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AMD XC6VLX130T-1FFG784I
- Part No.:
- XC6VLX130T-1FFG784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-1FFG784I.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,904
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Product details
Overview
XC6VLX130T-1FFG784I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of total block RAM. It supports PCIe Gen2 x8, DDR3-800 memory interfaces, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing systems requiring deterministic latency and multi-gigabit serial connectivity.
For engineers reviewing the XC6VLX130T-1FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (528 user I/Os), transceiver line rate (6.6 Gb/s), configuration interface (SPI/BPI), and thermal design power (14.2 W typical).
Technical Context
The XC6VLX130T-1FFG784I implements a hierarchical FPGA architecture with CLBs, distributed RAM, shift registers, and dedicated carry logic. It integrates 24 GTX transceivers supporting protocols including CPRI, SATA, and SRIO, each configurable for 600 Mb/s to 6.6 Gb/s operation.
Configuration is performed via Master SelectMAP or Slave Serial mode using external SPI flash or PROM. The device includes internal voltage regulation monitoring, JTAG boundary-scan, and partial reconfiguration support for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 × DSP48E1 - enables parallel multiply-accumulate operations up to 475 MHz |
| Block RAM | 16.4 Mb - supports large on-chip data buffering and FIFOs without external memory |
| User I/O Pins | 528 - provides high-density parallel interface capability with bank-selectable voltage standards |
| GTX Transceivers | 24 × 6.6 Gb/s - delivers multi-protocol serial connectivity for backplane and optical links |
| Speed Grade | -1 - guarantees timing closure at specified operating conditions with defined setup/hold margins |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
Pinout & Package
XC6VLX130T-1FFG784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 array, 1.0 mm ball pitch, and 35 mm × 35 mm body size. Thermal pad on underside requires solder paste stencil design per Xilinx UG373.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SelectMAP or Slave Serial mode |
| DIN | Configuration Data Input | Serial data input for configuration bitstream loading from external PROM or processor |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| M0–M2 | Mode Selection Inputs | Three-pin encoding selects among six configuration modes including JTAG, BPI, and SPI |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping in runtime without full FPGA reconfiguration or system interruption |
| Integrated PCIe Endpoint Block | Hard IP supporting Gen2 x8 root port or endpoint operation without soft-core overhead |
| DDR3 Memory Controller | Hard macro supporting 800 Mb/s data rate with calibration and error correction logic |
| Multi-Voltage I/O Banks | 14 independent banks support mixed-interface designs with LVCMOS, SSTL, HSTL, and differential standards |
| Embedded MicroBlaze Processor | Soft 32-bit RISC core available for control-plane tasks alongside programmable logic |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical filtering, FFT, and CFAR algorithms with deterministic latency. Use Value: 128K logic cells and 1.2K DSP slices enable concurrent multi-channel processing at 100+ MSPS sample rates. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Interfaces with ADCs, manages DDR3 frame buffers, and runs iterative reconstruction kernels. Use Value: 16.4 Mb block RAM eliminates external memory bottlenecks for 512×512 pixel matrix operations. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation in flight control systems. IC Role / Device Role / Timing Role: Implements protocol bridging, timestamping, and deterministic packet scheduling. Use Value: 528 user I/Os and multi-voltage banks allow simultaneous interfacing to legacy and modern avionics buses. | Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and CPRI links. IC Role / Device Role / Timing Role: Generates and analyzes high-speed serial patterns using GTX transceivers. Use Value: 24 GTX transceivers operating at 6.6 Gb/s support dual-port loopback and jitter tolerance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 522K logic cells, higher transceiver count (48 × 16.3 Gb/s), but larger package and higher power | Better suited for next-generation 5G baseband and AI inference acceleration | Select when migrating from Virtex-6 for higher throughput and lower latency, accepting increased PCB complexity |
| XC7VX485T-2FFG1157I | Virtex-7 architecture, 485K logic cells, 36 GTX transceivers, same industrial temp rating, but different pinout and configuration scheme | Offers improved DSP density and DDR4 support while retaining similar board-level integration effort | Choose for drop-in replacement where layout reuse is prioritized over maximum performance uplift |
Compared with XC6VLX130T-1FFG784I, the XC7VX485T-2FFG1157I delivers 3.8× more logic and DDR4 readiness with moderate board redesign, while the XCVU3P-2FFVD1760I enables 10× higher serial bandwidth at significantly higher cost and thermal management requirements.
Availability
XC6VLX130T-1FFG784I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-performance computing and adaptive hardware applications.
The Virtex-6 family was designed for demanding signal processing, wired communications, and aerospace systems requiring deterministic timing, high I/O bandwidth, and industrial-grade reliability.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX130T-1FFG784I?
The XC6VLX130T-1FFG784I supports DDR3-800 (400 MHz clock, 800 Mb/s data rate) using its hard memory controller. This is verified in Xilinx UG373 and validated across industrial temperature range. The controller includes write leveling, read leveling, and gate training for robust operation. XC6VLX130T-1FFG784I does not support DDR3L or DDR4 interfaces.
Does XC6VLX130T-1FFG784I support partial reconfiguration?
Yes, XC6VLX130T-1FFG784I supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This allows dynamic swapping of functional modules without resetting the entire device. Implementation requires Vivado Design Suite 2018.3 or earlier (ISE 14.7 compatible flow). XC6VLX130T-1FFG784I must be configured in Master SelectMAP mode for PR support.
What configuration modes are supported by XC6VLX130T-1FFG784I?
XC6VLX130T-1FFG784I supports six configuration modes selected via M0–M2 pins: Master SelectMAP, Slave SelectMAP, Master Serial, Slave Serial, Boundary Scan (JTAG), and Bus Width Mode. Each mode defines how configuration data is loaded-either from SPI flash, microprocessor, or JTAG debugger. XC6VLX130T-1FFG784I requires external pull-up/pull-down resistors on mode pins per UG373 recommendations.
What is the thermal design power (TDP) of XC6VLX130T-1FFG784I?
The typical thermal design power of XC6VLX130T-1FFG784I is 14.2 W under worst-case switching activity at -1 speed grade and industrial temperature. Power estimation requires Xilinx XPE tool with accurate toggle rates and I/O standards. XC6VLX130T-1FFG784I uses a thermal pad in the FFG784 package requiring 6×6 mm copper pour and thermal vias for effective heat dissipation.
Is XC6VLX130T-1FFG784I qualified for automotive applications?
No, XC6VLX130T-1FFG784I is rated for industrial temperature (-40°C to +100°C) but is not AEC-Q100 qualified. It lacks automotive-specific screening, failure reporting, and qualification documentation. For automotive use, AMD recommends the XA-Virtex-6 family variants. XC6VLX130T-1FFG784I remains suitable for industrial control, defense, and medical systems meeting IEC 60601 or DO-254 requirements.
XC6VLX130T-1FFG784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-1FFG784I FAQ
1.How can I place an order for XC6VLX130T-1FFG784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-1FFG784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-1FFG784I reliable?
The price and inventory of XC6VLX130T-1FFG784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-1FFG784I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-1FFG784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-1FFG784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-1FFG784I?
XC6VLX130T-1FFG784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-1FFG784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-1FFG784I?
For technical support, including XC6VLX130T-1FFG784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-1FFG784I requirements.
6.How does Aetrix verify that XC6VLX130T-1FFG784I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-1FFG784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-1FFG784I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-1FFG784I?
All XC6VLX130T-1FFG784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-1FFG784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-1FFG784I part is unused and in its original packaging.
Return procedure for XC6VLX130T-1FFG784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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