA, SRIO, and CPRI via GTX transceivers with programmable pre-emphasis and receiver equalization.
Configuration occurs through SelectMAP or JTAG interfaces with dual-boot capability. The device uses configuration memory with CRC error checking and bitstream encryption support for secure deployment in field-upgradable systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 250,000 – determines maximum combinational/sequential logic capacity for protocol stack implementation |
| GTX Transceivers | 16 × 12.5 Gb/s – enables 10G Ethernet, CPRI, or dual 5G wireless fronthaul links |
| DSP Slices | 1,824 × DSP48E1 – supports real-time FIR filtering, FFT, and digital up/down conversion |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, Differential Signaling – allows direct interfacing to DDR3, ADCs, and SERDES PHYs |
| Package | FFG1154, 1154-pin flip-chip BGA, 35 mm × 35 mm – provides low-inductance power delivery for high-speed signaling |
| Max I/O Count | 600 user I/Os – supports wide parallel buses and multi-lane serial expansion |
Pinout & Package
XC6VHX250T-1FFG1154C is housed in a 1154-pin flip-chip BGA (FFG1154) with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. Power delivery uses dedicated VCCINT/VCCAUX/VCCO banks with bank-specific voltage control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M27 | CCLK | Configuration clock input for master SPI and SelectMAP modes |
| P24 | DONE | Open-drain status output indicating successful bitstream loading |
| R23 | INIT_B | Active-low open-drain signal indicating configuration controller readiness |
| T22 | PROGRAM_B | Active-low asynchronous reset initiating full reconfiguration |
| A14–A19 | GTXREFCLK0 | Dedicated differential reference clock input for GTX0–GTX7 transceiver quad |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTX Transceivers | 16 channels supporting 600 Mb/s to 12.5 Gb/s with built-in 8B/10B encoder/decoder |
| Advanced Clock Management | Multiple CMTs with dual PLL/DCM per tile enabling sub-100 fs RMS jitter at 125 MHz output |
| System Monitor | On-die temperature and supply voltage sensing with I²C interface for thermal throttling control |
| Secure Configuration | Bitstream AES-256 encryption and HMAC authentication prevent unauthorized programming and cloning |
| Partial Reconfiguration Support | Enables dynamic module swapping without system reset for adaptive radio and radar processing |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time baseband signal processing in LTE-A and 5G NR macrocell base stations. IC Role / Device Role / Timing Role: FPGA fabric executes layer-1 PHY algorithms while GTX transceivers handle CPRI/OBSAI fronthaul links. Use Value: 12.5 Gb/s transceivers and 1,824 DSP slices enable simultaneous multi-carrier MIMO processing with <10 µs latency. | Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and Fibre Channel systems. IC Role / Device Role / Timing Role: Configurable pattern generator and analyzer core with deterministic timing alignment across 600+ I/Os. Use Value: Programmable I/O standards and precise clock phase control allow accurate eye-diagram capture at 10.3125 Gb/s. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control systems. IC Role / Device Role / Timing Role: Deterministic switch fabric with time-triggered scheduling and dual-redundant transceivers. Use Value: Built-in CRC checking and ECC on block RAM ensure fault-tolerant packet routing under EMI stress. | Use Scenario: Real-time image reconstruction pipeline in PET/CT scanners using raw detector data streams. IC Role / Device Role / Timing Role: High-throughput DMA engine and FFT accelerator offloading host CPU during sinogram processing. Use Value: 250K logic cells and 16 GTX lanes support concurrent acquisition of 32-channel analog front-end data at 125 MSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 16.3 Gb/s GTY transceivers, higher logic density (356K LUTs), 16 nm process | Better suited for 25G+ Ethernet and coherent optical interfaces requiring lower power per Gb/s | Select when migrating to higher serial rates or requiring hardened PCIe Gen4/Gen5 controllers |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 13.1 Gb/s GTX transceivers, 485K logic cells, -2 speed grade, industrial temp range | Offers extended temperature operation and larger logic capacity for complex radar beamforming | Choose for harsh-environment deployments where -40°C to +100°C operation is mandatory |
Compared with XC6VHX250T-1FFG1154C, the XCVU3P-2FFVD1760E delivers higher transceiver bandwidth and lower static power but requires new PCB layout and toolchain migration, while the XC7VX485T-2FFG1761I provides greater logic resources and industrial qualification at the cost of higher thermal design power.
Availability
XC6VHX250T-1FFG1154C is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed test instrumentation, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC6VHX250T-1FFG1154C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Virtex-6 family was engineered for high-bandwidth, low-latency programmable logic in wired communications, military/aerospace, and scientific computing applications.
FAQ
What is the maximum supported transceiver data rate for XC6VHX250T-1FFG1154C?
The XC6VHX250T-1FFG1154C supports GTX transceivers rated up to 12.5 Gb/s. This rate is validated for protocols including CPRI, SRIO Gen2, and 10GBASE-R over backplane or short-reach copper. Operation at this speed requires proper PCB stackup, controlled impedance routing, and compliance with IBIS-AMI models provided in UG371.
Does XC6VHX250T-1FFG1154C support partial reconfiguration?
Yes, XC6VHX250T-1FFG1154C supports partial reconfiguration through its ICAP interface and hierarchical design flow in Vivado Design Suite. This capability enables runtime swapping of functional modules-such as modulation/demodulation blocks-without resetting the entire device, critical for adaptive wireless and radar systems.
What configuration modes are available for XC6VHX250T-1FFG1154C?
XC6VHX250T-1FFG1154C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Dual-boot capability allows fallback to a secondary bitstream stored in external flash if primary configuration fails, enhancing field reliability in unattended systems.
Is XC6VHX250T-1FFG1154C qualified for automotive applications?
No, XC6VHX250T-1FFG1154C is not AEC-Q100 qualified and is specified for commercial (0°C to +85°C) operation only. For automotive use, AMD offers the XA series derivatives with extended temperature range and qualification testing-XC6VHX250T-1FFG1154C itself is not approved for safety-critical vehicle subsystems.
What I/O standards does XC6VHX250T-1FFG1154C support?
XC6VHX250T-1FFG1154C supports LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and differential signaling standards. Each I/O bank operates independently, allowing mixed-voltage interfaces-for example, DDR3 memory at 1.5 V alongside 2.5 V analog front-end interfaces.
XC6VHX250T-1FFG1154C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 19680
- Number of Logic Elements/Cells:
- 251904
- Total RAM Bits:
- 18579456
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VHX250T-1FFG1154C FAQ
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The price and inventory of XC6VHX250T-1FFG1154C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX250T-1FFG1154C is usually 5 days.
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5.How can I obtain technical support or documentation for XC6VHX250T-1FFG1154C?
For technical support, including XC6VHX250T-1FFG1154C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX250T-1FFG1154C requirements.
6.How does Aetrix verify that XC6VHX250T-1FFG1154C is sourced from the original manufacturer or authorized distributors?
All XC6VHX250T-1FFG1154C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX250T-1FFG1154C meets industry standards.
7.What is the process for return or replacement of XC6VHX250T-1FFG1154C?
All XC6VHX250T-1FFG1154C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX250T-1FFG1154C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX250T-1FFG1154C part is unused and in its original packaging.
Return procedure for XC6VHX250T-1FFG1154C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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