My Inquiry
My Account
AMD XC6VHX380T-3FFG1155C
- Part No.:
- XC6VHX380T-3FFG1155C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VHX380T-3FFG1155C.pdf
- Description:
- IC FPGA 440 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,508
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6VHX380T-3FFG1155C from AMD is a high-performance Virtex-6 HXT FPGA with 379,200 logic cells, 24.5 Gb/s transceivers, and integrated 10.3125 Gb/s multi-gigabit serial I/O. It serves as the system-level programmable logic fabric in high-speed communication line cards and radar signal processors.
For engineers reviewing the XC6VHX380T-3FFG1155C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, LVDS I/O support, thermal design power (19.2 W), and -3 speed grade timing closure.
Technical Context
The XC6VHX380T-3FFG1155C implements a 40 nm copper CMOS process with 128 GTX transceiver lanes supporting 600 Mb/s to 6.6 Gb/s operation and 16 GTH transceiver lanes rated up to 11.18 Gb/s. It integrates 1,536 DSP48E1 slices for fixed-point arithmetic and supports PCI Express Gen2 x8 endpoint configuration.
Configuration occurs via Master SelectMAP mode using external SPI flash or JTAG boundary-scan. The device includes dedicated clock management tiles with MMCM and PLL blocks enabling sub-150 ps jitter performance at 100 MHz output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 379,200 - total configurable logic resources for complex state machines and data path implementation |
| Transceiver Lanes | 128 GTX + 16 GTH - supports multi-protocol serial interfaces including CPRI, SRIO, and 10GbE |
| Max Transceiver Rate | 11.18 Gb/s - enables single-lane 10GBASE-KR compliance without gearbox logic |
| DSP Slices | 1,536 DSP48E1 - provides 18×25-bit multiply-accumulate capability per slice for real-time filtering |
| I/O Standards | LVDS, BLVDS, RSDS, TMDS, HSTL, SSTL - supports direct interfacing to ADCs, DACs, and memory controllers |
| Thermal Design Power | 19.2 W - defines heatsink sizing requirement under worst-case switching activity |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths |
Pinout & Package
XC6VHX380T-3FFG1155C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and 35 × 35 mm body size. Thermal and mechanical data comply with JEDEC MO-271AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for transceiver banks | Must be filtered with 100 nF + 4.7 µF local decoupling to meet <15 mV ripple spec |
| MRCC/MRCC_N | Multi-Region Clock Capable input pair | Accepts differential LVDS/BLVDS clocks up to 800 MHz for global clock distribution |
| HP[0:71] | High-Performance I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.25 V I/O standards with programmable slew rate and drive strength |
| CCLK | Configuration clock input | Driven by external oscillator or FPGA-generated clock during SelectMAP configuration |
| INIT_B | Configuration status indicator | Active-low open-drain signal asserting during bitstream loading and CRC checking |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 10.3125 Gb/s Transceivers | Enables direct connection to SFP+ optical modules without external retimers |
| PCIe Gen2 x8 Endpoint Support | Reduces host interface design effort with hard IP block and AXI4 streaming interface |
| MMCM and PLL Clock Management | Delivers <150 ps integrated jitter at 100 MHz for low-jitter sampling clock generation |
| Configurable I/O Standards | Eliminates level-shifter ICs when interfacing with mixed-voltage peripherals (1.2 V to 1.8 V) |
| Partial Reconfiguration Capability | Allows dynamic function swapping in deployed systems without full reconfiguration overhead |
Applications
| Radar Signal Processing | Optical Transport Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: Programmable logic fabric executing FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 1,536 DSP48E1 slices enable parallel 1024-point FFT execution within 2.1 µs at 200 MHz clock. | Use Scenario: 100G OTN framer and switch fabric in metro DWDM equipment. IC Role / Device Role / Timing Role: Multi-protocol serial I/O controller handling OTU4 framing, FEC, and client mapping. Use Value: 16 GTH transceivers support native 11.18 Gb/s OTL4.4 interface without gearbox logic. |
| Medical Imaging Data Acquisition | Test & Measurement Instrumentation |
Use Scenario: High-fidelity ultrasound beamformer with 128-channel echo digitization. IC Role / Device Role / Timing Role: Time-aligned digital receiver core synchronizing ADC sampling and channel weighting. Use Value: MRCC inputs accept 800 MHz LVDS clocks for precise 125 MSPS sampling across all channels. | Use Scenario: Modular PXIe-based oscilloscope with 10 GS/s real-time capture. IC Role / Device Role / Timing Role: High-speed data acquisition controller managing DDR3 memory buffering and PCIe Gen2 x8 upload. Use Value: 128 GTX lanes provide 80 Gb/s aggregate bandwidth for sustained 10 GS/s waveform streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm process, 2,560 UltraScale+ DSP slices, higher transceiver count (64 GTY @ 32.75 Gb/s) | Better suited for 400G Ethernet and AI inference acceleration | Select when migrating to higher bandwidth or lower power per GOP |
| XC7VX690T-3FFG1927C | 28 nm process, same architecture family, 690K logic cells, 40 GTX lanes only | Limited to 6.6 Gb/s protocols; no GTH transceivers | Choose for cost-sensitive designs requiring legacy Virtex-7 compatibility and lower I/O count |
Compared with XC6VHX380T-3FFG1155C, XCVU9P-2FLGA2104I delivers 2.8× more DSP throughput and supports PAM4 signaling, while XC7VX690T-3FFG1927C trades transceiver speed for higher logic density and mature toolchain support.
Availability
XC6VHX380T-3FFG1155C is available at Aetrix Electronics and suitable for radar signal processing, optical transport line cards, and medical imaging data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XC6VHX380T-3FFG1155C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-6 family was designed for high-bandwidth, low-latency programmable logic in wired communications, defense electronics, and scientific instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC6VHX380T-3FFG1155C?
The XC6VHX380T-3FFG1155C supports up to 11.18 Gb/s on its 16 GTH transceiver lanes and up to 6.6 Gb/s on its 128 GTX lanes. This allows native implementation of 10GBASE-KR, CPRI Option 3, and OTU2 protocols without external retiming circuitry. The XC6VHX380T-3FFG1155C datasheet specifies these rates under recommended voltage and temperature conditions.
Does XC6VHX380T-3FFG1155C support partial reconfiguration?
Yes, XC6VHX380T-3FFG1155C supports partial reconfiguration through its ICAP interface and hierarchical design flow in Vivado Design Suite. This enables runtime logic module swapping in deployed systems such as adaptive radar waveforms or protocol-agile test equipment. The XC6VHX380T-3FFG1155C configuration architecture allocates dedicated frame buffers and address decoding for dynamic region updates.
What I/O standards are supported by XC6VHX380T-3FFG1155C HP banks?
XC6VHX380T-3FFG1155C HP I/O banks support LVDS, BLVDS, RSDS, TMDS, HSTL Class I/II, and SSTL Class I/II at voltages ranging from 1.25 V to 1.8 V. Each bank is independently configurable, allowing mixed-standard operation across pins. The XC6VHX380T-3FFG1155C documentation confirms this support in Table 27 of DS152 (v1.17).
What is the thermal design power (TDP) of XC6VHX380T-3FFG1155C?
The thermal design power of XC6VHX380T-3FFG1155C is 19.2 W under worst-case switching activity at junction temperature of 100°C. This value guides heatsink selection and airflow requirements in enclosed chassis environments. The XC6VHX380T-3FFG1155C power estimation report (XPE v14.7) validates this TDP using typical routing congestion and toggle rates.
Is XC6VHX380T-3FFG1155C compatible with Vivado Design Suite?
No, XC6VHX380T-3FFG1155C requires ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. Vivado does not support Virtex-6 devices. The XC6VHX380T-3FFG1155C toolchain dependency is documented in UG628 (v14.7) and enforced by device ID checks in Vivado's device database.
XC6VHX380T-3FFG1155C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 HXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 29880
- Number of Logic Elements/Cells:
- 382464
- Total RAM Bits:
- 28311552
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VHX380T-3FFG1155C FAQ
1.How can I place an order for XC6VHX380T-3FFG1155C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VHX380T-3FFG1155C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VHX380T-3FFG1155C reliable?
The price and inventory of XC6VHX380T-3FFG1155C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VHX380T-3FFG1155C is usually 5 days.
3.What payment methods are accepted for XC6VHX380T-3FFG1155C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VHX380T-3FFG1155C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VHX380T-3FFG1155C?
XC6VHX380T-3FFG1155C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VHX380T-3FFG1155C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VHX380T-3FFG1155C?
For technical support, including XC6VHX380T-3FFG1155C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VHX380T-3FFG1155C requirements.
6.How does Aetrix verify that XC6VHX380T-3FFG1155C is sourced from the original manufacturer or authorized distributors?
All XC6VHX380T-3FFG1155C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VHX380T-3FFG1155C meets industry standards.
7.What is the process for return or replacement of XC6VHX380T-3FFG1155C?
All XC6VHX380T-3FFG1155C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VHX380T-3FFG1155C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VHX380T-3FFG1155C part is unused and in its original packaging.
Return procedure for XC6VHX380T-3FFG1155C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VHX380T-3FFG1155C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
