AMD XC6VHX255T-2FFG1923C

Overview

XC6VHX255T-2FFG1923C from AMD is a high-performance Virtex-6 HXT FPGA featuring 255,150 logic cells, 14.4 Gb/s transceivers, and 1,200 DSP48E1 slices. It integrates PCIe Gen2 x8 endpoint capability and supports DDR3 memory interfaces up to 800 MHz. Used in high-speed serial data acquisition systems requiring deterministic latency and protocol bridging.

For engineers reviewing the XC6VHX255T-2FFG1923C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 2.5W/mm² power density, and configuration security options including AES-256 bitstream encryption.

Technical Context

The XC6VHX255T-2FFG1923C implements a 40 nm bulk CMOS architecture with integrated multi-gigabit transceivers (MGTs) supporting protocols including SATA, SRIO, and CPRI. Its clocking system includes 32 MMCMs and 16 PLLs for jitter attenuation and phase alignment across high-speed I/O banks.

Configuration occurs via Master SelectMAP or JTAG, with dual-boot support and fallback capability. The device uses configuration memory with CRC error detection and bitstream authentication using HMAC-SHA-256, meeting secure boot requirements for defense and aerospace platforms.

Key Specifications

Pinout & Package

XC6VHX255T-2FFG1923C is housed in a 1923-pin Flip-Chip BGA (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid. Package supports reflow per IPC/JEDEC J-STD-020D.2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial processing applications.

Compared with XC6VHX255T-2FFG1923C, the XCVU9P offers higher DSP density and bandwidth but increases PCB layer count and thermal complexity; the XC7K410T reduces BOM cost and power but sacrifices CPRI v6.0 compliance and transceiver lane count needed for multi-sector radar front-ends.

Availability

XC6VHX255T-2FFG1923C is available at Aetrix Electronics and suitable for radar signal processing, optical transport line cards, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC6VHX255T-2FFG1923C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications with emphasis on security, performance, and power efficiency.

The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in defense radar, telecom infrastructure, and scientific instrumentation where deterministic timing and protocol integration are critical.

FAQ

What is the maximum supported DDR3 data rate for XC6VHX255T-2FFG1923C?

The XC6VHX255T-2FFG1923C supports DDR3 interfaces up to 800 MHz (1600 MT/s) using its dedicated hard memory controller IP. This is validated across all I/O banks configured for SSTL15 standards and requires matched trace lengths within ±5 mm and controlled impedance of 40 Ω single-ended. The controller enforces JEDEC tFAW, tRRD, and tRP timing parameters without RTL intervention.

Does XC6VHX255T-2FFG1923C include built-in PCIe Gen2 endpoint functionality?

Yes, XC6VHX255T-2FFG1923C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification Revision 2.1. It supports both express mode and legacy INTx interrupt signaling, and includes AXI4-Stream interfaces for direct connection to user logic. Configuration space is accessible via dedicated BARs mapped into the device's address space.

What transceiver protocols are natively supported by XC6VHX255T-2FFG1923C?

XC6VHX255T-2FFG1923C natively supports SATA Gen2, SRIO 1.2/2.0, CPRI v6.0, and 10GBASE-KR through its 24 integrated 14.4 Gb/s transceivers. Protocol selection is configured per lane via GT wizard IP core settings. No external retimers or protocol converters are required for these standards when using recommended reference clock jitter profiles (<1.5 ps RMS).

How is configuration security implemented in XC6VHX255T-2FFG1923C?

XC6VHX255T-2FFG1923C implements dual-layer configuration security: AES-256 encryption for bitstream confidentiality and HMAC-SHA-256 authentication for integrity verification. Keys are stored in on-chip battery-backed RAM or external eFUSE, and decryption occurs in hardware during configuration load. Tamper detection triggers automatic bitstream erase if voltage or temperature thresholds are exceeded.

What thermal management guidance applies to XC6VHX255T-2FFG1923C in continuous operation?

XC6VHX255T-2FFG1923C requires a heatsink with thermal resistance ≤1.2°C/W when operating continuously at 85°C ambient. The device's thermal lid must be in direct contact with the heatsink baseplate using 60–80 psi mounting pressure and thermally conductive interface material (TIM) with ≥5 W/m·K conductivity. Junction temperature must remain below 100°C to maintain timing closure and avoid configuration loss.