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AMD XC6VLX130T-1FF1156C
- Part No.:
- XC6VLX130T-1FF1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-1FF1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,623
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Product details
Overview
XC6VLX130T-1FF1156C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.8 Mb of total block RAM. It supports PCIe Gen2 x8, DDR3-800 memory interfaces, and operates at -1 speed grade with 1.0V core voltage. Used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-1FF1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (600 user I/Os), transceiver line rate (6.6 Gb/s), thermal design power (19.7 W typical), and support for JTAG boundary-scan and SelectMAP configuration.
Technical Context
The XC6VLX130T-1FF1156C implements a fully programmable architecture based on 4-input LUTs and distributed RAM, with dedicated routing for high-speed serial I/O. It integrates 24 multi-gigabit transceivers supporting protocols including SATA, SRIO, and CPRI.
Configuration is performed via Master SelectMAP mode using external flash or JTAG, with bitstream encryption and HMAC authentication available. The device includes clock management tiles (CMT) with dual DCMs and PLLs per CMT for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations up to 25 GMAC/s at 200 MHz |
| Block RAM | 16.8 Mb - supports large on-chip data buffering, FIFOs, and coefficient storage |
| User I/O Pins | 600 - provides flexible interface connectivity across multiple voltage standards (1.2–3.3 V) |
| Transceiver Line Rate | 6.6 Gb/s - enables single-lane CPRI v6.0 or dual-lane SATA 3.0 links |
| Speed Grade | -1 - guarantees timing closure at specified frequencies under worst-case industrial temperature conditions |
| Core Voltage | 1.0 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
Pinout & Package
XC6VLX130T-1FF1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside requires solder paste stencil aperture and ground plane connection for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Select boot mode (e.g., Master SelectMAP, JTAG) during power-up reset |
| CCLK | Configuration Clock | Drives internal configuration shift register; externally generated during SelectMAP programming |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master SelectMAP mode |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| GTX_CLK0_M2C_P/N | Differential Transceiver Reference Clock | Provides low-jitter reference for GTX transceiver banks (Bank 112/113) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint Support | Integrated hard IP enables direct attachment to host CPU without external bridge logic |
| DDR3-800 Memory Controller | Hard macro supports 16-bit/32-bit interfaces with 400 MHz clock, reducing PHY design effort |
| Bitstream Encryption | AES-256 key protection prevents unauthorized configuration and IP theft |
| HMAC Authentication | Ensures bitstream integrity via SHA-256 hash verification before configuration commit |
| Multi-Gigabit Transceivers | 24 GTX transceivers with built-in 8B/10B encoding and elastic buffers for protocol adaptation |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sample ingestion, FIR filtering, and FFT computation. Use Value: 1,200 DSP48E1 slices deliver sustained 22 GMAC/s throughput for adaptive clutter cancellation algorithms. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Co-processor accelerating back-projection and denoising kernels while interfacing with DDR3 frame buffers. Use Value: 16.8 Mb block RAM enables on-chip storage of 2K×2K sinogram tiles, eliminating off-chip latency bottlenecks. |
| Wireless Baseband Processing | High-Speed Test Equipment |
Use Scenario: LTE-A and 5G NR physical layer processing in small-cell base stations. IC Role / Device Role / Timing Role: Reconfigurable baseband engine executing channel coding, OFDM modulation, and MIMO precoding. Use Value: 600 user I/Os support parallel 4×4 MIMO RF interface timing with sub-ns skew control. | Use Scenario: Protocol-aware pattern generation and analysis in automated test systems for SerDes validation. IC Role / Device Role / Timing Role: Programmable stimulus generator with deterministic 6.6 Gb/s transceiver output and real-time error injection. Use Value: GTX transceivers operate at exact line rates required for PCI Express Gen2 compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-1FF1759C | Higher logic density (240K LC), 36 GTX transceivers, larger FFG1759 package | Required for designs needing >128K LC or >24 transceivers; higher TDP (27.4 W) | Choose when XC6VLX130T-1FF1156C resource utilization exceeds 90% across LUT, DSP, and RAM |
| XC7VX330T-2FFG1157I | Virtex-7 generation; 304K logic cells, 36 GTH transceivers, 28 nm process, -2 speed grade | Supports PCIe Gen3 and DDR3-1066; not pin-compatible; requires board redesign | Consider for new designs requiring higher bandwidth or lower power per logic cell; migration path from XC6VLX130T-1FF1156C |
Compared with XC6VLX130T-1FF1156C, XC6VLX240T-1FF1759C offers scalable resources within the same Virtex-6 family, while XC7VX330T-2FFG1157I delivers architectural improvements but mandates PCB revision and toolchain update.
Availability
XC6VLX130T-1FF1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and wireless baseband processing requiring stable component supply across long-life industrial programs.
Supply support for XC6VLX130T-1FF1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance, high-bandwidth applications including wired/wireless infrastructure, aerospace, and scientific computing where deterministic latency and reconfigurable logic density are critical.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VLX130T-1FF1156C?
The XC6VLX130T-1FF1156C supports DDR3-800 (400 MHz clock) with a hard memory controller in Bank 34/35. This enables 16-bit or 32-bit interfaces with full read/write calibration, write leveling, and gate training. The XC6VLX130T-1FF1156C does not support DDR3-1066 or LPDDR2/3; those require Virtex-7 or later families.
Does XC6VLX130T-1FF1156C support PCIe Gen2 endpoint functionality?
Yes, XC6VLX130T-1FF1156C includes a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.0. It supports link training, power management states (L0s/L1), and message-signaled interrupts. The XC6VLX130T-1FF1156C requires external EEPROM for vendor/device ID configuration and does not integrate a root complex.
What configuration modes are supported by XC6VLX130T-1FF1156C?
XC6VLX130T-1FF1156C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-on. Master SelectMAP uses CCLK-driven parallel loading from external flash; JTAG enables debugging and partial reconfiguration. The XC6VLX130T-1FF1156C does not support passive serial (SPI) or BPI configuration.
Is bitstream encryption available on XC6VLX130T-1FF1156C?
Yes, XC6VLX130T-1FF1156C supports AES-256 bitstream encryption using a 256-bit key stored in on-chip eFUSE. Encryption is enabled during bitstream generation in Vivado Design Suite. The XC6VLX130T-1FF1156C also supports HMAC-SHA256 authentication to verify bitstream integrity prior to configuration commit.
What is the thermal design power (TDP) of XC6VLX130T-1FF1156C under typical operating conditions?
The XC6VLX130T-1FF1156C has a typical thermal design power of 19.7 W at 80°C junction temperature, assuming 50% logic toggle rate, 25% I/O activity, and active transceivers. Power estimation must be performed using Xilinx XPE tool with actual design netlist and constraints. The XC6VLX130T-1FF1156C requires a heatsink and forced airflow for sustained operation above 65°C ambient.
XC6VLX130T-1FF1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-1FF1156C FAQ
1.How can I place an order for XC6VLX130T-1FF1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-1FF1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-1FF1156C reliable?
The price and inventory of XC6VLX130T-1FF1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-1FF1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-1FF1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-1FF1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-1FF1156C?
XC6VLX130T-1FF1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-1FF1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-1FF1156C?
For technical support, including XC6VLX130T-1FF1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-1FF1156C requirements.
6.How does Aetrix verify that XC6VLX130T-1FF1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-1FF1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-1FF1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-1FF1156C?
All XC6VLX130T-1FF1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-1FF1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-1FF1156C part is unused and in its original packaging.
Return procedure for XC6VLX130T-1FF1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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