AMD XC6VHX250T-2FFG1154I

Overview

XC6VHX250T-2FFG1154I from AMD is a high-performance Virtex-6 HXT FPGA with 250K logic cells, 12.8 Gb/s transceivers, and -2 speed grade, used in high-speed serial interface prototyping and reconfigurable computing systems.

For engineers reviewing the XC6VHX250T-2FFG1154I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, I/O voltage support, thermal design power, and configuration interface compatibility.

Technical Context

The XC6VHX250T-2FFG1154I integrates 250,800 logic cells, 1,248 DSP48E1 slices, and 24 GTX transceivers supporting 1.6–12.8 Gb/s line rates. It implements SelectIO technology with support for LVDS, SSTL, and HSTL standards across 528 user I/Os.

Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device operates at core voltage of 1.0V ±3% and supports junction temperatures from –40°C to +100°C.

Key Specifications

Pinout & Package

XC6VHX250T-2FFG1154I is housed in a 1154-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires soldered thermal connection to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VHX250T-2FFG1154I, the XCVU3P-2FFVD1760I delivers higher transceiver speed and logic capacity but mandates full hardware revision, while the XC7VX330T-2FFG1157I provides incremental DSP and jitter improvements within a similar form-factor constraint but with non-interchangeable packaging.

Availability

XC6VHX250T-2FFG1154I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics networking requiring stable component supply across extended product lifecycles.

Supply support for XC6VHX250T-2FFG1154I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Virtex-6 family was engineered for high-bandwidth, low-latency reconfigurable systems demanding multi-gigabit serial connectivity and deterministic real-time processing.

FAQ

What is the maximum supported transceiver data rate for XC6VHX250T-2FFG1154I?

The XC6VHX250T-2FFG1154I supports GTX transceivers with a maximum data rate of 12.8 Gb/s. This capability enables direct interface with JESD204B-compliant high-speed ADCs and DACs, as well as 10 Gigabit Ethernet PHY layers. The -2 speed grade guarantees timing closure at this rate under worst-case voltage and temperature conditions specified in AMD's Virtex-6 timing models.

Does XC6VHX250T-2FFG1154I support configuration via JTAG?

Yes, XC6VHX250T-2FFG1154I supports JTAG-based configuration using IEEE 1149.1 boundary-scan for both programming and debugging. It also supports Master SPI and Slave SelectMAP modes. JTAG access remains available post-configuration for real-time debugging, partial reconfiguration control, and SEU monitoring through the ICAP interface.

What I/O standards are supported by XC6VHX250T-2FFG1154I?

XC6VHX250T-2FFG1154I implements SelectIO technology supporting LVDS, LVPECL, SSTL-18/25, HSTL-I/III, and PCI-X standards across its 528 user I/O pins. Each I/O bank operates independently with configurable VCCO voltages from 1.2 V to 3.3 V, enabling mixed-voltage interface bridging without level shifters.

Is XC6VHX250T-2FFG1154I qualified for industrial temperature operation?

Yes, XC6VHX250T-2FFG1154I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating is validated per AMD's qualification testing and applies to the FFG1154 package variant. Thermal design must ensure proper heat dissipation via the exposed thermal pad and appropriate PCB copper pour to maintain reliability within this range.

How many DSP48E1 slices does XC6VHX250T-2FFG1154I contain?

XC6VHX250T-2FFG1154I contains 1,248 DSP48E1 slices. Each slice provides 25×18-bit signed multiplication with optional 48-bit accumulator and pipeline registers, enabling high-throughput fixed-point arithmetic for FIR filters, FFT engines, and matrix operations in hardware.