AMD XC6VLX130T-1FFG1156C

Overview

XC6VLX130T-1FFG1156C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of block RAM, configured in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and embedded processing applications in radar signal processing systems.

For engineers reviewing the XC6VLX130T-1FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, and -1 speed grade timing performance under industrial temperature conditions.

Technical Context

The XC6VLX130T-1FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated 6.6 Gb/s multi-gigabit transceivers (MGTs). It supports PCI Express Gen2 x8, SATA II, and Serial RapidIO protocols via its GTx transceiver banks.

This device includes dual-register 6-input LUTs, built-in clock management tiles (CMT) with PLL and MMCM, and SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.

Key Specifications

Pinout & Package

XC6VLX130T-1FFG1156C is housed in a 1156-ball flip-chip fine-pitch BGA (FFG) package with thermal lid, 1.0 mm ball pitch, and 35 × 35 mm footprint. Pin functions are organized into I/O banks, configuration banks, transceiver banks (GTx), and dedicated power/ground balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX75T-1FFG1156C, the XC6VLX130T-1FFG1156C provides 71% more logic and 67% more DSP slices in identical packaging-enabling larger algorithm partitions without board change. Versus XCKU060-2FFVA1156I, it offers mature toolchain support and lower power at 6.6 Gb/s, but lacks Gen3+ transceivers and hardened IP.

Availability

XC6VLX130T-1FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX130T-1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-6 family was designed for high-performance, high-bandwidth applications including wired communications infrastructure, aerospace and defense signal processing, and high-end test equipment.

FAQ

What is the maximum transceiver line rate supported by XC6VLX130T-1FFG1156C?

The XC6VLX130T-1FFG1156C supports a maximum transceiver line rate of 6.6 Gb/s per GTx channel. This enables compliance with PCI Express Gen2, Serial RapidIO Gen2, and SATA II standards. The transceiver calibration engine maintains signal integrity across process, voltage, and temperature variations, ensuring reliable operation at this rate in industrial environments.

Does XC6VLX130T-1FFG1156C support partial reconfiguration?

Yes, XC6VLX130T-1FFG1156C supports partial reconfiguration through Xilinx ISE Design Suite tools. This capability allows dynamic replacement of functional modules in the FPGA fabric without resetting the entire device. Engineers use this feature in applications like radar waveform adaptation and protocol switching, where uninterrupted system operation is critical during updates.

What I/O standards are supported by XC6VLX130T-1FFG1156C?

XC6VLX130T-1FFG1156C supports SSTL-18/25, HSTL-I/II, LVCMOS (1.2 V to 3.3 V), LVDS, and TMDS across its configurable I/O banks. Each bank operates independently with selectable VCCO, enabling mixed-standard interfaces on a single device-for example, DDR3 memory control alongside HDMI output and Gigabit Ethernet PHY signaling-all implemented within XC6VLX130T-1FFG1156C.

What is the operating temperature range for XC6VLX130T-1FFG1156C?

The XC6VLX130T-1FFG1156C is rated for industrial temperature operation from –40°C to +100°C. Its -1 speed grade guarantees timing closure under worst-case PVT conditions within this range. Thermal management relies on the FFG1156 package's integrated heat spreader and recommended PCB copper pour under the thermal lid to maintain junction temperature below 100°C.

Is XC6VLX130T-1FFG1156C compatible with Xilinx ISE 14.7?

Yes, XC6VLX130T-1FFG1156C is fully supported in Xilinx ISE Design Suite 14.7-the final and officially qualified tool version for Virtex-6 devices. Synthesis, place-and-route, and bitstream generation for XC6VLX130T-1FFG1156C require ISE 14.7 or earlier; Vivado does not support this architecture. Device-specific constraints and transceiver wizards are validated only in this environment.