AMD XC6VLX130T-1FF1156I

Overview

XC6VLX130T-1FF1156I from AMD (formerly Xilinx) is a Virtex-6 FPGA with 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of total block RAM. It features 600 MHz system clock capability, SelectIO™ technology supporting DDR3 at 800 Mbps, and operates over –40°C to +100°C industrial temperature range. It serves as a high-performance reconfigurable fabric in radar signal processing subsystems.

For engineers reviewing the XC6VLX130T-1FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), transceiver lane count (24 GTX), and thermal design power (17.5 W typical).

Technical Context

The XC6VLX130T-1FF1156I implements a 40 nm bulk CMOS architecture with dual-register LUT6 logic, integrated PCIe Gen2 x8 endpoint, and 24 GTX transceivers each capable of 6.6 Gbps line rates. It supports JTAG boundary-scan (IEEE 1149.1) and IEEE 1532 configuration.

Configuration is performed via Master SelectMAP, Slave SelectMAP, or Serial Peripheral Interface (SPI) flash mode using dedicated CCLK, DIN, and INIT_B pins. The device includes internal voltage regulation for VCCINT (1.0 V ±3%), VCCAUX (2.5 V ±5%), and VCCO banks.

Key Specifications

Pinout & Package

XC6VLX130T-1FF1156I uses a 1156-pin flip-chip BGA (FF1156) package with 16 I/O banks, dedicated configuration pins (INIT_B, PROGRAM_B, CCLK, DONE), and 24 GTX transceiver banks (each with differential TX/RX pairs and reference clocks).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX130T-1FF1156I, the XCVU9P offers higher bandwidth and lower power per function but demands PCB redesign and new qualification; the XC7VX690T delivers incremental capacity uplift with minimal toolchain change but lacks native PCIe Gen2 support.

Availability

XC6VLX130T-1FF1156I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended temperature ranges.

Supply support for XC6VLX130T-1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and SoCs for high-performance embedded and datacenter applications.

The Virtex-6 family was designed for compute-intensive, high-bandwidth applications such as wireless infrastructure, defense radar, and scientific instrumentation requiring deterministic latency and mixed-signal integration.

FAQ

What is the maximum supported DDR3 data rate for XC6VLX130T-1FF1156I?

The XC6VLX130T-1FF1156I supports DDR3 interfaces up to 800 Mbps per pin using its SelectIO technology. This is achieved with calibrated I/O timing, on-die termination, and programmable output drive strength. The device requires external memory controller logic implemented in fabric or via IP core. XC6VLX130T-1FF1156I does not include a hard memory controller, so timing closure depends on placement and routing constraints.

Does XC6VLX130T-1FF1156I include a built-in PCIe Gen2 endpoint?

Yes, XC6VLX130T-1FF1156I integrates a hard PCIe Gen2 x8 endpoint compliant with PCI Express Base Specification v2.0. It handles link training, transaction layer packet generation, and data scrambling without consuming logic resources. XC6VLX130T-1FF1156I supports both endpoint and root complex configurations via configuration space registers accessible through AXI interface.

What configuration modes are supported by XC6VLX130T-1FF1156I?

XC6VLX130T-1FF1156I supports Master SelectMAP, Slave SelectMAP, Serial (SPI), and JTAG configuration modes. Master SelectMAP uses internal oscillator to drive CCLK; Slave mode relies on external clock. SPI mode loads from standard quad-SPI flash. All modes use the same bitstream format. XC6VLX130T-1FF1156I requires proper INIT_B and DONE pin handling regardless of mode.

What is the thermal design power (TDP) of XC6VLX130T-1FF1156I under typical operating conditions?

The typical thermal design power of XC6VLX130T-1FF1156I is 17.5 W at 600 MHz system clock, 50% logic utilization, and 25% I/O switching activity. Power varies with voltage scaling, temperature, and design-specific resource usage. XC6VLX130T-1FF1156I includes System Monitor circuitry to measure on-die temperature and supply voltages for thermal management feedback.

Is XC6VLX130T-1FF1156I qualified for automotive applications?

No, XC6VLX130T-1FF1156I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure reporting, and traceability requirements. For automotive use, AMD recommends the XA-Virtex-6 family variants, which share the same architecture but undergo additional qualification. XC6VLX130T-1FF1156I remains suitable for industrial and aerospace applications meeting IPC-610 Class 3 standards.