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AMD XC6VHX380T-1FFG1923C
- Part No.:
- XC6VHX380T-1FFG1923C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC6VHX380T-1FFG1923C.pdf
- Description:
- IC FPGA 720 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,693
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Product details
Overview
XC6VHX380T-1FFG1923C from AMD is a high-performance Virtex-6 HXT FPGA featuring 379,200 logic cells, 24 transceivers operating up to 13.1 Gb/s, and integrated 64-bit DDR3 memory controller support. It implements complex digital signal processing and high-speed serial interface functions in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC6VHX380T-1FFG1923C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, and PCIe Gen2 endpoint compliance for embedded compute acceleration.
Technical Context
The XC6VHX380T-1FFG1923C integrates RocketIO GTH transceivers with built-in PRBS generators/checkers and adaptive equalization, supporting protocols including CPRI, SRIO 2.0, and 10GBASE-KR. Its CLB architecture includes dual 6-input LUTs with dedicated carry logic and fast arithmetic capability.
Configurable I/O banks support 1.2 V to 3.3 V signaling standards including LVDS, SSTL, HSTL, and TMDS. The device uses 40 nm HKMG process technology and supports JTAG, SelectMAP, and Master SPI configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 379,200 - provides gate count equivalent to ~2.4M ASIC gates for complex RTL implementation |
| Transceivers | 24 × GTH - supports 5–13.1 Gb/s serial links with integrated clock data recovery |
| Block RAM | 15,480 Kb - enables large on-chip FIFOs, coefficient storage, or protocol buffer memory |
| I/O Pins | 720 - configurable across 32 I/O banks with independent VCCO per bank |
| Speed Grade | -1 - guarantees timing closure at maximum specified frequencies under industrial temperature |
| DDR3 Interface | 64-bit x2 channels - native PHY support for 800–1066 MHz DDR3 operation |
| PCIe Support | Gen2 x8 endpoint - hard IP block compliant with PCI Express Base 2.0 specification |
Pinout & Package
XC6VHX380T-1FFG1923C is housed in a 1923-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid. The package supports high-power dissipation (up to 35 W typical) and high-speed signal integrity via controlled impedance routing and dedicated ground/power ball arrays.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Separate 1.0 V (core) and 1.2 V (termination) rails required for GTH transceiver stability |
| VRP / VRN | Reference voltage inputs | Provide precision termination reference for differential I/O standards like LVDS and SSTL |
| CCLK / INIT_B / DONE | Configuration control | Control signals for master SPI/JTAG configuration flow and status indication |
| HP[0:71]_I/O | High-performance I/O bank | Supports 1.8 V/2.5 V/3.3 V single-ended and differential standards with programmable slew rate |
| PCIE_X8 | Dedicated PCIe hard IP interface | 8-lane PCIe Gen2 endpoint interface with integrated TLP handling and DMA engine |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTH Transceivers | 24 lanes with 5–13.1 Gb/s operation, PRBS pattern generation, and adaptive equalization for backplane and optical module interfacing |
| Hard IP PCIe Gen2 Endpoint | Reduces RTL integration effort by providing certified link training, error reporting, and configuration space access without soft-core overhead |
| Multi-Voltage I/O Banks | 32 independently powered banks enable mixed-voltage system interfacing (e.g., 1.8 V FPGA core to 3.3 V legacy peripherals) |
| DDR3 Memory Controller | Two 64-bit channels with 800–1066 MHz support eliminate external memory controller IC and reduce latency in data acquisition systems |
| Configurable Logic Blocks (CLBs) | Dual 6-LUT + carry chain architecture delivers high arithmetic throughput for real-time filtering and FFT computation |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTH transceivers interface with ADC/DAC JESD204B converters. Use Value: Native JESD204B support and deterministic latency enable sub-microsecond processing loop timing for adaptive waveform control. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards. IC Role / Device Role / Timing Role: Protocol bridging between 10GBASE-R PHY and backplane switch fabric using PCIe Gen2 and XAUI interfaces. Use Value: Hard IP PCIe endpoint and 24 GTH lanes allow concurrent 10G Ethernet, CPRI, and system management traffic without soft-core bottlenecks. |
| Medical Imaging Data Acquisition | Avionics Data Concentrator |
Use Scenario: High-fidelity ultrasound echo digitization and beam synthesis in portable imaging systems. IC Role / Device Role / Timing Role: Synchronizes multi-channel ADC sampling, performs channel gain correction, and compresses raw RF data before transmission. Use Value: On-chip DDR3 controller and 64-bit memory interface sustain >6 GB/s sustained bandwidth for real-time image reconstruction pipelines. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Time-triggered scheduler and deterministic packet switching engine with hardware timestamping. Use Value: -1 speed grade and industrial temperature rating ensure guaranteed timing closure in extended environmental qualification testing per DO-254. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 16.3 Gb/s GTY transceivers, higher logic density (522K LUTs), no native DDR3 controller | Better suited for 25G+ Ethernet and AI inference acceleration; requires external DDR4 controller | Select when migrating to 16 nm node and requiring >13 Gb/s serial bandwidth or AI-optimized DSP slices |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 13.1 Gb/s GTX transceivers, same logic cell count (~485K), -2 speed grade, industrial temp | Higher static power, mature toolchain support, broader third-party IP availability | Select when prioritizing design reuse, long-term toolchain stability, or lower risk in safety-critical certification paths |
Compared with XC6VHX380T-1FFG1923C, the XCVU3P-2FFVD1760E offers higher transceiver speed and logic capacity but lacks integrated DDR3 support, while the XC7VX485T-2FFG1761I provides identical serial performance with stronger legacy IP ecosystem and higher static power consumption.
Availability
XC6VHX380T-1FFG1923C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX380T-1FFG1923C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, adaptive SoC, and AI acceleration technologies.
The Virtex-6 family was designed for high-performance serial connectivity and signal processing in aerospace, defense, and wired communications infrastructure where deterministic latency and multi-protocol transceiver flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VHX380T-1FFG1923C?
The XC6VHX380T-1FFG1923C supports a maximum transceiver data rate of 13.1 Gb/s per GTH lane. This is validated across all 24 transceivers under industrial temperature conditions (-40°C to +100°C) and specified for protocols including CPRI, SRIO 2.0, and 10GBASE-KR. The -1 speed grade ensures timing closure at this rate with standard PCB stackups and controlled impedance routing.
Does XC6VHX380T-1FFG1923C include a hard PCIe controller?
Yes, XC6VHX380T-1FFG1923C integrates a hard PCIe Gen2 x8 endpoint controller. It complies fully with the PCI Express Base 2.0 specification, supports link training, configuration space access, and DMA operations without consuming programmable logic resources. This hard IP reduces design risk and verification effort compared to soft-core PCIe implementations.
What memory interface standards does XC6VHX380T-1FFG1923C support natively?
XC6VHX380T-1FFG1923C provides native physical layer support for DDR3 SDRAM at data rates up to 1066 MHz across two independent 64-bit channels. It does not support DDR4 or LPDDR3 natively. The integrated memory controller includes calibration logic, write leveling, and read-leveling circuitry optimized for industrial temperature operation.
Is XC6VHX380T-1FFG1923C qualified for automotive applications?
No, XC6VHX380T-1FFG1923C is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for aerospace, defense, and telecommunications infrastructure. For automotive use, AMD recommends the XA series Virtex-6 derivatives, which undergo additional screening and qualification testing per automotive reliability standards.
What configuration modes are supported by XC6VHX380T-1FFG1923C?
XC6VHX380T-1FFG1923C supports three primary configuration modes: Master SPI (using on-chip boot PROM interface), JTAG (IEEE 1149.1 boundary scan for debug and programming), and SelectMAP (parallel slave mode via dedicated I/O pins). Configuration bitstream encryption and HMAC authentication are also supported for secure deployment.
XC6VHX380T-1FFG1923C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 29880
- Number of Logic Elements/Cells:
- 382464
- Total RAM Bits:
- 28311552
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XC6VHX380T-1FFG1923C FAQ
1.How can I place an order for XC6VHX380T-1FFG1923C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX380T-1FFG1923C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX380T-1FFG1923C reliable?
The price and inventory of XC6VHX380T-1FFG1923C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-1FFG1923C is usually 5 days.
3.What payment methods are accepted for XC6VHX380T-1FFG1923C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-1FFG1923C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX380T-1FFG1923C?
XC6VHX380T-1FFG1923C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX380T-1FFG1923C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX380T-1FFG1923C?
For technical support, including XC6VHX380T-1FFG1923C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-1FFG1923C requirements.
6.How does Aetrix verify that XC6VHX380T-1FFG1923C is sourced from the original manufacturer or authorized distributors?
All XC6VHX380T-1FFG1923C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-1FFG1923C meets industry standards.
7.What is the process for return or replacement of XC6VHX380T-1FFG1923C?
All XC6VHX380T-1FFG1923C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-1FFG1923C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX380T-1FFG1923C part is unused and in its original packaging.
Return procedure for XC6VHX380T-1FFG1923C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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