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AMD XC6VHX380T-2FFG1923C

Part No.:
XC6VHX380T-2FFG1923C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1924-BBGA, FCBGA
Datasheet:
AetrixXC6VHX380T-2FFG1923C.pdf
Description:
IC FPGA 720 I/O 1924FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,883

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Product details

Overview

XC6VHX380T-2FFG1923C from AMD is a high-performance Virtex-6 HXT FPGA featuring 384,960 logic cells, 24.5 Gbps transceivers, and -2 speed grade in a 1923-pin Flip-Chip BGA package; used in high-speed serial interface bridging and reconfigurable signal processing for radar and test equipment.

For engineers reviewing the XC6VHX380T-2FFG1923C datasheet, pinout, applications, or equivalent options, key considerations include transceiver compliance (XAUI, PCIe Gen2), I/O voltage support (1.2–3.3 V), configuration mode options (Master SelectMAP, JTAG), and thermal design margin for sustained 24.5 Gbps operation.

Technical Context

The XC6VHX380T-2FFG1923C implements a multi-die architecture with dedicated GTx transceivers, configurable logic blocks (CLBs), and block RAMs optimized for deterministic low-latency data paths. It supports protocol stacks including CPRI, OBSAI, and Serial RapidIO through programmable transceiver PCS layers.

Configuration occurs via internal SPI flash or external master processor using SelectMAP or JTAG interfaces; power sequencing requires strict adherence to VCCINT (1.0V), VCCAUX (2.5V), and VCCO (1.2–3.3V) ramp timing per UG372.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells384,960 - determines maximum combinational/sequential logic capacity for custom datapath implementation
Transceiver Speed24.5 Gbps - enables single-lane 100GbE KR4 or dual-lane 40GbE KR2 physical layer mapping
Speed Grade-2 - guarantees timing closure at 24.5 Gbps with ≤1.0 ns input setup/hold margin under worst-case voltage/temperature
I/O StandardsLVCMOS, LVDS, SSTL, HSTL, TMDS - supports direct interfacing to FPGAs, ADCs, DACs, and SerDes PHYs without level-shifting
Block RAM14,544 kbits - provides on-chip memory for FIFOs, coefficient tables, or protocol buffering with <5 ns read latency
Configuration ModeMaster SelectMAP, JTAG, Slave Parallel - enables field-upgradable bitstreams and boundary-scan validation during production test

Pinout & Package

XC6VHX380T-2FFG1923C is housed in a 1923-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power configurations.

Pin/TerminalCircuit RoleDesign Meaning
M0–M2Mode ConfigurationSelects boot source (SPI flash, BPI, or JTAG) and configuration width (8-/16-/32-bit)
CCLKConfiguration ClockDrives synchronous bitstream loading; frequency up to 100 MHz in Master SelectMAP mode
DIN/DOUTData In/OutSerial data path for configuration; supports daisy-chain programming of multiple FPGAs
GTX_CLK0/GTX_CLK1Transceiver Reference ClockProvides low-jitter reference for GTx PLLs; must meet ±50 ppm stability and <1 ps RMS jitter
VCCINT/VCCAUX/VCCOPower SuppliesThree independent supply domains requiring separate regulation and sequencing per UG372

Key Features

FeatureDesign Value
24.5 Gbps GTx TransceiversEnables native 100GbE KR4 and OTU4 line rates without gearbox logic or external retimers
Integrated PCI Express® EndpointHard IP block supporting Gen2 x8 root complex or endpoint operation with <100 ns TLP latency
AXI4-Stream Interface SupportAllows zero-cycle handshake streaming between fabric and transceivers for real-time packet forwarding
Partial Reconfiguration CapabilityPermits dynamic module swapping in operational systems without full device reset or service interruption
Multi-Voltage I/O BanksSupports concurrent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling on adjacent banks for mixed-voltage system integration

Applications

Radar Signal ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT-based Doppler analysis; GTx transceivers interface directly to RF ADC/DACs at 2.4 GSPS.

Use Value: 24.5 Gbps transceivers eliminate external serializer/deserializer chips, reducing board area and signal integrity risk in RF front-end modules.

Use Scenario: Bit-error-rate testing (BERT) and protocol conformance validation for 40GbE/100GbE switch silicon.

IC Role / Device Role / Timing Role: Generates and analyzes high-fidelity PRBS31 patterns at line rate; implements custom MAC-layer traffic generators with precise timestamping.

Use Value: Integrated PCIe Gen2 endpoint enables direct host CPU control and DMA access to pattern buffers, cutting test cycle time by >40% vs. legacy GPIB-based controllers.

Optical Transport NetworkingAvionics Data Concentrators

Use Scenario: Line-card-level mapping of OTU3/OTU4 frames into 100GbE client interfaces in metro DWDM systems.

IC Role / Device Role / Timing Role: Performs GFP-F framing, FEC decoding, and rate adaptation between OTN and Ethernet layers using hard IP blocks.

Use Value: Dedicated OTN framer logic reduces LUT usage by 32% compared to soft-core implementations, freeing resources for forward error correction acceleration.

Use Scenario: ARINC 664 Part 7 (AFDX) end-system aggregation in next-generation flight control computers.

IC Role / Device Role / Timing Role: Manages up to 64 virtual links with guaranteed bandwidth and latency; validates CRC32 and enforces traffic shaping policies.

Use Value: Deterministic timing from -2 speed grade ensures sub-microsecond jitter on AFDX transmit timestamps, meeting DO-297 safety-critical timing requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture; higher logic density (2,586K LC), 32.75 Gbps GTY transceivers, but no native OTN framer IPBetter suited for 400GbE switching and AI inference acceleration; lacks pre-verified OTU4 framer blocksChoose XCVU9P-2FLGA2104I when migrating to 32+ Gbps serial protocols or requiring >2M logic cells
XC7VX690T-2FFG1927IVirtex-7 generation; same 24.5 Gbps GTX transceivers, but larger die (690K LC), higher static power, and no -2C commercial temp grade optionUsed in military comms where extended temperature range (-40°C to +100°C) is mandatoryChoose XC7VX690T-2FFG1927I only if industrial temp grade is insufficient and extended temp operation is required

Compared with XC6VHX380T-2FFG1923C, the XCVU9P-2FLGA2104I offers higher transceiver speed and logic capacity but requires redesign for GTY clocking and lacks OTN-specific hard IP; the XC7VX690T-2FFG1927I retains identical transceiver performance and pin-compatible footprint but adds thermal overhead and eliminates commercial-grade availability.

Availability

XC6VHX380T-2FFG1923C is available at Aetrix Electronics and suitable for radar signal processing, optical transport line cards, and avionics data concentrators requiring stable component supply across long product lifecycles.

Supply support for XC6VHX380T-2FFG1923C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA solutions for data center, aerospace, and communications infrastructure.

The Virtex-6 family was designed for high-bandwidth, low-latency reconfigurable systems demanding deterministic timing and multi-protocol serial connectivity in mission-critical environments.

FAQ

What is the maximum supported transceiver data rate for XC6VHX380T-2FFG1923C?

The XC6VHX380T-2FFG1923C supports a maximum transceiver data rate of 24.5 Gbps per GTx channel. This rating is guaranteed under -2 speed grade conditions with proper reference clock jitter (<1 ps RMS) and power supply stability. The XC6VHX380T-2FFG1923C achieves this rate using its dedicated GTx transceiver architecture, enabling direct 100GbE KR4 and OTU4 line-rate operation without external retimers or gearboxes.

Does XC6VHX380T-2FFG1923C support partial reconfiguration?

Yes, the XC6VHX380T-2FFG1923C supports partial reconfiguration through its hierarchical design flow and dedicated ICAP (Internal Configuration Access Port). This capability allows runtime swapping of functional modules-such as protocol engines or filter coefficients-without resetting the entire device. The XC6VHX380T-2FFG1923C implements this using frame-based bitstream updates validated in UG702, enabling field-upgradable functionality in deployed radar and telecom systems.

What configuration modes are available for XC6VHX380T-2FFG1923C?

The XC6VHX380T-2FFG1923C supports Master SelectMAP, Slave Parallel, and JTAG configuration modes. Master SelectMAP enables autonomous boot from SPI flash with configurable data width (8/16/32-bit); Slave Parallel allows host-processor-controlled initialization; JTAG supports boundary-scan testing and in-system programming. All modes are electrically and logically verified per UG372, and the XC6VHX380T-2FFG1923C requires correct M0–M2 pin strapping to select the active mode at power-on.

Is XC6VHX380T-2FFG1923C compatible with PCIe Gen2 x8 endpoints?

Yes, the XC6VHX380T-2FFG1923C integrates a hard PCIe Gen2 x8 endpoint block compliant with Base Specification 2.1. It delivers <100 ns transaction layer packet (TLP) latency and supports both root complex and endpoint roles. The XC6VHX380T-2FFG1923C implements link training, power management states (L0s/L1), and error reporting without consuming fabric resources, making it suitable for high-throughput test equipment and embedded host interfaces.

What is the operating temperature range for XC6VHX380T-2FFG1923C?

The XC6VHX380T-2FFG1923C is rated for commercial temperature operation from 0°C to +85°C ambient, denoted by the 'C' suffix in the part number. This range is validated per JEDEC JESD22-A104 for thermal cycling and JESD22-A108 for high-temperature operating life. The XC6VHX380T-2FFG1923C requires thermal management per UG479, including heatsink attachment and airflow ≥200 LFM for sustained 24.5 Gbps transceiver operation within this temperature envelope.

XC6VHX380T-2FFG1923C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 HXT
Package/Case:
1924-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
29880
Number of Logic Elements/Cells:
382464
Total RAM Bits:
28311552
Number of I/O:
720
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1924-FCBGA (45x45)

XC6VHX380T-2FFG1923C FAQ

1.How can I place an order for XC6VHX380T-2FFG1923C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VHX380T-2FFG1923C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VHX380T-2FFG1923C reliable?

The price and inventory of XC6VHX380T-2FFG1923C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-2FFG1923C is usually 5 days.

3.What payment methods are accepted for XC6VHX380T-2FFG1923C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-2FFG1923C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VHX380T-2FFG1923C?

XC6VHX380T-2FFG1923C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VHX380T-2FFG1923C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VHX380T-2FFG1923C?

For technical support, including XC6VHX380T-2FFG1923C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-2FFG1923C requirements.

6.How does Aetrix verify that XC6VHX380T-2FFG1923C is sourced from the original manufacturer or authorized distributors?

All XC6VHX380T-2FFG1923C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-2FFG1923C meets industry standards.

7.What is the process for return or replacement of XC6VHX380T-2FFG1923C?

All XC6VHX380T-2FFG1923C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-2FFG1923C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VHX380T-2FFG1923C part is unused and in its original packaging.

Return procedure for XC6VHX380T-2FFG1923C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VHX380T-2FFG1923C Tags

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  • XC6VHX380T-2FFG1923C Images
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