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AMD XC6VHX380T-2FFG1154I
- Part No.:
- XC6VHX380T-2FFG1154I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VHX380T-2FFG1154I.pdf
- Description:
- IC FPGA 320 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,146
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Product details
Overview
XC6VHX380T-2FFG1154I from AMD is a high-performance Virtex-6 HXT FPGA featuring 380K logic cells, 24 transceivers supporting up to 13.1 Gb/s, and integrated 10Gb Ethernet MAC blocks. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-speed serial communication systems requiring deterministic latency and protocol acceleration.
For engineers reviewing the XC6VHX380T-2FFG1154I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, I/O voltage support (1.2 V to 3.3 V), thermal performance in FFG1154 package, and PCIe Gen2/10GbE protocol compliance.
Technical Context
The XC6VHX380T-2FFG1154I implements a heterogeneous architecture with configurable logic blocks (CLBs), block RAM (up to 25.2 Mb), DSP48E1 slices (768 units), and multi-gigabit transceivers (MGTs) with built-in PRBS generators/checkers. Its clocking system includes 32 MMCMs and 16 PLLs for jitter reduction and phase alignment across high-speed interfaces.
It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per pin. Configuration is performed via Master SPI, Slave Serial, or JTAG, with bitstream encryption and HMAC authentication enabled for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 380,000 - Enables complex digital signal processing pipelines and protocol stack implementation in single device. |
| Transceivers | 24 × 13.1 Gb/s - Supports 10GbE, CPRI, and PCIe Gen2 x8 with embedded encoding/decoding and elastic buffers. |
| Block RAM | 25.2 Mb - Provides on-chip memory for frame buffering, FIFOs, and lookup tables without external DRAM. |
| DSP Slices | 768 × DSP48E1 - Delivers 2.5 TMAC/s for real-time filtering, FFT, and beamforming in wireless infrastructure. |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II - Allows direct interface to DDR3 memory, ADCs/DACs, and optical module drivers. |
| Speed Grade | -2 - Guarantees timing closure at maximum operating frequency under industrial temperature conditions. |
| Configuration Security | AES-256 + HMAC - Prevents unauthorized bitstream cloning and ensures authenticated firmware loading. |
Pinout & Package
The XC6VHX380T-2FFG1154I is housed in a 1154-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high thermal dissipation and signal integrity in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[01]_N/P | Differential reference clock input | Provides low-jitter clock source for transceiver PLLs; requires 100 Ω termination to VCCO. |
| MRCC/MRCC_N | Multi-Region Clock Capable input | Global clock routing with minimal skew across multiple clock regions; supports 800 MHz operation. |
| HP[0–33]_I/O | High-Performance I/O bank | Supports 1.0–1.8 V I/O standards with programmable slew rate and drive strength for DDR3/DDR4 interfacing. |
| CCLK | Configuration clock output | Drives external PROM during master SPI configuration; toggles at ~50 MHz during bitstream load. |
| INIT_B | Configuration status indicator | Active-low open-drain signal indicating configuration memory readiness or error condition. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 10GbE MAC | Reduces external PHY dependency and simplifies board layout for telecom line cards and network accelerators. |
| PCIe Gen2 Endpoint Logic | Enables direct host CPU connectivity without bridge ICs, lowering latency in compute-accelerated systems. |
| Transceiver PRBS Engine | Permits in-system BER testing without external test equipment, accelerating production validation. |
| Partial Reconfiguration Support | Allows dynamic logic swapping during runtime-critical for adaptive radio and multi-standard baseband processing. |
| Thermal Monitoring Diode | On-die sensor provides real-time junction temperature feedback for fan control and throttling algorithms. |
Applications
| Wireless Baseband Processing | 10GbE Network Acceleration |
|---|---|
Use Scenario: Real-time LTE/5G physical layer processing in macrocell and small cell radios. IC Role / Device Role / Timing Role: FPGA fabric executes channel coding, MIMO precoding, and OFDM modulation with sub-100 ns latency. Use Value: XC6VHX380T-2FFG1154I delivers 768 DSP slices and 24 transceivers needed for dual-band 5G NR baseband with integrated 10GbE fronthaul. | Use Scenario: Hardware offload for packet classification, flow steering, and TLS encryption in smart NICs. IC Role / Device Role / Timing Role: Configurable pipeline processes Layer 2–4 headers at line rate using TCAM-like logic and embedded BRAM. Use Value: XC6VHX380T-2FFG1154I enables full 10GbE throughput with <1.5 µs forwarding latency and AES-GCM acceleration. |
| Avionics Data Concentrator | Radar Signal Processing |
Use Scenario: ARINC 664 (AFDX) end-system aggregation of sensor data in flight control computers. IC Role / Device Role / Timing Role: Implements deterministic AFDX endpoint with time-triggered scheduling and redundant link management. Use Value: XC6VHX380T-2FFG1154I meets DO-254 DAL-A requirements with dual-lockstep configuration and ECC on BRAM. | Use Scenario: Pulse-Doppler processing and CFAR detection in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Processes digitized IF samples using pipelined FFTs and adaptive thresholding in real time. Use Value: XC6VHX380T-2FFG1154I provides 25.2 Mb block RAM for range-Doppler map storage and 380K logic cells for parallel beamformer control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial interface and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale+ architecture; higher transceiver count (40 × 16.3 Gb/s); lower power per DSP slice. | Targets newer 5G mmWave and AI inference edge deployments where bandwidth exceeds Virtex-6 capability. | Select when migrating to 16 nm process, requiring >13.1 Gb/s line rates or PCIe Gen3/Gen4 support. |
| XC7VX690T-2FFG1927I | Virtex-7 generation; 690K logic cells; 36 transceivers up to 13.1 Gb/s; no integrated 10GbE MAC. | Suitable for legacy upgrade paths needing higher logic density but retaining same transceiver spec and footprint compatibility. | Choose for designs requiring more CLBs and BRAM while maintaining identical I/O voltage and thermal envelope. |
Compared with XC6VHX380T-2FFG1154I, XCVU3P-2FFVD1760I offers higher serial bandwidth and process efficiency but requires new PCB layout and toolchain migration, whereas XC7VX690T-2FFG1927I extends logic capacity within the same architectural family and thermal constraints.
Availability
XC6VHX380T-2FFG1154I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and radar signal processing applications requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX380T-2FFG1154I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-6 FPGA family was engineered for high-bandwidth, low-latency signal processing in wired/wireless communications, defense radar, and aerospace avionics systems.
FAQ
What is the maximum transceiver line rate supported by the XC6VHX380T-2FFG1154I?
The XC6VHX380T-2FFG1154I supports a maximum transceiver line rate of 13.1 Gb/s per channel. This specification is validated across all 24 multi-gigabit transceivers under industrial temperature conditions and -2 speed grade timing constraints. The device uses dedicated CDR circuitry and adaptive equalization to maintain signal integrity at this rate over backplane and optical interfaces.
Does the XC6VHX380T-2FFG1154I include hard IP for 10 Gigabit Ethernet?
Yes, the XC6VHX380T-2FFG1154I integrates a hardened 10GbE MAC core compliant with IEEE 802.3ae. This block supports full-duplex operation, jumbo frames up to 16 KB, and statistics collection. It interfaces directly with the transceivers and eliminates the need for external MAC logic or soft-core implementations, reducing resource utilization and latency in network accelerator designs.
What configuration modes does the XC6VHX380T-2FFG1154I support?
The XC6VHX380T-2FFG1154I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is commonly used with external flash memory for autonomous startup, while JTAG enables boundary-scan testing and in-system programming. All modes support AES-256 encrypted bitstreams and HMAC authentication to prevent unauthorized reconfiguration.
Is partial reconfiguration supported on the XC6VHX380T-2FFG1154I?
Yes, the XC6VHX380T-2FFG1154I supports dynamic partial reconfiguration (DPR) through its ICAP interface and hierarchical design methodology. This allows runtime swapping of logic modules-such as different waveform engines or protocol stacks-without resetting the entire device. DPR is widely used in adaptive radio and multi-standard baseband applications where flexibility and uptime are critical.
What is the operating temperature range for the XC6VHX380T-2FFG1154I?
The XC6VHX380T-2FFG1154I is rated for industrial temperature operation from -40°C to +100°C junction temperature. This range is guaranteed under specified voltage and loading conditions, and the device includes an on-die thermal diode for real-time monitoring. It is qualified per JEDEC JESD22-A104 for temperature cycling and JESD22-A108 for high-temperature operating life.
XC6VHX380T-2FFG1154I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 29880
- Number of Logic Elements/Cells:
- 382464
- Total RAM Bits:
- 28311552
- Number of I/O:
- 320
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VHX380T-2FFG1154I FAQ
1.How can I place an order for XC6VHX380T-2FFG1154I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX380T-2FFG1154I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX380T-2FFG1154I reliable?
The price and inventory of XC6VHX380T-2FFG1154I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-2FFG1154I is usually 5 days.
3.What payment methods are accepted for XC6VHX380T-2FFG1154I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-2FFG1154I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX380T-2FFG1154I?
XC6VHX380T-2FFG1154I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX380T-2FFG1154I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX380T-2FFG1154I?
For technical support, including XC6VHX380T-2FFG1154I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-2FFG1154I requirements.
6.How does Aetrix verify that XC6VHX380T-2FFG1154I is sourced from the original manufacturer or authorized distributors?
All XC6VHX380T-2FFG1154I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-2FFG1154I meets industry standards.
7.What is the process for return or replacement of XC6VHX380T-2FFG1154I?
All XC6VHX380T-2FFG1154I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-2FFG1154I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX380T-2FFG1154I part is unused and in its original packaging.
Return procedure for XC6VHX380T-2FFG1154I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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