AMD XC6VLX130T-1FFG1156I

Overview

XC6VLX130T-1FFG1156I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,248 DSP48E1 slices, and 16.4 Mb of total block RAM. It operates at -1 speed grade (1.2 V core, 1.0 ns CLB delay), packaged in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG). It targets high-performance serial transceiver applications including 6.6 Gb/s multi-gigabit transceivers.

For engineers reviewing the XC6VLX130T-1FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (24 lanes), I/O standard support (LVDS, SSTL, HSTL), thermal performance in FFG package, and compatibility with Vivado and ISE design suites.

Technical Context

The XC6VLX130T-1FFG1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO.

It supports SelectIO standards up to 1.8 V, includes integrated clock management (MMCM and PLL), and delivers deterministic timing closure for high-speed serial interfaces. The -1 speed grade specifies maximum operating frequencies for CLB logic (600 MHz), block RAM (550 MHz), and I/O (1,066 Mbps DDR3).

Key Specifications

Pinout & Package

XC6VLX130T-1FFG1156I is housed in a 1156-ball Flip-Chip Fine-Pitch BGA (FFG) package with 16 power/ground rings, dedicated configuration banks (CONFIG), and differential clock inputs (MRCC/DRCC). Thermal pad under die improves junction-to-board heat transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VLX75T-1FFG1156I, the XC6VLX130T-1FFG1156I delivers 71% more logic and 73% more DSP resources in identical packaging-enabling larger algorithm partitions without board redesign. Against XCKU060-2FFVA1156I, it trades raw bandwidth for mature toolchain support and lower power in established 6.6 Gb/s infrastructure.

Availability

XC6VLX130T-1FFG1156I is available at Aetrix Electronics and suitable for high-performance computing, aerospace data concentrators, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX130T-1FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-6 family was engineered for high-bandwidth, low-latency applications in wired communications, defense systems, and scientific instrumentation where deterministic timing and transceiver integration are critical.

FAQ

What is the maximum supported DDR3 data rate for XC6VLX130T-1FFG1156I?

The XC6VLX130T-1FFG1156I supports DDR3 interfaces up to 1,066 Mbps per pin in the -1 speed grade. This is validated for SSTL-15 and SSTL-18 I/O standards across banks configured with VCCO = 1.5 V or 1.8 V, and requires proper PCB layout adherence to Xilinx UG381 guidelines for fly-by topology and termination.

Does XC6VLX130T-1FFG1156I include hardened PCIe Gen2 endpoints?

Yes, the XC6VLX130T-1FFG1156I integrates 24 multi-gigabit transceivers with native PCIe Gen2 endpoint capability. Each transceiver lane can be configured as a PCIe endpoint with hard-coded encoding, framing, and link training logic-no soft IP required for basic enumeration and DMA transfers.

What configuration modes does XC6VLX130T-1FFG1156I support?

The XC6VLX130T-1FFG1156I supports Master SelectMAP, Slave SelectMAP, Serial Peripheral Interface (SPI), and JTAG configuration modes. Configuration is initiated via PROGRAM_B and monitored through INIT_B and DONE pins, with bitstream loading from external SPI flash or host processor over parallel or serial interfaces.

Is partial reconfiguration supported on XC6VLX130T-1FFG1156I?

Yes, partial reconfiguration is fully supported on XC6VLX130T-1FFG1156I using Xilinx ISE Design Suite tools. It enables dynamic replacement of logical modules (e.g., filter coefficients or protocol engines) without resetting the entire device or disrupting active I/O and transceiver links.

What thermal management guidance applies to XC6VLX130T-1FFG1156I in FFG1156 package?

XC6VLX130T-1FFG1156I requires a 6-layer PCB with internal ground/power planes and thermal vias under the thermal pad. Xilinx DS152 specifies a maximum junction temperature of 100°C; typical operation at 85°C ambient requires ≥25 CFM airflow or a 15 mm² copper pour with ≥12 thermal vias (0.3 mm diameter) beneath the package.