AMD XC6VLX130T-1FFG484I
- Part No.:
- XC6VLX130T-1FFG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX130T-1FFG484I.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,016
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Product details
Overview
XC6VLX130T-1FFG484I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-1FFG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (364 user I/Os), transceiver lane count (24 lanes), voltage supply requirements (1.0V core, 1.8V/2.5V I/O), and thermal design envelope for FFG484 package.
Technical Context
The XC6VLX130T-1FFG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 multi-gigabit transceivers compliant with PCIe Gen2, SATA, and SRIO standards.
It supports SelectIO™ technology with programmable I/O standards including LVCMOS, LVDS, SSTL, and HSTL across 364 user-accessible pins. Configuration is performed via JTAG, Master SPI, or Slave SelectMAP modes using external flash or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 16.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external memory access |
| Transceivers | 24 lanes @ 6.6 Gb/s - supports serial protocols including PCIe Gen2 x8 and dual 10GbE MAC interfaces |
| User I/O Pins | 364 - supports high-pin-count interface bridging, such as DDR3 memory controllers and video pixel buses |
| Speed Grade | -1 - specifies maximum operating frequency under industrial temperature conditions with 1.0V core supply |
| Operating Temp | -40°C to +100°C - qualifies for deployment in industrial control cabinets and outdoor telecom equipment |
Pinout & Package
XC6VLX130T-1FFG484I is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG484) package with 29×29 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal pad on underside requires solder paste stencil design per Xilinx UG373.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% regulated input required for CLB and routing fabric operation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and transceiver reference circuits |
| VCCO | I/O bank power | Configurable per-bank (1.2V–3.3V) to support mixed-voltage interface interfacing |
| CONFIG_IO | Configuration I/O | Multi-function pins used for JTAG, SPI, or SelectMAP configuration loading |
| GTxCLK | Transceiver reference clock | Dedicated differential inputs for transceiver PLL reference; must meet jitter spec <1.5 ps RMS |
| MRCC / SRCC | Global clock inputs | Primary/secondary dedicated clock inputs feeding MMCM and BUFG resources |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Integrated MMCM and PLL support dynamic phase shifting, frequency synthesis, and jitter filtering for multi-domain clocking |
| PCIe Gen2 Endpoint Support | Hard IP blocks enable full endpoint functionality without soft-core overhead or timing closure risk |
| DDR3 Memory Interface | Native PHY support for 800 Mbps data rates across up to 16-bit wide interfaces with DQS gating |
| Transceiver Power Gating | Per-lane power-down capability reduces dynamic power by >40% when lanes are idle in burst-mode protocols |
| Partial Reconfiguration | Enables runtime module swapping without system reset-critical for adaptive radar and protocol gateway applications |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable hardware accelerator executing time-critical DSP kernels with deterministic latency. Use Value: 128K logic cells and 1.2K DSP slices enable concurrent processing of 32-channel RF data streams at 100 MSPS. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Co-processor offloading floating-point intensive back-projection and filtering tasks from host CPU. Use Value: On-chip 16.4 Mb block RAM eliminates external memory bottlenecks during multi-frame voxel accumulation. |
| Avionics Data Concentrators | Industrial Protocol Gateways |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX network aggregation in flight control systems. IC Role / Device Role / Timing Role: Deterministic packet routing and protocol translation engine with sub-microsecond latency. Use Value: 364 user I/Os and 24 transceiver lanes support simultaneous multi-protocol interface handling without external glue logic. | Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in smart factory PLC backplanes. IC Role / Device Role / Timing Role: Reconfigurable protocol stack executor with real-time scheduling and cyclic redundancy checking. Use Value: Partial reconfiguration allows field-upgradable protocol firmware while maintaining operational continuity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; higher logic density (2,586K LC), 100G Ethernet support, but larger FGA2104 package | Targets next-gen 5G baseband and AI inference where bandwidth exceeds Virtex-6 capabilities | Choose for new designs requiring >10 Gb/s serial I/O or PCIe Gen4; not drop-in compatible |
| XC6SLX150-3FGG484C | Spartan-6 family; lower logic count (147K LC), no multi-gigabit transceivers, commercial temp range only | Suitable for cost-sensitive industrial I/O consolidation where high-speed serial links are unnecessary | Choose for legacy migration paths or non-serial applications needing lower power and cost |
Compared with XC6VLX130T-1FFG484I, the XCVU9P offers significantly higher throughput and newer protocol support but demands PCB redesign and toolchain upgrade, while the XC6SLX150 trades transceivers and density for cost and simplicity in less demanding roles.
Availability
XC6VLX130T-1FFG484I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX130T-1FFG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-6 family was designed for high-performance reconfigurable computing in aerospace, defense, and wired infrastructure applications where deterministic latency and protocol flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-1FFG484I?
The XC6VLX130T-1FFG484I supports transceiver line rates up to 6.6 Gb/s per lane. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA II (3.0 Gb/s), and SRIO Gen2 (5.0 Gb/s) standards. The actual achievable rate depends on board layout quality, reference clock stability, and signal integrity margin measured per UG371.
Does XC6VLX130T-1FFG484I support DDR3 memory interfaces?
Yes, XC6VLX130T-1FFG484I includes dedicated DDR3 PHY logic supporting data rates up to 800 Mbps (400 MHz clock) across 8- or 16-bit interfaces. It provides DQS gating, write leveling, and read-leveling calibration sequences per Xilinx UG388, enabling reliable operation with industrial-grade DDR3 components.
What configuration modes are supported by XC6VLX130T-1FFG484I?
XC6VLX130T-1FFG484I supports JTAG, Master SPI, Slave SPI, and Slave SelectMAP configuration modes. JTAG is used for debugging and programming; SPI modes interface with serial flash; SelectMAP allows microprocessor-controlled partial or full reconfiguration. Mode selection is determined by M[2:0] pin states at power-up.
Is XC6VLX130T-1FFG484I qualified for industrial temperature operation?
Yes, the "I" suffix in XC6VLX130T-1FFG484I denotes industrial temperature grade (-40°C to +100°C). This qualification covers all logic, I/O, and transceiver functions under specified voltage and derating conditions per Xilinx DS152, making it suitable for enclosed industrial enclosures and outdoor telecom deployments.
Can XC6VLX130T-1FFG484I perform partial reconfiguration?
Yes, XC6VLX130T-1FFG484I supports partial reconfiguration through its ICAP interface and frame-based bitstream loading. This allows dynamic replacement of functional modules-such as protocol engines or filter banks-without resetting the entire device, preserving state in active logic regions during runtime updates.
XC6VLX130T-1FFG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX130T-1FFG484I FAQ
1.How can I place an order for XC6VLX130T-1FFG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-1FFG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC6VLX130T-1FFG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-1FFG484I is usually 5 days.
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5.How can I obtain technical support or documentation for XC6VLX130T-1FFG484I?
For technical support, including XC6VLX130T-1FFG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-1FFG484I requirements.
6.How does Aetrix verify that XC6VLX130T-1FFG484I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-1FFG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-1FFG484I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-1FFG484I?
All XC6VLX130T-1FFG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-1FFG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-1FFG484I part is unused and in its original packaging.
Return procedure for XC6VLX130T-1FFG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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