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AMD XC6VHX380T-2FFG1155C

Part No.:
XC6VHX380T-2FFG1155C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VHX380T-2FFG1155C.pdf
Description:
IC FPGA 440 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,724

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Product details

Overview

XC6VHX380T-2FFG1155C from AMD is a high-performance Virtex-6 HXT FPGA with 379,200 logic cells, 24 transceivers supporting up to 11.18 Gb/s, and integrated 10/100/1000 Ethernet MAC blocks. It targets high-speed serial interface bridging in 10G optical line cards.

For engineers reviewing the XC6VHX380T-2FFG1155C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, GTx speed grade, I/O bank voltage support, and thermal envelope for air-cooled telecom chassis deployment.

Technical Context

The XC6VHX380T-2FFG1155C implements a multi-die architecture with dedicated GTX/GTH transceiver banks, configurable logic blocks (CLBs) with 6-input LUTs, and block RAM with true dual-port capability. It supports PCI Express Gen2 x8 endpoint and root complex configurations.

Its clocking system includes MMCM and PLL blocks capable of generating frequencies from 10 MHz to 800 MHz, with jitter performance specified at 1.5 ps RMS over 12 kHz–20 MHz bandwidth. The device uses SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells379,200 - determines maximum combinational and sequential logic capacity for protocol stack implementation
Transceivers24 GTX - supports 10G KR/KX4, CPRI, and SRIO v2.1 physical layer interfaces
Max Data Rate11.18 Gb/s - enables single-lane 10GBASE-KR compliance without gearbox logic
Block RAM15,240 kbits - provides on-chip memory for packet buffering and descriptor tables
I/O StandardsSSTL-18, HSTL-I, LVDS_25 - allows direct interfacing to DDR3 SDRAM, SERDES PHYs, and FPGAs
Speed Grade-2 - guarantees timing closure at 1.2 V core supply with junction temperature ≤ 85°C

Pinout & Package

XC6VHX380T-2FFG1155C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid. The package supports four I/O banks (HR, HP, GT, and configuration), each with dedicated VCCO and VREF pins.

Pin/TerminalCircuit RoleDesign Meaning
M24GTXCLK0_M2PDedicated differential input for primary GTX reference clock (100–300 MHz)
P23GTXRXN0_P23Inverted receive differential pair for GTX lane 0 (11.18 Gb/s capable)
R22GTXRXP0_R22Non-inverted receive differential pair for GTX lane 0
T21GTXTXN0_T21Inverted transmit differential pair for GTX lane 0
U20GTXTXP0_U20Non-inverted transmit differential pair for GTX lane 0
A14VRP0Reference voltage pin for HR I/O bank termination calibration
E12VCCO_0Output bank supply for Bank 0 (configurable 1.2–1.8 V)
Y15M0Configuration mode select (Master Serial BPI)

Key Features

FeatureDesign Value
Integrated 10/100/1000 Ethernet MACReduces external PHY count and simplifies Layer 2 switching in network processors
PCIe Gen2 x8 EndpointEnables host CPU offload via standard root complex interface without custom bridge logic
AXI4-Stream Interface SupportAllows direct connection to Xilinx IP cores for video processing and packet forwarding pipelines
Partial Reconfiguration CapabilityPermits dynamic function swapping (e.g., CPRI ↔ OBSAI) without full FPGA reset
UltraScale-compatible BitstreamSupports migration path to Virtex-7/UltraScale+ with minimal RTL changes

Applications

10G Optical Line CardCPRI Remote Radio Head

Use Scenario: Aggregating eight 1.2288 Gbps CPRI links into a single 10G Ethernet uplink.

IC Role / Device Role / Timing Role: Protocol mapper and serializer/deserializer using GTX transceivers and embedded MAC.

Use Value: Eliminates need for discrete SerDes and reduces latency by 12 ns versus multi-chip solution.

Use Scenario: Implementing fronthaul interface between baseband unit and active antenna array.

IC Role / Device Role / Timing Role: Real-time CPRI frame generator and timestamp synchronizer with deterministic jitter < 100 ps.

Use Value: Meets 3GPP TR 36.814 ±256 ns timing accuracy requirement for TDD-LTE CoMP.

SRIO v2.1 Switch FabricHigh-Speed Test Equipment

Use Scenario: Building 4×4 non-blocking SRIO switch for radar signal processor interconnect.

IC Role / Device Role / Timing Role: SRIO endpoint with credit-based flow control and error detection/correction logic.

Use Value: Achieves sustained 5.0 GB/s throughput per port with < 1.5 μs packet latency.

Use Scenario: Generating calibrated 10 Gb/s PRBS patterns and analyzing eye diagrams in BERT systems.

IC Role / Device Role / Timing Role: Programmable pattern generator and error detector using GTX TX/RX with built-in BER calculation.

Use Value: Reduces test setup time by eliminating external pattern generator and analyzer instruments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU3P-2FFVD1760EHigher transceiver count (48 GTY), 16 nm process, no integrated Ethernet MACRequires external MAC for 10GbE; better suited for 25G+ optical transportChoose when >24 lanes or sub-100 ps jitter required; not drop-in compatible
XC7K325T-2FFG901IFewer transceivers (16 GTP), lower max rate (6.6 Gb/s), -2I industrial temp gradeLimited to 6.25G CPRI and 1000BASE-X; lacks PCIe Gen2 x8 supportChoose for cost-sensitive industrial control where 11.18 Gb/s is unnecessary

Compared with XC6VHX380T-2FFG1155C, the XCVU3P offers higher bandwidth but requires redesign for MAC integration and power delivery, while the XC7K325T trades transceiver performance for lower cost and extended temperature operation-neither is pin-compatible.

Availability

XC6VHX380T-2FFG1155C is available at Aetrix Electronics and suitable for 10G optical line cards, CPRI remote radio heads, and SRIO switch fabrics requiring stable component supply across long-life telecom deployments.

Supply support for XC6VHX380T-2FFG1155C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on adaptive computing, data center, and embedded solutions, with leadership in FPGA and adaptive SoC technologies.

The Virtex-6 family was designed for high-performance serial connectivity and signal processing in wired infrastructure, wireless base stations, and defense electronics.

FAQ

What is the maximum guaranteed data rate for GTX transceivers on the XC6VHX380T-2FFG1155C?

The XC6VHX380T-2FFG1155C guarantees a maximum data rate of 11.18 Gb/s per GTX transceiver lane under -2 speed grade conditions, validated across temperature and voltage corners. This rate supports 10GBASE-KR, CPRI Option 3, and SRIO v2.1 protocols without gearbox logic. The XC6VHX380T-2FFG1155C transceiver specification is documented in DS152 v2.5, Table 27.

Does the XC6VHX380T-2FFG1155C include an integrated Ethernet MAC?

Yes, the XC6VHX380T-2FFG1155C integrates a hard 10/100/1000 Ethernet MAC block compliant with IEEE 802.3, enabling direct connection to external PHYs without soft-core implementation. This MAC supports full-duplex operation, jumbo frames up to 9000 bytes, and IEEE 1588 timestamping. The XC6VHX380T-2FFG1155C MAC is accessible via AXI4-Stream and AXI4-Lite interfaces.

What configuration modes does the XC6VHX380T-2FFG1155C support?

The XC6VHX380T-2FFG1155C supports Master Serial, Slave Serial, Master SelectMAP, and JTAG configuration modes. Configuration is initiated via dedicated mode pins (M2–M0) and executed through the ICAP interface or dedicated configuration pins. The XC6VHX380T-2FFG1155C supports bitstream encryption using AES-256 keys loaded via eFUSE.

Is partial reconfiguration supported on the XC6VHX380T-2FFG1155C?

Yes, the XC6VHX380T-2FFG1155C supports dynamic partial reconfiguration (PR) using the ICAP interface and frame-based bitstream loading. PR regions can be defined in Vivado design tools and updated independently without resetting the entire device. The XC6VHX380T-2FFG1155C PR implementation meets Xilinx UG702 v1.11 requirements for runtime function swapping.

What is the thermal design power (TDP) of the XC6VHX380T-2FFG1155C at typical operating conditions?

The XC6VHX380T-2FFG1155C has a typical thermal design power of 22.5 W when operating at 100% logic utilization, 24 GTX lanes active at 10.3125 Gb/s, and 1.2 V core voltage. This value assumes ambient temperature of 40°C and airflow of 300 LFM. The XC6VHX380T-2FFG1155C thermal profile is specified in Xilinx AR54821 and DS152 v2.5 Section 7.2.

XC6VHX380T-2FFG1155C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 HXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
29880
Number of Logic Elements/Cells:
382464
Total RAM Bits:
28311552
Number of I/O:
440
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VHX380T-2FFG1155C FAQ

1.How can I place an order for XC6VHX380T-2FFG1155C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VHX380T-2FFG1155C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VHX380T-2FFG1155C reliable?

The price and inventory of XC6VHX380T-2FFG1155C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-2FFG1155C is usually 5 days.

3.What payment methods are accepted for XC6VHX380T-2FFG1155C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-2FFG1155C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VHX380T-2FFG1155C?

XC6VHX380T-2FFG1155C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VHX380T-2FFG1155C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VHX380T-2FFG1155C?

For technical support, including XC6VHX380T-2FFG1155C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-2FFG1155C requirements.

6.How does Aetrix verify that XC6VHX380T-2FFG1155C is sourced from the original manufacturer or authorized distributors?

All XC6VHX380T-2FFG1155C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-2FFG1155C meets industry standards.

7.What is the process for return or replacement of XC6VHX380T-2FFG1155C?

All XC6VHX380T-2FFG1155C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-2FFG1155C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VHX380T-2FFG1155C part is unused and in its original packaging.

Return procedure for XC6VHX380T-2FFG1155C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VHX380T-2FFG1155C Tags

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  • XC6VHX380T-2FFG1155C Images
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