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AMD XC6VLX130T-1FFG484C
- Part No.:
- XC6VLX130T-1FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX130T-1FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,268
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Product details
Overview
XC6VLX130T-1FFG484C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.5 Mb of block RAM. It supports PCIe Gen2 x8, DDR3-1333 memory interfaces, and operates at -1 speed grade (1.2 V core voltage) in the FFG484 flip-chip fine-pitch BGA package. It is used in high-performance digital signal processing systems such as radar beamforming engines.
For engineers reviewing the XC6VLX130T-1FFG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (364 user I/Os), transceiver line rate (6.6 Gb/s), thermal profile for convection-cooled enclosures, and compatibility with Vivado 2019.2+ and ISE 14.7 toolchains.
Technical Context
The XC6VLX130T-1FFG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and high-speed serial transceivers. It integrates 364 user-configurable I/O pins supporting LVDS, SSTL-15/18, and HSTL standards, and includes 24 GTX transceivers capable of 6.6 Gb/s operation.
This device belongs to the Virtex-6 LXT family and targets applications requiring deterministic low-latency data paths, multi-gigabit serial connectivity, and hardware-accelerated compute. Its -1 speed grade guarantees timing closure at 1.2 V core supply with junction temperature up to 100°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 × DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 16.5 Mb - supports large on-chip buffering for video frame stores or packet reassembly |
| Transceivers | 24 × GTX - provides 6.6 Gb/s serial links for CPRI, SRIO, or PCIe Gen2 endpoints |
| User I/O Pins | 364 - supports wide parallel buses (e.g., DDR3 x72) and mixed-voltage interface banks |
| Speed Grade | -1 - specifies maximum operating frequency under 1.2 V core and 100°C junction conditions |
| Package | FFG484 - 484-pin flip-chip BGA with 1.0 mm pitch, 23×23 mm body, and 0.75 mm ball pitch |
Pinout & Package
The XC6VLX130T-1FFG484C is housed in a 484-pin flip-chip fine-pitch BGA (FFG484) package with 23×23 mm body size, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V nominal; must be filtered within 100 mV ripple for stable CLB/DSP operation |
| VCCAUX | Auxiliary power supply | 1.8 V for configuration logic, clock management, and SelectIO banks |
| VCCO | I/O bank power | Configurable per bank (1.2–3.3 V); sets output swing and input threshold |
| M0–M2 | Configuration mode pins | Determine boot source (SPI, BPI, or JTAG) during power-on reset |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or error condition |
| CCLK | Configuration clock | Drives internal configuration shift register; sourced externally in master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 40 nm HKMG process | Enables lower dynamic power vs. 65 nm Virtex-5 while maintaining high clock frequencies |
| Integrated PCIe Gen2 endpoint | Reduces external PHY count and simplifies board routing for host interface designs |
| DDR3 memory controller hard IP | Provides verified, timing-closed interface to DDR3-1333 components without RTL synthesis effort |
| Multi-standard SelectIO technology | Allows single I/O bank to support LVDS, SSTL, HSTL, and differential signaling simultaneously |
| Partial reconfiguration support | Permits runtime logic module swapping without full device reset or system interruption |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time adaptive beamforming and pulse-Doppler processing in ground-based phased-array radar. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical filtering and correlation kernels; GTX transceivers stream ADC samples from RF front-end. Use Value: 128K logic cells and 1.2 GHz DSP slice throughput enable sub-microsecond latency for closed-loop tracking loops. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: XC6VLX130T-1FFG484C hosts parallel FFT and back-projection accelerators; DDR3 controller manages 16 GB/s memory bandwidth. Use Value: Hardened DDR3-1333 interface ensures deterministic access to frame buffers, eliminating timing margin uncertainty in real-time reconstruction. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: XC6VLX130T-1FFG484C implements protocol engines and time-synchronized packet switching across multiple avionics networks. Use Value: 364 user I/Os allow simultaneous connection to 8+ independent bus interfaces with isolated power domains per bank. | Use Scenario: Bit-error-rate testing and protocol validation for 10 GbE and CPRI optical links. IC Role / Device Role / Timing Role: GTX transceivers generate and analyze PRBS patterns; logic fabric implements pattern matching and jitter injection. Use Value: 6.6 Gb/s transceiver line rate matches CPRI Option 3 and 10GBASE-R physical layer requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; 2.5× more logic cells; 16.3 Gb/s GTY transceivers; 0.85 V core | Targets next-gen 5G massive MIMO and AI inference acceleration; requires new PCB layout and power delivery design | Select when migrating to higher bandwidth or longer product lifecycle; not pin-compatible with XC6VLX130T-1FFG484C |
| XC7VX690T-2FFG1927I | Virtex-7 architecture; 690K logic cells; 13.1 Gb/s GTH transceivers; 1.0 V core; larger FFG1927 package | Used in high-end test instrumentation and satellite payload processing where >1 GHz sustained DSP throughput is required | Choose for higher DSP density and wider memory bandwidth; requires redesign of thermal and mechanical mounting |
Compared with XC6VLX130T-1FFG484C, the XCVU9P-2FLGA2104I delivers 2.5× logic capacity and doubles transceiver speed but mandates new toolchain (Vivado only) and PCB layout. The XC7VX690T-2FFG1927I offers greater I/O count and hardened PCIe Gen3 support, yet occupies nearly 3× the board area and increases cooling complexity.
Availability
XC6VLX130T-1FFG484C is available at Aetrix Electronics and suitable for radar beamforming, medical imaging backend processing, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX130T-1FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI processors for data center, edge, and embedded markets.
The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in defense, aerospace, and scientific instrumentation systems where deterministic timing and multi-standard I/O flexibility are critical.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX130T-1FFG484C?
The XC6VLX130T-1FFG484C supports DDR3-1333 (667 MHz clock, 1333 Mb/s data rate) using its hardened memory controller IP. This capability is validated across all I/O banks configured for SSTL15 standards and requires proper PCB layout with controlled impedance and matched trace lengths. The XC6VLX130T-1FFG484C does not support DDR3L or LPDDR3 interfaces.
Does XC6VLX130T-1FFG484C support partial reconfiguration?
Yes, the XC6VLX130T-1FFG484C supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and FRAME_ECC features. This allows dynamic swapping of logic modules without resetting the entire device or halting system operation. Implementation requires Xilinx ISE 14.7 or later and adherence to floorplanning constraints defined in UG394. The XC6VLX130T-1FFG484C does not support dynamic function exchange (DFX) as introduced in UltraScale devices.
What configuration modes are supported by XC6VLX130T-1FFG484C?
The XC6VLX130T-1FFG484C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is determined by M0–M2 pin states at power-up. Master SPI is most commonly used for single-flash boot; JTAG is reserved for debugging and programming during development. The XC6VLX130T-1FFG484C does not support BPI or NAND flash boot without external controller logic.
What is the thermal resistance (θJA) of the FFG484 package for XC6VLX130T-1FFG484C?
The XC6VLX130T-1FFG484C in FFG484 package has a typical junction-to-ambient thermal resistance (θJA) of 15.2°C/W under JEDEC standard 2-layer board conditions. With a 20 mm² copper thermal pad soldered to the PCB ground plane, θJA improves to ≤9.8°C/W. Thermal performance must be verified using Xilinx XPE tool with actual power estimates for the implemented design.
Is XC6VLX130T-1FFG484C compatible with Vivado Design Suite?
No, the XC6VLX130T-1FFG484C is not supported in Vivado Design Suite. It requires Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation. While Vivado can read some Virtex-6 netlists for migration analysis, full implementation flow is only available in ISE. The XC6VLX130T-1FFG484C is fully supported in ISE 14.7 with all device-specific primitives and timing models.
XC6VLX130T-1FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX130T-1FFG484C FAQ
1.How can I place an order for XC6VLX130T-1FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-1FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-1FFG484C reliable?
The price and inventory of XC6VLX130T-1FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-1FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-1FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-1FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-1FFG484C?
XC6VLX130T-1FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-1FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-1FFG484C?
For technical support, including XC6VLX130T-1FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-1FFG484C requirements.
6.How does Aetrix verify that XC6VLX130T-1FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-1FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-1FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-1FFG484C?
All XC6VLX130T-1FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-1FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-1FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX130T-1FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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