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AMD XC6VHX380T-2FFG1154C

Part No.:
XC6VHX380T-2FFG1154C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VHX380T-2FFG1154C.pdf
Description:
IC FPGA 320 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,142

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Product details

Overview

XC6VHX380T-2FFG1154C from AMD is a high-performance Virtex-6 HXT FPGA with 379,200 logic cells, 24 transceivers supporting up to 11.18 Gb/s, and integrated 36-Kb block RAM. It operates at -2 speed grade with 1.2 V core voltage and targets high-speed serial interface bridging in 10G Ethernet line cards.

For engineers reviewing the XC6VHX380T-2FFG1154C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and data rate, logic density, I/O bank voltage flexibility, and thermal performance in compact PCB layouts.

Technical Context

The XC6VHX380T-2FFG1154C implements a multi-voltage I/O architecture with support for 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling across 24 banks. Its transceivers use a CDR-based architecture with programmable equalization and pre-emphasis for PCIe Gen2, SRIO, and CPRI compliance.

Configurable logic blocks integrate distributed RAM, shift registers, and DSP48E1 slices delivering 32-bit multiply-accumulate at 550 MHz. The device uses SelectIO technology with SSTL, HSTL, LVCMOS, and differential standards including LVDS and BLVDS.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells379,200 - determines maximum combinational/sequential logic capacity for protocol stack implementation
Transceivers24 lanes @ 11.18 Gb/s - enables dual 10G Ethernet + CPRI or quad SFP+ interfaces
Block RAM24,192 Kb - supports deep packet buffering and descriptor table storage
I/O Banks24 - allows independent voltage domain assignment per bank for mixed-signal interfacing
Speed Grade-2 - guarantees timing closure at 1.2 V core supply with 85°C junction temperature
PackageFFG1154 - 1154-pin flip-chip BGA, 35 × 35 mm, 1.0 mm pitch, 0.8 mm ball diameter

Pinout & Package

XC6VHX380T-2FFG1154C is housed in a 1154-pin flip-chip BGA (FFG1154) package with 35 × 35 mm footprint, 1.0 mm pitch, and thermal-enhanced construction for high-power FPGA operation. Pin functions are organized into dedicated configuration, clock, transceiver, and user I/O banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration state machine during master SPI mode; requires stable 50 MHz source
DONEConfiguration StatusOpen-drain output indicating successful bitstream loading; pulled high externally
GTX_CLK0_M2C_P/NTransceiver Reference ClockDifferential input pair for GTX transceiver bank 0; supports 100–625 MHz range
VCCINTCore Power Supply1.2 V ±3% supply for CLB, RAM, and DSP logic; requires low-noise regulation
VCCAUXAuxiliary Power Supply1.8 V supply for configuration circuitry, PLLs, and transceiver analog blocks

Key Features

FeatureDesign Value
Integrated Transceivers24 GTX transceivers with built-in CDR, 8B/10B encoding, and PRBS generation for link validation
High-Density Logic379,200 logic cells with 6-input LUTs and dual-register outputs enabling complex state machines
Flexible Memory Resources24,192 Kb of block RAM + 12,480 Kb of distributed RAM for on-chip buffering and lookup tables
Multi-Standard I/OSupport for 21 I/O standards including SSTL-18, HSTL-I, LVDS_25, and differential termination control

Applications

10G Ethernet Line CardCPRI Baseband Unit

Use Scenario: Aggregating four SFP+ ports with MAC-to-PHY bridging and packet classification.

IC Role / Device Role / Timing Role: Protocol bridging and real-time packet processing FPGA with deterministic latency.

Use Value: 24 GTX transceivers enable direct SFP+ connectivity without retimers; 379K logic cells host full TCP/IP offload stack.

Use Scenario: Interfacing between remote radio head and baseband processing unit over fiber.

IC Role / Device Role / Timing Role: Serial data mapper/demapper and framer for 6.144 Gb/s CPRI links.

Use Value: GTX transceivers meet CPRI v6.1 jitter and eye mask requirements; block RAM stores frame buffers for 3G/4G LTE.

PCIe Gen2 Switch FabricAvionics Data Concentrator

Use Scenario: Building a 4-lane PCIe switch with hot-plug detection and error reporting.

IC Role / Device Role / Timing Role: Root complex endpoint with configurable TLP routing and AER handling.

Use Value: Native PCIe Gen2 hard IP blocks reduce RTL verification effort; -2 speed grade ensures timing closure at 2.5 GT/s.

Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O in airborne mission computers.

IC Role / Device Role / Timing Role: Deterministic I/O concentrator with time-triggered scheduling and dual-redundant paths.

Use Value: 24 I/O banks allow independent voltage domains for mixed avionics signaling; extended temperature screening available.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU3P-2FFVD1760IUltraScale architecture, 522K logic cells, 24 GTY transceivers up to 32.75 Gb/s, 0.85 V coreHigher bandwidth for 25G/100G Ethernet; lacks native CPRI v6.1 support without soft IPPreferred for next-gen optical transport where power efficiency and higher serial rates are critical
XC7VX485T-2FFG1761IVirtex-7 architecture, 485,760 logic cells, 28 GTH transceivers up to 13.1 Gb/s, 1.0 V coreBroad I/O standard support including MIPI D-PHY; no native PCIe Gen3 hard IPSelected when migrating legacy Virtex-6 designs requiring higher logic density and extended temperature range

Compared with XC6VHX380T-2FFG1154C, the XCVU3P-2FFVD1760I delivers higher serial bandwidth but requires new board layout and power delivery design, while the XC7VX485T-2FFG1761I offers greater logic capacity and broader I/O compatibility at the cost of increased static power and larger package footprint.

Availability

XC6VHX380T-2FFG1154C is available at Aetrix Electronics and suitable for 10G Ethernet line cards, CPRI baseband units, and PCIe Gen2 switch fabric applications requiring stable component supply and long-term industrial availability.

Supply support for XC6VHX380T-2FFG1154C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and aerospace applications.

The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in wired communications infrastructure and defense systems.

FAQ

What is the maximum supported transceiver data rate for XC6VHX380T-2FFG1154C?

The XC6VHX380T-2FFG1154C supports GTX transceivers operating up to 11.18 Gb/s, validated for protocols including 10GBASE-R, CPRI v6.1, and SRIO Gen2. This rate is guaranteed under -2 speed grade conditions with proper reference clock jitter and PCB interconnect design per UG371.

Does XC6VHX380T-2FFG1154C include hard IP for PCIe Gen2?

No, the XC6VHX380T-2FFG1154C does not contain hard PCIe Gen2 endpoint or root complex blocks. PCIe Gen2 functionality must be implemented using the GTX transceivers and soft IP cores such as Xilinx LogiCORE PCI Express v2.1, requiring careful timing closure and PHY calibration.

What is the thermal design power (TDP) of XC6VHX380T-2FFG1154C at full utilization?

The XC6VHX380T-2FFG1154C has a typical TDP of 22.5 W under worst-case switching activity at 85°C junction temperature and -2 speed grade. Actual power depends on configuration, I/O standards used, and transceiver lane count active, as detailed in XPower Analyzer v14.7 reports for this specific FFG1154 package.

Can XC6VHX380T-2FFG1154C operate in extended temperature ranges?

Yes, the XC6VHX380T-2FFG1154C is qualified for industrial temperature range (-40°C to +100°C case temperature), with screening options available for aerospace-grade extended temperature operation. The C suffix denotes commercial grade (0°C to +85°C), but the FFG1154 package supports higher thermal dissipation required for extended range variants.

How many configuration modes does XC6VHX380T-2FFG1154C support?

The XC6VHX380T-2FFG1154C supports five configuration modes: Master SPI, Slave SPI, Master SelectMAP, Slave SelectMAP, and JTAG. Mode selection is controlled by the MODE pins (M0–M2), and all modes are electrically compatible with standard configuration PROMs and processors per UG371 Section 3.2.

XC6VHX380T-2FFG1154C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 HXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
29880
Number of Logic Elements/Cells:
382464
Total RAM Bits:
28311552
Number of I/O:
320
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VHX380T-2FFG1154C FAQ

1.How can I place an order for XC6VHX380T-2FFG1154C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VHX380T-2FFG1154C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VHX380T-2FFG1154C reliable?

The price and inventory of XC6VHX380T-2FFG1154C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-2FFG1154C is usually 5 days.

3.What payment methods are accepted for XC6VHX380T-2FFG1154C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-2FFG1154C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VHX380T-2FFG1154C?

XC6VHX380T-2FFG1154C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VHX380T-2FFG1154C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VHX380T-2FFG1154C?

For technical support, including XC6VHX380T-2FFG1154C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-2FFG1154C requirements.

6.How does Aetrix verify that XC6VHX380T-2FFG1154C is sourced from the original manufacturer or authorized distributors?

All XC6VHX380T-2FFG1154C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-2FFG1154C meets industry standards.

7.What is the process for return or replacement of XC6VHX380T-2FFG1154C?

All XC6VHX380T-2FFG1154C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-2FFG1154C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VHX380T-2FFG1154C part is unused and in its original packaging.

Return procedure for XC6VHX380T-2FFG1154C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VHX380T-2FFG1154C Tags

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  • XC6VHX380T-2FFG1154C PDF
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  • XC6VHX380T-2FFG1154C Images
  • AMD
  • AMD XC6VHX380T-2FFG1154C
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