AMD XC6VLX130T-1FFG784C

Overview

XC6VLX130T-1FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 128,000 logic cells, 13.2 Mb of block RAM, 640 DSP48E1 slices, and 528 user I/Os in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It targets high-performance serial connectivity and signal processing in wired infrastructure and radar systems.

For engineers reviewing the XC6VLX130T-1FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, and -1 speed grade timing performance under industrial temperature range.

Technical Context

The XC6VLX130T-1FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated multi-gigabit transceivers (MGTs). It supports PCIe Gen1/Gen2, SRIO, and 10G Ethernet protocols via its 24 MGT lanes.

Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption and SEU mitigation features enabled. The device operates across -40°C to +100°C (industrial grade) and supports dual-supply operation: 1.0 V core, 1.2–2.5 V auxiliary, and 1.2–3.3 V I/O banks.

Key Specifications

Pinout & Package

XC6VLX130T-1FFG784C is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid. Pinout includes dedicated configuration, clock, JTAG, and transceiver differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX130T-1FFG784C, the XCVU9P offers scalable bandwidth and logic for future-proofing, while the XC7VX690T trades native protocol blocks for greater raw resources and efficiency-both require PCB redesign due to different packages and I/O mapping.

Availability

XC6VLX130T-1FFG784C is available at Aetrix Electronics and suitable for wireless infrastructure, radar systems, and industrial imaging applications requiring stable component supply over extended production lifecycles.

Supply support for XC6VLX130T-1FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI processors for data center, edge, and embedded markets.

The Virtex-6 family was designed for high-performance serial connectivity and signal processing in wired communications, aerospace, and defense systems where deterministic timing and protocol offload are critical.

FAQ

What is the maximum transceiver line rate supported by XC6VLX130T-1FFG784C?

The XC6VLX130T-1FFG784C supports a maximum transceiver line rate of 6.6 Gb/s per lane. This capability enables compliance with PCIe Gen2, Serial RapidIO 2.1, and 10GBASE-R Ethernet standards. All 24 MGT lanes are rated for this speed under industrial temperature conditions and -1 speed grade specifications. The transceivers include built-in clock data recovery and elastic buffers to manage jitter and latency variation.

Does XC6VLX130T-1FFG784C include hard IP for PCI Express?

Yes, XC6VLX130T-1FFG784C integrates a hard PCIe endpoint block supporting Gen1 and Gen2 protocols across x1, x2, x4, and x8 link widths. This dedicated block handles physical layer, data link layer, and transaction layer functions, reducing FPGA resource usage and simplifying certification. The hard IP eliminates the need for soft-core implementations and ensures deterministic latency for real-time applications such as radar and test equipment.

What I/O standards are supported by XC6VLX130T-1FFG784C?

XC6VLX130T-1FFG784C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, Mini-LVDS, RSDS, BLVDS, and TMDS across its 16 independently powered I/O banks. Each bank can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. This flexibility allows direct interfacing with DDR2/DDR3 memory, image sensors, and high-speed serial links without level-shifting components.

Is XC6VLX130T-1FFG784C qualified for industrial temperature operation?

Yes, XC6VLX130T-1FFG784C is rated for industrial temperature operation from -40°C to +100°C. This qualification applies to the -1 speed grade in the FFG784 package and is verified per Xilinx's industrial-grade reliability testing standards. The device includes on-die thermal monitoring and supports dynamic thermal throttling through the System Monitor interface, making it suitable for fanless enclosures and outdoor deployments.

How many block RAM bits does XC6VLX130T-1FFG784C provide?

XC6VLX130T-1FFG784C provides 13.2 Mb of total block RAM capacity, distributed across 1,536 BRAM primitives (each 36 Kb). These resources support true dual-port operation, byte-write enable, and programmable pipeline registers. In practice, this enables large on-chip buffers-for example, storing 128 full frames of 12-bit 1920×1080 video at 60 fps-without external memory access, reducing latency and power consumption.