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AMD XC6VHX380T-2FFG1923I
- Part No.:
- XC6VHX380T-2FFG1923I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC6VHX380T-2FFG1923I.pdf
- Description:
- IC FPGA 720 I/O 1924FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,564
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Product details
Overview
XC6VHX380T-2FFG1923I from AMD is a high-performance 28 nm Virtex-6 HXT FPGA with 379,200 logic cells, 24.5 Gb/s transceivers, and -2 speed grade, designed for high-speed serial interface applications including 10G Ethernet and CPRI in wireless infrastructure.
For engineers reviewing the XC6VHX380T-2FFG1923I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.2 V to 3.3 V), thermal performance under sustained 24.5 Gb/s operation, and configuration interface compatibility with SPIx4 or SelectMAP.
Technical Context
The XC6VHX380T-2FFG1923I integrates 32 RocketIO GTH transceivers supporting protocols including PCIe Gen2, SATA, and SRIO, each configurable from 600 Mb/s to 24.5 Gb/s. It features integrated DSP48E1 slices (1,920 units) and Block RAM (25,120 kbits), enabling real-time signal processing in radar and software-defined radio.
Configuration occurs via Master SPI or Slave SelectMAP mode using dedicated CCLK and D[0:7] pins; bitstream authentication and AES decryption are supported for secure boot. The device operates within -40°C to +100°C junction temperature range and requires multi-rail power delivery (VCCINT = 1.0 V, VCCAUX = 1.8 V, VCCO = 1.2–3.3 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 379,200 - determines maximum combinational/sequential logic capacity for protocol stack implementation |
| Transceiver Count | 32 GTH - enables concurrent 10G Ethernet + CPRI + JESD204B links without external bridging |
| Max Transceiver Rate | 24.5 Gb/s - supports single-lane 25G Ethernet KR/KR4 and 5G NR fronthaul |
| DSP Slices | 1,920 DSP48E1 - delivers 248 GMAC/s for real-time beamforming or channel equalization |
| Block RAM | 25,120 kbits - provides on-chip buffering for packet reordering or FFT window storage |
| Speed Grade | -2 - guarantees timing closure at 24.5 Gb/s with ≤ 10 ps jitter (RMS) over full temperature range |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL - allows direct interfacing to ADCs, DACs, and memory controllers |
Pinout & Package
XC6VHX380T-2FFG1923I is housed in a 1923-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine; must be stable before INIT_B deassertion |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating bitstream loading readiness or CRC error |
| D0–D7 | SelectMAP Data Bus | 8-bit parallel interface for fast configuration via microcontroller or host processor |
| TXP/TXN, RXP/RXN | Differential Transceiver Lanes | 32 pairs supporting AC-coupled 24.5 Gb/s signaling with programmable pre-emphasis and receiver equalization |
| VCCINT | Core Power Supply | 1.0 V ±3% supply for logic fabric and CLBs; requires low-noise regulation and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| 24.5 Gb/s GTH Transceivers | Enables single-chip 25G Ethernet KR and JESD204B subclass 1 compliance without retimers |
| AES-256 Bitstream Encryption | Prevents IP theft by enforcing authenticated, decrypted configuration from external flash |
| Integrated PCIe Gen2 Endpoint | Reduces host interface latency and eliminates need for external bridge IC in data acquisition systems |
| Thermal Monitoring Diode | Provides real-time junction temperature feedback to system management controller for dynamic throttling |
| Multi-Voltage I/O Banks | Allows simultaneous connection to 1.2 V, 1.5 V, 1.8 V, and 3.3 V peripherals without level shifters |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time 5G NR physical layer processing in massive MIMO remote radio heads. IC Role / Device Role / Timing Role: FPGA fabric executes OFDM modulation/demodulation, channel coding, and beamforming; GTH transceivers handle CPRI/eCPRI fronthaul. Use Value: 24.5 Gb/s transceivers eliminate external SerDes, reducing BOM cost and PCB area by 32% versus Virtex-5 solutions. | Use Scenario: Multi-channel high-resolution oscilloscope with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: Configurable logic implements trigger arbitration and deep memory control; DSP slices perform streaming FFTs. Use Value: 1,920 DSP48E1 slices deliver 248 GMAC/s, enabling 1M-point FFT in <12 µs without offloading to CPU. |
| Radar Signal Processing | Avionics Data Concentrators |
Use Scenario: Active electronically scanned array (AESA) radar front-end with adaptive pulse compression and clutter filtering. IC Role / Device Role / Timing Role: FPGA processes digitized RF samples using pipelined FIR filters and CFAR detection; transceivers interface to high-speed ADCs/DACs. Use Value: 25,120 kbits of Block RAM buffers 4096-sample windows for STAP processing with zero external memory latency. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data concentrator in flight control systems. IC Role / Device Role / Timing Role: Implements deterministic time-triggered Ethernet switching and dual-redundant bus controllers in single device. Use Value: -40°C to +100°C operating range and SEU mitigation features meet DO-254 Level A hardware assurance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial interface FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | 16 nm UltraScale architecture; 32 GTY transceivers up to 32.75 Gb/s; higher logic density (568K LC) | Better suited for 40G/100G Ethernet and coherent optical interfaces requiring >25 Gb/s line rates | Select when migrating to higher bandwidth or lower power per function; requires PCB redesign due to different package and pinout |
| XC7VX485T-2FFG1761I | 28 nm 7-series; 36 GTP transceivers up to 13.1 Gb/s; lower max rate but mature toolchain and qualification | Preferred for cost-sensitive aerospace programs where 13.1 Gb/s suffices and long-term obsolescence avoidance is critical | Choose for legacy design refreshes needing proven reliability and extended lifecycle support beyond 2030 |
Compared with XC6VHX380T-2FFG1923I, XCKU060-2FFVA1156I offers higher transceiver speed and lower static power but demands new board layout and updated Vivado toolflow, while XC7VX485T-2FFG1761I trades peak bandwidth for broader qualification history and simplified migration path from Virtex-6 designs.
Availability
XC6VHX380T-2FFG1923I is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX380T-2FFG1923I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets with emphasis on performance-per-watt and heterogeneous integration.
The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in communications infrastructure and defense electronics, prioritizing transceiver flexibility and deterministic timing closure.
FAQ
What is the maximum guaranteed transceiver line rate for XC6VHX380T-2FFG1923I?
The XC6VHX380T-2FFG1923I guarantees operation up to 24.5 Gb/s per GTH transceiver lane under full industrial temperature range (-40°C to +100°C) and specified voltage tolerances. This rating is validated per AMD's DS152 datasheet Rev 5.2 and applies to AC-coupled differential interfaces with proper termination and reference clock jitter below 0.3 ps RMS. The XC6VHX380T-2FFG1923I does not support 25.78125 Gb/s (25G Ethernet KR) without margin reduction.
Does XC6VHX380T-2FFG1923I support AES bitstream encryption?
Yes, XC6VHX380T-2FFG1923I includes hardware-accelerated AES-256 decryption for encrypted configuration bitstreams stored in external SPI flash. The feature requires enabling BITSTREAM.ENCRYPTION and BITSTREAM.AES_KEY in the Xilinx ISE toolchain and uses on-chip key storage with battery-backed RAM or eFUSE options. This security mechanism prevents unauthorized readback or cloning of the XC6VHX380T-2FFG1923I configuration.
What configuration modes are supported by XC6VHX380T-2FFG1923I?
XC6VHX380T-2FFG1923I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses internal oscillator to drive external flash; Slave SelectMAP enables high-speed parallel loading via 8-bit or 16-bit host interface; JTAG is used for boundary-scan testing and partial reconfiguration. All modes are electrically compatible with the XC6VHX380T-2FFG1923I's dedicated CONFIG_IO bank and require correct INIT_B and DONE pin sequencing.
What is the thermal design power (TDP) range for XC6VHX380T-2FFG1923I?
The XC6VHX380T-2FFG1923I has a typical TDP of 18.5 W and maximum TDP of 24.3 W under worst-case 24.5 Gb/s transceiver activity and full logic utilization at 100°C junction temperature. Thermal solution design must accommodate 35 mm × 35 mm FFG package with thermal lid, and AMD recommends ≥ 2.5 W/°C heatsink thermal resistance with forced airflow. Power estimation tools like XPE v14.7 provide accurate XC6VHX380T-2FFG1923I TDP modeling per use case.
Is XC6VHX380T-2FFG1923I qualified for automotive applications?
No, XC6VHX380T-2FFG1923I is not AEC-Q100 qualified and lacks automotive-grade screening, temperature range extension beyond -40°C to +100°C, or fault-injection test reports required for automotive ECUs. It is rated for industrial and extended commercial environments only. For automotive ADAS domain controllers, AMD recommends the Zynq UltraScale+ MPSoC family instead of the XC6VHX380T-2FFG1923I.
XC6VHX380T-2FFG1923I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 29880
- Number of Logic Elements/Cells:
- 382464
- Total RAM Bits:
- 28311552
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1924-FCBGA (45x45)
XC6VHX380T-2FFG1923I FAQ
1.How can I place an order for XC6VHX380T-2FFG1923I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX380T-2FFG1923I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX380T-2FFG1923I reliable?
The price and inventory of XC6VHX380T-2FFG1923I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-2FFG1923I is usually 5 days.
3.What payment methods are accepted for XC6VHX380T-2FFG1923I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-2FFG1923I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX380T-2FFG1923I?
XC6VHX380T-2FFG1923I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX380T-2FFG1923I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX380T-2FFG1923I?
For technical support, including XC6VHX380T-2FFG1923I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-2FFG1923I requirements.
6.How does Aetrix verify that XC6VHX380T-2FFG1923I is sourced from the original manufacturer or authorized distributors?
All XC6VHX380T-2FFG1923I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-2FFG1923I meets industry standards.
7.What is the process for return or replacement of XC6VHX380T-2FFG1923I?
All XC6VHX380T-2FFG1923I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-2FFG1923I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX380T-2FFG1923I part is unused and in its original packaging.
Return procedure for XC6VHX380T-2FFG1923I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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