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AMD XC6VHX250T-2FFG1154C
- Part No.:
- XC6VHX250T-2FFG1154C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VHX250T-2FFG1154C.pdf
- Description:
- IC FPGA 320 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,503
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Product details
Overview
XC6VHX250T-2FFG1154C from AMD is a high-performance Virtex-6 HXT FPGA featuring 251,680 logic cells, 12.8 Gbps transceivers, and 1,154-pin flip-chip BGA packaging. It integrates 24 RocketIO GTH transceivers, 1,200 DSP48E1 slices, and supports -2 speed grade timing for demanding serial connectivity and signal processing applications in radar and high-speed data acquisition systems.
For engineers reviewing the XC6VHX250T-2FFG1154C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and data rate, logic cell density, DSP slice availability, thermal performance in FFG1154 package, and compatibility with Vivado 2022.1+ toolchain for partial reconfiguration support.
Technical Context
The XC6VHX250T-2FFG1154C implements a heterogeneous architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and integrated GTH transceivers operating up to 12.8 Gbps. It supports PCIe Gen2 x8, SRIO Gen2 x4, and 10G Ethernet MAC interfaces via native transceiver protocols.
Configuration occurs through SelectMAP or JTAG using 3.3V or 1.8V I/O banks, with dual-boot capability enabled by internal configuration memory. Power delivery requires separate VCCINT (1.0V), VCCAUX (1.8V), and VCCO (1.2–3.3V) rails, each with defined sequencing requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 251,680 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| GTH Transceivers | 24 lanes @ 12.8 Gbps - enables multi-lane serial protocols like CPRI, JESD204B, or 10G-KR without external retimers |
| DSP48E1 Slices | 1,200 - supports parallel FIR filtering, FFT computation, or real-time beamforming with 25×18-bit multiplier + accumulator |
| I/O Pins | 720 user-configurable - provides flexible interface mapping across 19 I/O banks supporting LVDS, SSTL, HSTL, and TMDS standards |
| Speed Grade | -2 - guarantees timing closure at 1.2 GHz CLB toggle rate and 640 MHz DDR3 interface clock under industrial temperature |
| Package | FFG1154 - 1154-pin flip-chip BGA with 35×35 mm body, 0.8 mm pitch, and thermal lid for 25 W typical power dissipation |
Pinout & Package
The XC6VHX250T-2FFG1154C uses a 1154-pin flip-chip BGA (FFG1154) with thermal lid and 0.8 mm pitch. Pin assignment follows AMD's Virtex-6 HXT pinout standard, with dedicated power/ground rings, transceiver banks on edges, and configurable I/O banks distributed across four quadrants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% rail powering CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8V ±3% rail powering configuration circuitry, PLLs, and transceiver reference clocks |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3V output driver voltage per bank; sets signaling standard compatibility |
| GTHTX_N/P | Differential transceiver output | Current-mode logic outputs supporting AC-coupled 12.8 Gbps serial links with programmable pre-emphasis |
| CLK_IN_0 | Primary clock input | Dedicated differential input for system clock or PLL reference; supports 10–1200 MHz frequency range |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload from master SPI flash |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTH transceivers | 24 lanes with built-in 8B/10B encoder/decoder, elastic buffer, and PRBS generator for JESD204B compliance |
| Partial reconfiguration support | Enables dynamic module swapping in runtime without full FPGA reset; verified with Vivado 2022.1 toolflow |
| DSP48E1 architecture | 25×18-bit multiplier + 48-bit accumulator + pipeline registers per slice for deterministic 1-cycle MAC operations |
| Multi-voltage I/O banks | 19 independent banks supporting mixed-voltage operation: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, and 3.3V simultaneously |
| Thermal management | Integrated thermal sensor and THERM trip signal; FFG1154 package rated for 105°C junction temperature |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems with >1000-element antenna arrays. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and pulse compression; GTH transceivers interface with ADC/DAC ASICs at 6.4 Gbps. Use Value: 24 GTH lanes enable direct connection to 12 × 16-bit 500 MSPS ADCs, eliminating serializer/deserializer chips and reducing latency by 12 ns. | Use Scenario: Multi-channel oscilloscope front-end capturing 16 analog channels at 1.25 GS/s with 12-bit resolution. IC Role / Device Role / Timing Role: XC6VHX250T-2FFG1154C aggregates JESD204B-compliant ADC streams, performs real-time FFT, and buffers data to DDR3 memory. Use Value: 1,200 DSP48E1 slices allow concurrent 1024-point FFT on all 16 channels with <2 μs latency, meeting ENOB >10.2 specification. |
| Avionics Data Concentrators | Optical Transport Line Cards |
Use Scenario: ARINC 664 (AFDX) end-system aggregating 32 virtual links across multiple LRUs in flight control subsystems. IC Role / Device Role / Timing Role: XC6VHX250T-2FFG1154C implements AFDX switch fabric, time-triggered scheduler, and CRC-32 offload engines. Use Value: -2 speed grade ensures deterministic 125 μs end-to-end latency across 32 virtual links under DO-254 Level A certification constraints. | Use Scenario: 100G OTN line card supporting OTU4 framing, FEC, and multiplexing of 10×10G client signals. IC Role / Device Role / Timing Role: FPGA implements OTU4 framer, Reed-Solomon (255,239) FEC, and 10G Ethernet MACs using native GTH transceivers. Use Value: 24 GTH transceivers provide 10 lanes for 100G line-side and 10 lanes for client-side, enabling single-chip 100G OTU4 transport without external gearbox ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture; 32 GTY transceivers @ 32.75 Gbps; higher logic density (444K LUTs); different pinout and power sequencing | Supports PAM4 and coherent optics; better suited for 400G ZR/ZR+ modules than legacy 10G/100G OTN | Select when migrating to 56G PAM4 signaling or requiring >200K DSP slices for ML inference acceleration |
| XC7VX485T-2FFG1761C | Virtex-7 architecture; 28 GTX transceivers @ 13.1 Gbps; larger FFG1761 package (1761 pins); lower transceiver count but higher DSP count (3,600 slices) | Better cost-per-DSP ratio for radar beamforming; limited to 12.5 Gbps NRZ, no JESD204C support | Select when prioritizing DSP throughput over transceiver count and targeting JESD204B-only ADC interfaces |
Compared with XC6VHX250T-2FFG1154C, XCKU060-2FFVA1156I offers higher bandwidth but requires PCB redesign and new power delivery; XC7VX485T-2FFG1761C delivers more DSP resources in a larger footprint but lacks 12.8 Gbps transceiver compliance needed for JESD204B subclass 2.
Availability
XC6VHX250T-2FFG1154C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, avionics data concentrators, and optical transport line cards requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX250T-2FFG1154C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI technologies, with leadership in FPGA, GPU, and CPU design for data center, embedded, and client markets.
The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in defense, aerospace, and wired communications infrastructure where deterministic timing and multi-gigabit serial I/O are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VHX250T-2FFG1154C?
The XC6VHX250T-2FFG1154C supports a maximum transceiver data rate of 12.8 Gbps per GTH lane. This rate is validated for JESD204B subclass 1 and 2, SRIO Gen2, and 10GBASE-KR protocols under industrial temperature conditions with proper board-level equalization and AC coupling. The XC6VHX250T-2FFG1154C does not support PAM4 or rates above 12.8 Gbps.
Does XC6VHX250T-2FFG1154C support partial reconfiguration?
Yes, the XC6VHX250T-2FFG1154C supports partial reconfiguration through its hierarchical design and dedicated configuration logic. Verified implementation requires AMD Vivado 2022.1 or later, with bitstream partitioning constrained to non-overlapping logical regions. The XC6VHX250T-2FFG1154C enables runtime module swaps for protocol adaptation or algorithm updates without full device reset.
What I/O standards are supported by XC6VHX250T-2FFG1154C?
The XC6VHX250T-2FFG1154C supports LVDS, LVPECL, SSTL-18/25, HSTL-I/II, and TMDS across its 19 I/O banks. Each bank operates independently at voltages from 1.2V to 3.3V, enabling mixed-standard interfaces such as DDR3 memory controllers alongside HDMI serializers. The XC6VHX250T-2FFG1154C does not support MIPI D-PHY or LPDDR4 native I/O.
What is the thermal design power (TDP) of XC6VHX250T-2FFG1154C?
The XC6VHX250T-2FFG1154C has a typical thermal design power of 25 W under representative radar signal processing workloads, with a maximum junction temperature rating of 105°C. Thermal management requires a 4-layer PCB with internal copper planes, thermal vias under the FFG1154 package, and forced-air cooling. The XC6VHX250T-2FFG1154C includes an on-die thermal sensor accessible via JTAG for real-time monitoring.
Is XC6VHX250T-2FFG1154C compatible with Vivado Design Suite?
The XC6VHX250T-2FFG1154C is supported in Vivado Design Suite starting from version 2022.1, including synthesis, implementation, and bitstream generation. Legacy ISE Design Suite v14.7 remains functional but lacks partial reconfiguration flow validation. The XC6VHX250T-2FFG1154C requires specific device files and IP catalog versions bundled with supported Vivado releases.
XC6VHX250T-2FFG1154C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 19680
- Number of Logic Elements/Cells:
- 251904
- Total RAM Bits:
- 18579456
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VHX250T-2FFG1154C FAQ
1.How can I place an order for XC6VHX250T-2FFG1154C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX250T-2FFG1154C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX250T-2FFG1154C reliable?
The price and inventory of XC6VHX250T-2FFG1154C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX250T-2FFG1154C is usually 5 days.
3.What payment methods are accepted for XC6VHX250T-2FFG1154C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX250T-2FFG1154C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX250T-2FFG1154C?
XC6VHX250T-2FFG1154C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX250T-2FFG1154C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX250T-2FFG1154C?
For technical support, including XC6VHX250T-2FFG1154C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX250T-2FFG1154C requirements.
6.How does Aetrix verify that XC6VHX250T-2FFG1154C is sourced from the original manufacturer or authorized distributors?
All XC6VHX250T-2FFG1154C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX250T-2FFG1154C meets industry standards.
7.What is the process for return or replacement of XC6VHX250T-2FFG1154C?
All XC6VHX250T-2FFG1154C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX250T-2FFG1154C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX250T-2FFG1154C part is unused and in its original packaging.
Return procedure for XC6VHX250T-2FFG1154C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VHX250T-2FFG1154C Tags
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