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AMD XC6VLX130T-2FFG1156C

Part No.:
XC6VLX130T-2FFG1156C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VLX130T-2FFG1156C.pdf
Description:
IC FPGA 600 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,642

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Product details

Overview

XC6VLX130T-2FFG1156C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,248 DSP48E1 slices, and 16.4 Mb of total block RAM. It supports DDR3 memory interfaces up to 800 MHz and delivers 24.5 GMACs of signal processing throughput. This device is deployed in high-performance digital signal processing systems such as radar beamforming and real-time video encoding.

For engineers reviewing the XC6VLX130T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600 user I/Os), speed grade (-2), package type (FFG1156), and transceiver capability (24 × 6.6 Gb/s GTP).

Technical Context

The XC6VLX130T-2FFG1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates 24 GTP serial transceivers supporting protocols including PCIe Gen2, SATA, and Serial RapidIO.

This device uses 40 nm bulk CMOS process technology and operates at core voltage of 1.0 V ±3%. Its -2 speed grade guarantees timing closure for designs running at maximum system clock frequencies up to 500 MHz in critical paths.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells128,000 - determines maximum combinational/sequential logic capacity for RTL implementation
DSP Slices1,248 × DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines
Block RAM16.4 Mb - supports large on-chip data buffering and coefficient storage without external memory
User I/Os600 - provides high-density interface connectivity to ADCs, DACs, memory, and FMC mezzanine cards
GTP Transceivers24 × 6.6 Gb/s - enables multi-lane serial links for camera sensor aggregation and backplane interconnect
Speed Grade-2 - guarantees timing closure for designs targeting 500 MHz system clocks in worst-case conditions
PackageFFG1156 - 1156-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity

Pinout & Package

XC6VLX130T-2FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch and 35 × 35 mm body size. The package supports thermal vias and power/ground ball patterns compliant with Xilinx PCB design guidelines.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore supply1.0 V ±3% power domain for CLBs, DSP slices, and routing fabric
VCCAUXAuxiliary supply1.8 V supply for configuration logic, clock management, and SelectIO banks
VCCOI/O supplyProgrammable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support
MRMaster resetAsynchronous global reset input that clears configuration memory and logic states
CCLKConfiguration clockInput clock for slave-serial and JTAG configuration modes
INIT_BConfiguration statusOpen-drain output indicating configuration memory readiness and error detection

Key Features

FeatureDesign Value
Integrated Clock Management16 × DCM and 8 × PLL blocks provide jitter-reduced clock synthesis and phase alignment across multiple domains
SelectIO TechnologySupports LVDS, SSTL, HSTL, and differential signaling standards with programmable drive strength and termination
PCIe Endpoint LogicHard IP for PCIe Gen2 x1/x2/x4 endpoints eliminates need for soft-core implementation and reduces resource usage
Partial Reconfiguration SupportEnables dynamic module swapping in operational systems without full reconfiguration or system reset
Transceiver CalibrationAutomatic analog calibration of GTP receivers ensures consistent signal integrity across voltage/temperature variations

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation.

IC Role / Device Role / Timing Role: High-throughput data path orchestrator with deterministic latency for ADC sample ingestion and FFT acceleration.

Use Value: 128K logic cells and 1,248 DSP slices enable concurrent multi-channel beamforming with sub-microsecond latency.

Use Scenario: CT and MRI reconstruction pipeline handling gigapixel voxel datasets.

IC Role / Device Role / Timing Role: Co-processor managing parallel back-projection kernels and real-time motion correction logic.

Use Value: 16.4 Mb block RAM allows on-chip storage of intermediate sinogram buffers, reducing DDR3 bandwidth pressure by 40%.

High-Speed Test EquipmentAvionics Data Concentrator

Use Scenario: Automated test systems requiring synchronized multi-channel waveform generation and analysis.

IC Role / Device Role / Timing Role: Timing-critical pattern generator and response analyzer with deterministic I/O delay control.

Use Value: 600 user I/Os and -2 speed grade ensure precise 1 ns resolution timing control across 32+ channels.

Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control subsystems.

IC Role / Device Role / Timing Role: Protocol-aware packet router with time-triggered scheduling and hardware CRC offload.

Use Value: Integrated PCIe Gen2 endpoint and 24 × 6.6 Gb/s GTP transceivers enable deterministic low-latency interconnect between avionics LRUs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6VLX75T-2FFG1156CFewer logic cells (75,000), reduced DSP count (720), same package and speed gradeSuitable for mid-bandwidth signal processing where full LX130T resources are unusedSelect when design fits within 60% of LX130T resource utilization to reduce cost and power
XCVU9P-2FFVA2104IUltraScale architecture, higher density (2,586K logic cells), 100+ GTY transceivers, different package (2104-pin)Required for next-generation 5G baseband or AI inference acceleration beyond Virtex-6 capabilitiesChoose only when migrating legacy Virtex-6 designs to higher throughput, lower power per MAC, or advanced SerDes features

Compared with XC6VLX130T-2FFG1156C, the XC6VLX75T-2FFG1156C offers cost savings at reduced capacity, while the XCVU9P-2FFVA2104I enables architectural scaling but requires PCB redesign and toolchain migration.

Availability

XC6VLX130T-2FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, high-speed test equipment, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.

Supply support for XC6VLX130T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions through its acquisition of Xilinx. It focuses on high-performance, heterogeneous processing platforms for data centers, AI, and embedded systems.

The Virtex-6 family was designed for demanding high-speed signal processing, wired communications, and military/aerospace applications where deterministic timing, high I/O bandwidth, and transceiver integration are critical.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6VLX130T-2FFG1156C?

The XC6VLX130T-2FFG1156C supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its integrated memory controller and I/O banks configured for SSTL15. This capability is validated in Xilinx UG388 and applies specifically to the -2 speed grade under industrial temperature conditions.

Does XC6VLX130T-2FFG1156C include hard IP for PCI Express?

Yes, XC6VLX130T-2FFG1156C integrates hard PCIe Gen2 endpoint blocks supporting x1, x2, and x4 lane configurations. These blocks are implemented in dedicated silicon, not soft logic, and require no LUT resources. Configuration and link training are handled autonomously per Xilinx UG371.

What is the core voltage requirement for XC6VLX130T-2FFG1156C?

XC6VLX130T-2FFG1156C requires a nominal core supply voltage of 1.0 V with tolerance of ±3%, delivered via the VCCINT pins. This voltage must be tightly regulated and filtered per Xilinx DS152 recommendations to maintain timing integrity and avoid configuration errors.

How many GTP transceivers does XC6VLX130T-2FFG1156C provide?

XC6VLX130T-2FFG1156C provides 24 GTP transceivers, each capable of operation from 100 Mb/s to 6.6 Gb/s. These transceivers support protocols including PCIe Gen2, SATA II/III, and Serial RapidIO, and are distributed across four quads on the die.

Is partial reconfiguration supported on XC6VLX130T-2FFG1156C?

Yes, XC6VLX130T-2FFG1156C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This feature allows dynamic replacement of logic modules without resetting the entire device or halting system operation, as documented in Xilinx UG702.

XC6VLX130T-2FFG1156C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10000
Number of Logic Elements/Cells:
128000
Total RAM Bits:
9732096
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VLX130T-2FFG1156C FAQ

1.How can I place an order for XC6VLX130T-2FFG1156C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX130T-2FFG1156C reliable?

The price and inventory of XC6VLX130T-2FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG1156C is usually 5 days.

3.What payment methods are accepted for XC6VLX130T-2FFG1156C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FFG1156C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX130T-2FFG1156C?

XC6VLX130T-2FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX130T-2FFG1156C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX130T-2FFG1156C?

For technical support, including XC6VLX130T-2FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FFG1156C requirements.

6.How does Aetrix verify that XC6VLX130T-2FFG1156C is sourced from the original manufacturer or authorized distributors?

All XC6VLX130T-2FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG1156C meets industry standards.

7.What is the process for return or replacement of XC6VLX130T-2FFG1156C?

All XC6VLX130T-2FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG1156C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX130T-2FFG1156C part is unused and in its original packaging.

Return procedure for XC6VLX130T-2FFG1156C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX130T-2FFG1156C Tags

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