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AMD XC6VLX130T-2FF1156I
- Part No.:
- XC6VLX130T-2FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-2FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,947
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Product details
Overview
XC6VLX130T-2FF1156I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of block RAM. It supports transceiver data rates up to 6.6 Gb/s and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in high-performance digital signal processing for radar beamforming systems.
For engineers reviewing the XC6VLX130T-2FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600), transceiver capability (32 lanes), LVDS support, and thermal performance in sealed enclosure deployments.
Technical Context
The XC6VLX130T-2FF1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated multi-gigabit transceivers (MGTs). It includes SelectIO technology supporting 1.2–3.3 V I/O standards including LVCMOS, SSTL, and HSTL.
Configuration is performed via JTAG or master/slave serial mode using external SPI flash. The device supports partial reconfiguration and built-in system monitor functionality for on-chip temperature and supply voltage measurement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for complex control and datapath implementation |
| DSP Slices | 1,200 × DSP48E1 - enables parallel multiply-accumulate operations for real-time filtering and FFT acceleration |
| Block RAM | 16.4 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external SRAM |
| Transceivers | 32 × 6.6 Gb/s - supports multi-lane JESD204B links for high-speed ADC/DAC interfacing |
| I/O Pins | 600 - enables dense peripheral connectivity including DDR3 memory interfaces and sensor buses |
| Speed Grade | -2 - guarantees timing closure at 600 MHz internal clocking with worst-case industrial temperature derating |
| Operating Temp | -40°C to +100°C - qualified for conduction-cooled avionics and downhole industrial equipment |
Pinout & Package
XC6VLX130T-2FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for CLBs, DSP, and routing fabric; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, SelectIO, and transceiver reference circuits |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| MGTAVCC | Transceiver analog supply | 1.0 V supply for PLLs and serializers/deserializers; sensitive to ripple & noise |
| CLK_IN | Dedicated clock input | Single-ended or differential input supporting 10–1000 MHz clocks for global clock distribution |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset-critical for adaptive radio and real-time protocol switching |
| Integrated System Monitor | On-chip ADC measures die temperature and supply voltages; eliminates external monitoring ICs in space-constrained designs |
| JESD204B Support | Native PHY-level compliance with subclass 0/1 for deterministic latency ADC/DAC synchronization in software-defined radios |
| SelectIO Technology | Per-bank I/O voltage control and programmable slew rate enable robust signal integrity across mixed-standard interfaces |
| PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4 lane configurations-reduces FPGA resource usage and simplifies host interface development |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical correlation, filtering, and FFT kernels; transceivers interface with RF sampling ADCs. Use Value: 32 × 6.6 Gb/s transceivers enable direct JESD204B capture from 12-bit, 2.5 GSPS ADCs without serialization bottlenecks. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Accelerates back-projection and iterative reconstruction algorithms while managing DDR3 memory bandwidth. Use Value: 128,000 logic cells and 16.4 Mb block RAM support concurrent multi-slice processing with sub-millisecond latency. |
| Avionics Data Concentrator | Industrial Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Implements multiple protocol engines and deterministic time-triggered scheduling logic. Use Value: Industrial temperature rating (-40°C to +100°C) and configuration scrubbing ensure reliability in unventilated avionics enclosures. | Use Scenario: High-precision waveform generation and analysis in automated test equipment (ATE). IC Role / Device Role / Timing Role: Generates synchronized multi-channel stimuli and captures response data with picosecond timestamping. Use Value: 600 I/O pins and LVDS support allow simultaneous connection to 48+ DUT channels with matched trace lengths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; higher logic density (2,586K LC), 16.3 Gb/s transceivers, but larger package and higher power | Better suited for next-generation 5G baseband and AI inference acceleration where bandwidth exceeds Virtex-6 limits | Choose XC6VLX130T-2FF1156I when legacy IP reuse, lower static power, or existing PCB footprint constraints apply |
| XC7VX690T-2FFG1927I | Virtex-7 generation; 690K logic cells, 13.1 Gb/s transceivers, improved DSP efficiency, but no native PCIe Gen2 hard IP | Preferred for migration paths requiring higher throughput with backward-compatible toolchain support | XC6VLX130T-2FF1156I remains optimal for cost-sensitive, thermally constrained deployments where Gen2 PCIe endpoint is required |
Compared with XCVU9P-2FLGA2104I and XC7VX690T-2FFG1927I, the XC6VLX130T-2FF1156I offers balanced transceiver count, proven radiation-tolerant configuration architecture, and lower thermal design power-making it preferred for deployed systems requiring long-term stability over raw bandwidth scaling.
Availability
XC6VLX130T-2FF1156I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and industrial test equipment requiring stable component supply and long lifecycle support.
Supply support for XC6VLX130T-2FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance compute and signal processing.
The Virtex-6 family was designed for demanding high-speed serial connectivity, DSP-intensive workloads, and deterministic real-time systems in aerospace, defense, and medical imaging.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-2FF1156I?
The XC6VLX130T-2FF1156I supports transceiver data rates up to 6.6 Gb/s per lane. This is verified in the Virtex-6 FPGA GTX Transceiver User Guide (UG366 v1.12), which specifies the -2 speed grade's guaranteed operation across the full industrial temperature range. The XC6VLX130T-2FF1156I implements GTX transceivers compliant with protocols including SATA, PCI Express Gen2, and CPRI.
Does XC6VLX130T-2FF1156I include hard IP for PCI Express?
Yes, the XC6VLX130T-2FF1156I integrates a hard PCIe Gen2 endpoint block supporting x1, x2, and x4 configurations. This reduces logic utilization and simplifies timing closure compared to soft-core implementations. The XC6VLX130T-2FF1156I's PCIe IP is documented in UG371 and validated for endpoint use in embedded host systems.
What I/O standards are supported by XC6VLX130T-2FF1156I?
The XC6VLX130T-2FF1156I supports 21 I/O standards via SelectIO technology, including LVCMOS, SSTL, HSTL, and differential standards such as LVDS, BLVDS, and RSDS. Each I/O bank is independently configurable for voltage (1.2–3.3 V) and termination, enabling mixed-standard interfaces on a single device. This capability is confirmed in the Virtex-6 FPGA Packaging and Pinout Product Specification (DS152).
Is XC6VLX130T-2FF1156I qualified for industrial temperature operation?
Yes, the XC6VLX130T-2FF1156I is rated for industrial temperature operation from -40°C to +100°C. This qualification is specified in the device's ordering information and confirmed in the Virtex-6 DC and Switching Characteristics datasheet (DS151). The XC6VLX130T-2FF1156I undergoes extended temperature screening and is commonly used in sealed avionics and downhole instrumentation.
Can XC6VLX130T-2FF1156I perform partial reconfiguration?
Yes, the XC6VLX130T-2FF1156I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This allows dynamic replacement of logic modules without resetting the entire device-a capability used in adaptive communications and real-time protocol switching. Documentation is provided in UG702 and validated in Xilinx reference designs for software-defined radio.
XC6VLX130T-2FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-2FF1156I FAQ
1.How can I place an order for XC6VLX130T-2FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FF1156I reliable?
The price and inventory of XC6VLX130T-2FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FF1156I?
XC6VLX130T-2FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FF1156I?
For technical support, including XC6VLX130T-2FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FF1156I requirements.
6.How does Aetrix verify that XC6VLX130T-2FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FF1156I?
All XC6VLX130T-2FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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