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AMD XC6VHX250T-3FFG1154C
- Part No.:
- XC6VHX250T-3FFG1154C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VHX250T-3FFG1154C.pdf
- Description:
- IC FPGA 320 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,335
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Product details
Overview
XC6VHX250T-3FFG1154C from AMD is a high-performance Virtex-6 HXT FPGA featuring 250K logic cells, 14.4 Gb/s transceivers, and integrated 36-Kb block RAM. It implements high-speed serial connectivity in radar signal processing systems with deterministic latency and multi-gigabit I/O.
For engineers reviewing the XC6VHX250T-3FFG1154C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, GTx channel count, I/O bank voltage support, and thermal performance under sustained 2.5 W/mm² power density.
Technical Context
The XC6VHX250T-3FFG1154C integrates 32 GTX transceivers operating at 2.488–14.4 Gb/s with built-in PRBS generators, 8B/10B encoders, and elastic buffers. It supports PCIe Gen2 x8, SRIO Gen2 x4, and CPRI v6.1 protocols with programmable equalization and pre-emphasis.
Its logic fabric includes 6-input LUTs with dual flip-flops per slice, distributed RAM, and DSP48E1 slices delivering 17.8 GMAC/s at 550 MHz. Configuration occurs via Master SelectMAP or JTAG with AES-256 bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 250,000 – determines maximum concurrent parallel logic functions and routing complexity |
| GTX Transceivers | 32 channels, 2.488–14.4 Gb/s – enables multi-lane serial protocols without external retimers |
| Block RAM | 14,976 Kbits – supports large FIFOs, coefficient storage, and frame buffering |
| DSP Slices | 1,120 × DSP48E1 – delivers 17.8 GMAC/s for real-time filtering and FFT acceleration |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL – allows direct interfacing to ADCs, DACs, and memory controllers |
| Configuration Security | AES-256 + HMAC authentication – prevents unauthorized bitstream cloning or modification |
Pinout & Package
XC6VHX250T-3FFG1154C uses a 1154-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, 35×35 mm body size, and thermal lid for conduction cooling in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for GTX transceivers | Must be filtered with ≤10 mΩ impedance to meet jitter spec at 14.4 Gb/s |
| MGTREFCLK | Differential reference clock input | Accepts 100–800 MHz LVDS/LVPECL; phase alignment critical for multi-channel lock |
| INIT_B | Configuration status indicator | Active-low open-drain output signals successful bitstream loading or CRC error |
| CCLK | Configuration clock input | Drives internal configuration logic; max 50 MHz during SelectMAP mode |
| PROGRAM_B | Global reset for configuration | Pulse low to clear current bitstream and restart configuration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTX transceivers | Eliminates need for external SerDes chips in 10G Ethernet and CPRI baseband units |
| Partial reconfiguration support | Enables dynamic function swapping (e.g., radar waveform change) without system reset |
| Thermal monitoring diode | Provides on-die temperature readout via XADC for fan speed control and throttling |
| Multi-boot with fallback | Stores primary and backup bitstreams; auto-loads backup after three failed CRC checks |
| AXI-Stream interface support | Direct connection to Xilinx IP cores for video pipeline and packet processing |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-speed data acquisition, FFT computation, and deterministic latency control across 64+ RF channels. Use Value: GTX transceivers directly ingest ADC samples at 1.25 GSPS per channel; DSP slices sustain 240 MFLOPS per beamformer lane. | Use Scenario: Digital backend for ultrasound machines requiring parallel channel processing and image reconstruction. IC Role / Device Role / Timing Role: Time-aligned echo data aggregation, digital beam synthesis, and DICOM-compliant video encoding. Use Value: 32 GTX lanes handle 16× ADC front-ends at 80 MSPS each; block RAM buffers full-frame RF data before GPU transfer. |
| Wireless Baseband Unit | High-Energy Physics Trigger |
Use Scenario: LTE-Advanced and 5G NR macrocell baseband processing with MIMO-8×8 and carrier aggregation. IC Role / Device Role / Timing Role: Layer 1 PHY acceleration, OFDM modulation/demodulation, and CPRI fronthaul interface. Use Value: Supports 4× CPRI v6.1 links at 10.1376 Gb/s each; DSP slices execute 128-point IFFT in 25 ns. | Use Scenario: Level-1 trigger decision engine in particle collider detectors with sub-microsecond latency budget. IC Role / Device Role / Timing Role: Real-time pattern matching on streaming hit data from silicon strip sensors. Use Value: Logic fabric processes 2.1 million hits/sec with <800 ns end-to-end latency; GTX links feed data from 128 sensor modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 32 GTY transceivers up to 32.75 Gb/s, lower static power | Better suited for 25G Ethernet and PAM4-based systems; lacks native CPRI v6.1 support | Select when migrating to higher line rates or requiring PCIe Gen4 x16 root complex capability |
| XC7VX485T-2FFG1761I | Virtex-7 generation, 36 GTH transceivers up to 13.1 Gb/s, larger logic capacity (485K LC) | Higher I/O count and memory bandwidth; requires external clock conditioning for >12 Gb/s operation | Choose for legacy migration paths where board layout reuse is prioritized over newest transceiver features |
Compared with XC6VHX250T-3FFG1154C, XCKU060-2FFVA1156I offers higher transceiver speed but demands new PCB stackup and power delivery design, while XC7VX485T-2FFG1761I retains pin-compatible packaging with FFG1761 but increases thermal envelope by 18%.
Availability
XC6VHX250T-3FFG1154C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and wireless baseband unit applications requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX250T-3FFG1154C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, aerospace, and industrial applications.
The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in defense electronics, telecom infrastructure, and scientific instrumentation where deterministic timing and protocol flexibility are critical.
FAQ
What is the maximum guaranteed transceiver line rate for XC6VHX250T-3FFG1154C?
The XC6VHX250T-3FFG1154C guarantees operation up to 14.4 Gb/s per GTX transceiver channel under industrial temperature conditions (–40°C to +100°C junction), verified per AMD DS152 specification revision 2.1. This line rate supports CPRI v6.1 and 10GBASE-R protocols without gearbox logic. The XC6VHX250T-3FFG1154C achieves this using adaptive equalization and transmitter pre-emphasis calibrated per channel.
Does XC6VHX250T-3FFG1154C support partial reconfiguration?
Yes, XC6VHX250T-3FFG1154C supports hardware-verified partial reconfiguration through the ICAP interface and dedicated frame-based bitstream loading. This capability enables runtime updates of functional blocks-such as radar waveform generators or filter coefficients-without resetting the entire device. The XC6VHX250T-3FFG1154C requires use of Vivado Design Suite 2018.3 or later for implementation.
What I/O standards are supported on XC6VHX250T-3FFG1154C banks?
XC6VHX250T-3FFG1154C supports LVDS, LVCMOS (1.2 V to 3.3 V), SSTL-15/18, HSTL-I/II, and differential signaling standards including RSDS and BLVDS. Each I/O bank operates independently with configurable VCCO and VREF. The XC6VHX250T-3FFG1154C does not support MIPI D-PHY or LPDDR5 native interfaces without external level-shifting circuitry.
How is configuration security implemented in XC6VHX250T-3FFG1154C?
XC6VHX250T-3FFG1154C implements AES-256 encryption for bitstream confidentiality and HMAC-SHA-256 authentication for integrity verification. Keys are stored in battery-backed RAM or eFUSE, and decryption occurs in dedicated on-die hardware. The XC6VHX250T-3FFG1154C requires secure programming via JTAG with authenticated access credentials enforced by the configuration controller.
What thermal management features are integrated into XC6VHX250T-3FFG1154C?
XC6VHX250T-3FFG1154C includes an on-die thermal diode monitored via the XADC subsystem, enabling real-time junction temperature measurement with ±5°C accuracy. It also supports dynamic thermal throttling through user-configurable THERMAL_SHUTDOWN pins and thermal-aware clock gating. The XC6VHX250T-3FFG1154C thermal lid facilitates conduction cooling in sealed chassis environments.
XC6VHX250T-3FFG1154C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 19680
- Number of Logic Elements/Cells:
- 251904
- Total RAM Bits:
- 18579456
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VHX250T-3FFG1154C FAQ
1.How can I place an order for XC6VHX250T-3FFG1154C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX250T-3FFG1154C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX250T-3FFG1154C reliable?
The price and inventory of XC6VHX250T-3FFG1154C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX250T-3FFG1154C is usually 5 days.
3.What payment methods are accepted for XC6VHX250T-3FFG1154C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX250T-3FFG1154C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX250T-3FFG1154C?
XC6VHX250T-3FFG1154C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX250T-3FFG1154C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX250T-3FFG1154C?
For technical support, including XC6VHX250T-3FFG1154C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX250T-3FFG1154C requirements.
6.How does Aetrix verify that XC6VHX250T-3FFG1154C is sourced from the original manufacturer or authorized distributors?
All XC6VHX250T-3FFG1154C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX250T-3FFG1154C meets industry standards.
7.What is the process for return or replacement of XC6VHX250T-3FFG1154C?
All XC6VHX250T-3FFG1154C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX250T-3FFG1154C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX250T-3FFG1154C part is unused and in its original packaging.
Return procedure for XC6VHX250T-3FFG1154C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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