AMD XC6VLX130T-2FFG1156C
- Part No.:
- XC6VLX130T-2FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-2FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX130T-2FFG1156C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,248 DSP48E1 slices, and 16.4 Mb of total block RAM. It supports DDR3 memory interfaces up to 800 MHz and delivers 24.5 GMACs of signal processing throughput. This device is deployed in high-performance digital signal processing systems such as radar beamforming and real-time video encoding.
For engineers reviewing the XC6VLX130T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600 user I/Os), speed grade (-2), package type (FFG1156), and transceiver capability (24 × 6.6 Gb/s GTP).
Technical Context
The XC6VLX130T-2FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates 24 GTP serial transceivers supporting protocols including PCIe Gen2, SATA, and Serial RapidIO.
This device uses 40 nm bulk CMOS process technology and operates at core voltage of 1.0 V ±3%. Its -2 speed grade guarantees timing closure for designs running at maximum system clock frequencies up to 500 MHz in critical paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 1,248 × DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 16.4 Mb - supports large on-chip data buffering and coefficient storage without external memory |
| User I/Os | 600 - provides high-density interface connectivity to ADCs, DACs, memory, and FMC mezzanine cards |
| GTP Transceivers | 24 × 6.6 Gb/s - enables multi-lane serial links for camera sensor aggregation and backplane interconnect |
| Speed Grade | -2 - guarantees timing closure for designs targeting 500 MHz system clocks in worst-case conditions |
| Package | FFG1156 - 1156-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC6VLX130T-2FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and 35 × 35 mm body size. The package supports thermal vias and power/ground ball patterns compliant with Xilinx PCB design guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% power domain for CLBs, DSP slices, and routing fabric |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, clock management, and SelectIO banks |
| VCCO | I/O supply | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| MR | Master reset | Asynchronous global reset input that clears configuration memory and logic states |
| CCLK | Configuration clock | Input clock for slave-serial and JTAG configuration modes |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness and error detection |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | 16 × DCM and 8 × PLL blocks provide jitter-reduced clock synthesis and phase alignment across multiple domains |
| SelectIO Technology | Supports LVDS, SSTL, HSTL, and differential signaling standards with programmable drive strength and termination |
| PCIe Endpoint Logic | Hard IP for PCIe Gen2 x1/x2/x4 endpoints eliminates need for soft-core implementation and reduces resource usage |
| Partial Reconfiguration Support | Enables dynamic module swapping in operational systems without full reconfiguration or system reset |
| Transceiver Calibration | Automatic analog calibration of GTP receivers ensures consistent signal integrity across voltage/temperature variations |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation. IC Role / Device Role / Timing Role: High-throughput data path orchestrator with deterministic latency for ADC sample ingestion and FFT acceleration. Use Value: 128K logic cells and 1,248 DSP slices enable concurrent multi-channel beamforming with sub-microsecond latency. | Use Scenario: CT and MRI reconstruction pipeline handling gigapixel voxel datasets. IC Role / Device Role / Timing Role: Co-processor managing parallel back-projection kernels and real-time motion correction logic. Use Value: 16.4 Mb block RAM allows on-chip storage of intermediate sinogram buffers, reducing DDR3 bandwidth pressure by 40%. |
| High-Speed Test Equipment | Avionics Data Concentrator |
Use Scenario: Automated test systems requiring synchronized multi-channel waveform generation and analysis. IC Role / Device Role / Timing Role: Timing-critical pattern generator and response analyzer with deterministic I/O delay control. Use Value: 600 user I/Os and -2 speed grade ensure precise 1 ns resolution timing control across 32+ channels. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control subsystems. IC Role / Device Role / Timing Role: Protocol-aware packet router with time-triggered scheduling and hardware CRC offload. Use Value: Integrated PCIe Gen2 endpoint and 24 × 6.6 Gb/s GTP transceivers enable deterministic low-latency interconnect between avionics LRUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX75T-2FFG1156C | Fewer logic cells (75,000), reduced DSP count (720), same package and speed grade | Suitable for mid-bandwidth signal processing where full LX130T resources are unused | Select when design fits within 60% of LX130T resource utilization to reduce cost and power |
| XCVU9P-2FFVA2104I | UltraScale architecture, higher density (2,586K logic cells), 100+ GTY transceivers, different package (2104-pin) | Required for next-generation 5G baseband or AI inference acceleration beyond Virtex-6 capabilities | Choose only when migrating legacy Virtex-6 designs to higher throughput, lower power per MAC, or advanced SerDes features |
Compared with XC6VLX130T-2FFG1156C, the XC6VLX75T-2FFG1156C offers cost savings at reduced capacity, while the XCVU9P-2FFVA2104I enables architectural scaling but requires PCB redesign and toolchain migration.
Availability
XC6VLX130T-2FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, high-speed test equipment, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX130T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions through its acquisition of Xilinx. It focuses on high-performance, heterogeneous processing platforms for data centers, AI, and embedded systems.
The Virtex-6 family was designed for demanding high-speed signal processing, wired communications, and military/aerospace applications where deterministic timing, high I/O bandwidth, and transceiver integration are critical.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VLX130T-2FFG1156C?
The XC6VLX130T-2FFG1156C supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its integrated memory controller and I/O banks configured for SSTL15. This capability is validated in Xilinx UG388 and applies specifically to the -2 speed grade under industrial temperature conditions.
Does XC6VLX130T-2FFG1156C include hard IP for PCI Express?
Yes, XC6VLX130T-2FFG1156C integrates hard PCIe Gen2 endpoint blocks supporting x1, x2, and x4 lane configurations. These blocks are implemented in dedicated silicon, not soft logic, and require no LUT resources. Configuration and link training are handled autonomously per Xilinx UG371.
What is the core voltage requirement for XC6VLX130T-2FFG1156C?
XC6VLX130T-2FFG1156C requires a nominal core supply voltage of 1.0 V with tolerance of ±3%, delivered via the VCCINT pins. This voltage must be tightly regulated and filtered per Xilinx DS152 recommendations to maintain timing integrity and avoid configuration errors.
How many GTP transceivers does XC6VLX130T-2FFG1156C provide?
XC6VLX130T-2FFG1156C provides 24 GTP transceivers, each capable of operation from 100 Mb/s to 6.6 Gb/s. These transceivers support protocols including PCIe Gen2, SATA II/III, and Serial RapidIO, and are distributed across four quads on the die.
Is partial reconfiguration supported on XC6VLX130T-2FFG1156C?
Yes, XC6VLX130T-2FFG1156C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This feature allows dynamic replacement of logic modules without resetting the entire device or halting system operation, as documented in Xilinx UG702.
XC6VLX130T-2FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-2FFG1156C FAQ
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Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC6VLX130T-2FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG1156C is usually 5 days.
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5.How can I obtain technical support or documentation for XC6VLX130T-2FFG1156C?
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6.How does Aetrix verify that XC6VLX130T-2FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FFG1156C?
All XC6VLX130T-2FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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