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AMD XC6VLX130T-2FF784I
- Part No.:
- XC6VLX130T-2FF784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-2FF784I.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,391
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Product details
Overview
XC6VLX130T-2FF784I from AMD (formerly Xilinx) is a high-performance 40 nm FPGA featuring 128,000 logic cells, 12.5 Gb/s transceiver capability, and integrated Block RAM totaling 6,912 kbits. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VLX130T-2FF784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), total DSP48E1 slices (640), and configuration interface options (SPI/BPI).
Technical Context
The XC6VLX130T-2FF784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. Its clock management includes dual MMCMs and PLLs per I/O bank.
Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces with fallback support. The device supports partial reconfiguration and uses 2.5 V configuration voltage with internal VCCAUX regulation at 1.8 V and 1.2 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 6,912 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory |
| DSP Slices | 640 DSP48E1 - enables high-speed multiply-accumulate operations for signal processing pipelines |
| Transceiver Lanes | 24 lanes @ 12.5 Gb/s - supports multi-protocol serial connectivity including PCIe Gen2 x8 and 10G Ethernet |
| I/O Pins | 400 user I/Os - configurable across 12 I/O banks with independent voltage support per bank |
| Speed Grade | -2 - guarantees timing closure at specified operating conditions with defined setup/hold margins |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
Pinout & Package
XC6VLX130T-2FF784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FF784) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0 V) for CLB, block RAM, and interconnect logic |
| K17 | VCCAUX | Auxiliary supply (1.8 V) for configuration, clocking, and transceiver reference circuits |
| M15 | VCCO_0 | I/O bank 0 output driver supply (1.2–3.3 V selectable) defining signal swing and termination |
| T14 | INIT_B | Open-drain active-low configuration status indicator; asserts during bitstream loading |
| R15 | CCLK | Configuration clock input for Master SelectMAP mode; drives internal configuration logic |
| P16 | DONE | Open-drain active-high configuration completion signal; released after CRC check passes |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Gigabit Transceivers | 24 lanes with built-in 8B/10B encoding, RX buffer realignment, and elastic buffer for protocol alignment |
| DSP48E1 Slices | 640 fully pipelined units supporting 25×18 signed multiplication, pre-adder, and cascade chaining |
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset or system interruption |
| PCIe Gen2 Endpoint Support | Integrated hard IP for endpoint functionality up to x8 width with AXI4 streaming interface |
| Configurable I/O Standards | Supports LVCMOS, SSTL, HSTL, differential LVDS, and TMDS across 12 independent voltage banks |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in LTE-A and 5G NR remote radio heads. IC Role / Device Role / Timing Role: Programmable baseband processor implementing PHY-layer algorithms with deterministic latency. Use Value: 640 DSP48E1 slices enable concurrent FFT/IFFT and filter operations; 24 transceiver lanes handle CPRI/eCPRI fronthaul links. | Use Scenario: High-precision signal generation and analysis in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: Reconfigurable pattern generator and acquisition engine synchronized to sub-nanosecond clocks. Use Value: -2 speed grade ensures timing margin for 12.5 Gb/s serial capture; 400 user I/Os support parallel DUT interfacing. |
| Avionics Data Concentrators | Industrial Vision Systems |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic packet switching fabric with time-triggered scheduling and redundancy management. Use Value: Industrial temperature rating (-40°C to +100°C) ensures operation in uncontrolled avionics bays; dual MMCMs provide jitter-clean clocks for AFDX MAC timing. | Use Scenario: Real-time image preprocessing and feature extraction in smart cameras for robotic guidance. IC Role / Device Role / Timing Role: Pixel pipeline accelerator with line buffers, color space conversion, and edge detection kernels. Use Value: 6,912 kbits of Block RAM stores multiple lines of HD image data; LVDS I/O supports high-speed CMOS image sensor interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-2FF1156I | Higher logic density (240K LC), 36 transceiver lanes, larger FF1156 package (40 mm × 40 mm) | Required when >128K logic cells or >24 transceivers needed; not pin-compatible | Select only if design requires additional resources beyond XC6VLX130T-2FF784I capacity |
| XCKU060-2FFVA1156I | UltraScale architecture, 1.0 V core, 32 GTY transceivers @ 16.3 Gb/s, different pinout and configuration flow | Offers higher bandwidth and lower power but requires RTL and PCB redesign | Consider for new designs targeting longer lifecycle and higher serial performance; not a drop-in replacement |
Compared with XC6VLX240T-2FF1156I and XCKU060-2FFVA1156I, the XC6VLX130T-2FF784I delivers optimal balance of transceiver count, logic density, and industrial temperature support in a compact 784-ball footprint-making it suitable for space-constrained, high-reliability applications where migration to newer families is not required.
Availability
XC6VLX130T-2FF784I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and industrial vision systems requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-2FF784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance computing and embedded applications.
The Virtex-6 family-including XC6VLX130T-2FF784I-was designed for demanding serial connectivity, signal processing, and deterministic real-time control in infrastructure and defense systems.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-2FF784I?
The XC6VLX130T-2FF784I supports transceiver data rates up to 12.5 Gb/s per lane. This is verified in the Virtex-6 FPGA GTX Transceiver User Guide (UG366), which specifies operation from 600 Mb/s to 12.5 Gb/s with built-in clock data recovery and equalization. The XC6VLX130T-2FF784I implements 24 GTX transceivers meeting this specification.
Does XC6VLX130T-2FF784I support partial reconfiguration?
Yes, the XC6VLX130T-2FF784I supports partial reconfiguration through its configuration port and dedicated ICAP (Internal Configuration Access Port). This allows dynamic modification of specific logic regions while the rest of the design remains operational. Implementation requires Vivado Design Suite 2019.2 or earlier toolflow compatibility with Virtex-6 devices.
What configuration modes are supported by XC6VLX130T-2FF784I?
The XC6VLX130T-2FF784I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. It also includes fallback configuration capability and supports dual configuration images stored in external flash. Configuration voltage is fixed at 2.5 V for the CONFIG_VOLTAGE pin.
Is XC6VLX130T-2FF784I qualified for industrial temperature operation?
Yes, the XC6VLX130T-2FF784I is rated for industrial temperature operation from -40°C to +100°C. This is confirmed in the Virtex-6 FPGA Data Sheet: DC and Switching Characteristics (DS152), where the "I" suffix explicitly denotes industrial temperature grade with full electrical specifications guaranteed across that range.
How many DSP48E1 slices does XC6VLX130T-2FF784I contain?
The XC6VLX130T-2FF784I contains 640 DSP48E1 slices. Each slice provides 25×18-bit signed multiplication, a 48-bit accumulator, and pre-adder capability. This count is documented in Table 1 of the Virtex-6 FPGA Overview (DS150) and is consistent across all LX130T variants regardless of speed grade or package.
XC6VLX130T-2FF784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-2FF784I FAQ
1.How can I place an order for XC6VLX130T-2FF784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FF784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FF784I reliable?
The price and inventory of XC6VLX130T-2FF784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FF784I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FF784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FF784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FF784I?
XC6VLX130T-2FF784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FF784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FF784I?
For technical support, including XC6VLX130T-2FF784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FF784I requirements.
6.How does Aetrix verify that XC6VLX130T-2FF784I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FF784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FF784I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FF784I?
All XC6VLX130T-2FF784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FF784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FF784I part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FF784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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