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AMD XC6VLX130T-2FF1156C

Part No.:
XC6VLX130T-2FF1156C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VLX130T-2FF1156C.pdf
Description:
IC FPGA 600 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,015

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Product details

Overview

XC6VLX130T-2FF1156C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of block RAM. It supports DDR3 memory interfaces up to 800 MHz and operates at -2 speed grade with 1.0 V core voltage. It is used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC6VLX130T-2FF1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (600 user I/Os), transceiver capability (24 GTP serial transceivers), thermal performance (FF1156 package), and configuration interface options (JTAG, SelectMAP, SPI).

Technical Context

The XC6VLX130T-2FF1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates hardened IP including PCI Express® Gen1 x4 endpoint, tri-mode Ethernet MACs, and clock management tiles with DCMs and PLLs.

It supports multi-voltage I/O banks (1.2 V to 3.3 V), LVDS, SSTL, HSTL, and differential signaling standards. Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption and SEU mitigation features enabled.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells128,000 - determines maximum combinational/sequential logic capacity for RTL implementation
DSP Slices1,200 DSP48E1 - enables parallel multiply-accumulate operations at up to 550 MHz
Block RAM16.4 Mb - supports large on-chip data buffering and FIFOs without external memory
User I/Os600 - provides flexible board-level connectivity across multiple voltage domains and standards
Transceivers24 GTP (3.2 Gbps) - delivers serial links for camera interfaces, JESD204B, or custom protocols
Speed Grade-2 - guarantees timing closure at 1.0 V core supply with specified temperature range (0°C to 85°C)
PackageFF1156 - 1156-pin flip-chip BGA, 35 × 35 mm, 1.0 mm pitch, with thermal lid for industrial cooling

Pinout & Package

XC6VLX130T-2FF1156C is housed in a 1156-pin flip-chip BGA (FF1156) package with thermal lid, designed for industrial thermal management and high-density PCB routing. Pin functions are organized into I/O banks, configuration pins, power/ground, clock inputs, and transceiver lanes.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration clock inputDrives internal configuration logic during Master SelectMAP or JTAG programming
DINConfiguration data inputSerial data path for bitstream loading in Master SelectMAP mode
INIT_BConfiguration status outputActive-low open-drain signal indicating configuration status and error detection
PROGRAM_BConfiguration reset inputAsynchronous active-low signal to initiate reconfiguration sequence
M0–M2Mode select inputsDefine configuration mode (JTAG, Slave Serial, Master SelectMAP, etc.) at power-up
VRN/VRPDifferential reference pairProvides internal termination reference for differential I/O standards like LVDS

Key Features

FeatureDesign Value
PCIe Gen1 x4 EndpointHardened IP block enabling plug-and-play host communication without soft-core overhead
Tri-Mode Ethernet MACConfigurable 10/100/1000 Mbps MAC supporting IEEE 802.3 with GMII/RGMII/MII interfaces
DCM + PLL Clock ManagementMultiple independent clock synthesis paths with jitter filtering and phase alignment
SEU Detection & CorrectionOn-the-fly single-event upset correction using built-in EDAC for configuration memory
Bitstream EncryptionAES-256 encryption with battery-backed key storage prevents unauthorized configuration access

Applications

Radar Signal ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: Reconfigurable compute fabric executing FFT, CFAR, and matrix inversion kernels with deterministic latency.

Use Value: 128K logic cells and 1.2K DSP slices enable >10 GOPS sustained throughput at 200 MHz system clock.

Use Scenario: High-speed image reconstruction in CT and MRI scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Co-processor offloading reconstruction pipelines from host CPU while managing DDR3 memory bandwidth.

Use Value: 16.4 Mb block RAM reduces external memory round-trips, cutting reconstruction latency by ~35%.

Avionics Data ConcentratorsHigh-Speed Test Equipment

Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control systems.

IC Role / Device Role / Timing Role: Protocol-aware packet routing engine with time-triggered scheduling and CRC validation.

Use Value: 600 user I/Os support concurrent multi-protocol physical layer interfacing without glue logic.

Use Scenario: Pattern generation and response analysis in automated test equipment for SoC validation.

IC Role / Device Role / Timing Role: High-fidelity stimulus generator with sub-nanosecond timing resolution via dedicated clock networks.

Use Value: GTP transceivers deliver 3.2 Gbps serial stimulus streams synchronized to internal PLL-controlled clocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end reconfigurable logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture, 2588K logic cells, 60 URAM blocks, no GTP (uses GTY transceivers)Higher bandwidth, PCIe Gen3 x16, DDR4 support - suited for next-gen AI inference accelerationSelect when migrating to higher density, wider memory bus, or Gen3+ serial protocols
XC7VX690T-2FFG1927IVirtex-7 architecture, 693,120 logic cells, 3,600 DSP48E1, 48 GTX transceivers (6.6 Gbps)Enhanced transceiver speed and DSP count - preferred for 10G Ethernet and real-time spectrum analysisChoose for improved serial bandwidth and arithmetic throughput where -2FF1156C reaches resource limits

Compared with XC6VLX130T-2FF1156C, the XC7VX690T offers higher transceiver speed and DSP density for bandwidth-constrained applications, while the XCVU9P delivers architectural scalability for future-proofing beyond Virtex-6's 40 nm node limitations.

Availability

XC6VLX130T-2FF1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX130T-2FF1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.

The Virtex-6 family was engineered for high-performance, low-power reconfigurable systems in aerospace, defense, and medical imaging - emphasizing deterministic timing, radiation tolerance, and long-term obsolescence management.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6VLX130T-2FF1156C?

The XC6VLX130T-2FF1156C supports DDR3 memory interfaces up to 800 MHz data rate (400 MHz clock frequency) using its dedicated memory controller IP and I/O banks configured for SSTL15. This speed is validated under industrial temperature conditions with appropriate PCB layout and termination.

Does XC6VLX130T-2FF1156C include built-in PCIe Gen1 endpoint functionality?

Yes, XC6VLX130T-2FF1156C integrates a hardened PCI Express Gen1 x4 endpoint block compliant with PCI-SIG specifications. It requires no additional soft logic resources and supports standard enumeration, configuration space access, and DMA transfers out-of-the-box.

What configuration modes does XC6VLX130T-2FF1156C support?

XC6VLX130T-2FF1156C supports multiple configuration modes including Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM (SPI). Mode selection is controlled by M0–M2 pins at power-up, and all modes are fully documented in UG364.

Is XC6VLX130T-2FF1156C qualified for industrial temperature operation?

Yes, the 'C' suffix in XC6VLX130T-2FF1156C denotes commercial temperature grade (0°C to +85°C), and it is rated for continuous operation within that range. Thermal design must account for the FF1156 package's power dissipation profile and recommended heatsink interface.

How many GTP transceivers are available on XC6VLX130T-2FF1156C?

XC6VLX130T-2FF1156C includes 24 GTP transceivers, each capable of serial data rates from 100 Mbps to 3.2 Gbps. These support protocols including CPRI, Aurora, and custom high-speed links, with programmable pre-emphasis and receiver equalization.

XC6VLX130T-2FF1156C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10000
Number of Logic Elements/Cells:
128000
Total RAM Bits:
9732096
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VLX130T-2FF1156C FAQ

1.How can I place an order for XC6VLX130T-2FF1156C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FF1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX130T-2FF1156C reliable?

The price and inventory of XC6VLX130T-2FF1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FF1156C is usually 5 days.

3.What payment methods are accepted for XC6VLX130T-2FF1156C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FF1156C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX130T-2FF1156C?

XC6VLX130T-2FF1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX130T-2FF1156C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX130T-2FF1156C?

For technical support, including XC6VLX130T-2FF1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FF1156C requirements.

6.How does Aetrix verify that XC6VLX130T-2FF1156C is sourced from the original manufacturer or authorized distributors?

All XC6VLX130T-2FF1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FF1156C meets industry standards.

7.What is the process for return or replacement of XC6VLX130T-2FF1156C?

All XC6VLX130T-2FF1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FF1156C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX130T-2FF1156C part is unused and in its original packaging.

Return procedure for XC6VLX130T-2FF1156C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX130T-2FF1156C Tags

  • XC6VLX130T-2FF1156C
  • XC6VLX130T-2FF1156C PDF
  • XC6VLX130T-2FF1156C Datasheet
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  • XC6VLX130T-2FF1156C Images
  • AMD
  • AMD XC6VLX130T-2FF1156C
  • Buy XC6VLX130T-2FF1156C
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