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AMD XC6VLX130T-2FFG1156I
- Part No.:
- XC6VLX130T-2FFG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-2FFG1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,687
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Product details
Overview
XC6VLX130T-2FFG1156I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing for radar beamforming systems.
For engineers reviewing the XC6VLX130T-2FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600 user I/Os), transceiver lane count (24 GTx), voltage supply requirements (1.0V core, 1.8V/2.5V I/O), and thermal design implications of the FFG1156 package.
Technical Context
The XC6VLX130T-2FFG1156I implements a fully programmable architecture based on 4-input LUTs, distributed RAM, and carry logic. It integrates hardened IP including PCIe Gen2 x8 endpoint, tri-mode Ethernet MACs, and clock management tiles with MMCM and PLL support.
Its GTx transceivers comply with PCIe Gen2, SATA, and SRIO v2 standards, and support protocol-transparent operation. The device uses SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards across its 600 user I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for complex state machines or data paths |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations at up to 550 MHz for real-time filtering |
| Block RAM | 16.4 Mb - supports large on-chip buffering for video frame storage or FFT coefficient tables |
| Transceivers | 24 GTx lanes @ 6.6 Gb/s - provides serial connectivity for JESD204B ADC/DAC interfaces or backplane links |
| User I/O Pins | 600 - allows wide parallel bus interfacing or multi-channel sensor aggregation |
| Speed Grade | -2 - guarantees timing closure at 1.0V core supply with worst-case industrial temperature derating |
| Operating Temp | -40°C to +100°C - qualified for under-hood automotive or outdoor base station deployment |
Pinout & Package
The XC6VLX130T-2FFG1156I is housed in a 1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1156) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO banks and thermal balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and transceiver analog circuitry |
| VCCO | I/O bank power | Configurable per-bank (1.2V–2.5V); sets output swing and input threshold for each I/O standard |
| MRCC / SRCC | Multi-/Single-ended clock input | Dedicated differential clock inputs with internal termination and phase alignment for MMCM/PLL |
| GTxP/N | Transceiver differential pair | High-speed serial I/O with integrated CDR, pre-emphasis, and receiver equalization |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hard IP block enabling direct host CPU communication without soft-core overhead or timing closure risk |
| Tri-Mode Ethernet MAC | Configurable 10/100/1000 Mbps MAC with GMII/RGMII/MII interface support for embedded networking |
| MMCM + PLL Clock Management | Two independent clock synthesis units supporting jitter cleaning, frequency translation, and phase shifting |
| SelectIO Technology | Per-bank I/O standard flexibility including LVDS, SSTL-18, HSTL-I, and differential termination control |
| AXI Interconnect Support | Native integration with AXI4/AXI4-Lite protocols for seamless connection to MicroBlaze or Zynq-based subsystems |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering algorithms; GTx transceivers interface with high-speed ADCs/DACs via JESD204B. Use Value: 128K logic cells and 1.2K DSP slices enable concurrent channel processing at 100+ MSPS sample rates. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Configurable logic handles raw data de-interleaving, compression, and GPU-offload coordination. Use Value: 16.4 Mb block RAM buffers full k-space datasets while AXI interconnect routes data to DDR3 controllers. |
| Avionics Data Concentrator | Industrial Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers. IC Role / Device Role / Timing Role: Soft peripherals implement protocol stacks; SelectIO banks isolate mixed-voltage legacy interfaces. Use Value: 600 user I/Os and industrial temp rating ensure deterministic latency and reliability in safety-critical avionics bays. | Use Scenario: High-precision automated test equipment requiring synchronized analog stimulus/response capture. IC Role / Device Role / Timing Role: Timing engine generates sub-nanosecond trigger sequences; GTx lanes stream digitized waveforms to host PC. Use Value: MMCM/PLL jitter performance (<1 ps RMS) meets IEEE 1149.4 boundary-scan timing compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; higher logic density (2,586K LC), 48 GTY transceivers @ 32.75 Gb/s, 1.2V core | Supports 5G NR baseband and AI inference acceleration; requires updated toolchain (Vivado 2019.1+) | Choose when migrating to higher bandwidth or AI-accelerated workloads; not pin-compatible with XC6VLX130T-2FFG1156I |
| XC7VX690T-2FFG1927I | Virtex-7 generation; 693K logic cells, 36 GTX transceivers @ 13.1 Gb/s, same -2 speed grade and industrial temp | Offers improved DSP efficiency and lower static power; supports PCIe Gen3 x16 | Prefer for new designs needing higher transceiver bandwidth and better power efficiency; pinout differs due to larger FFG1927 package |
Compared with XC6VLX130T-2FFG1156I, the XC7VX690T-2FFG1927I delivers 5.4× more logic and PCIe Gen3 support but requires PCB redesign, while the XCVU9P-2FLGA2104I enables next-generation serial protocols at significantly higher power and toolchain complexity.
Availability
XC6VLX130T-2FFG1156I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX130T-2FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Virtex-6 family was designed for high-performance logic, DSP, and serial connectivity in aerospace, defense, and wired communications infrastructure.
FAQ
What is the maximum transceiver data rate supported by XC6VLX130T-2FFG1156I?
The XC6VLX130T-2FFG1156I supports GTx transceivers operating at up to 6.6 Gb/s. This rate is validated across all 24 transceiver lanes under industrial temperature conditions and -2 speed grade timing constraints. Applications such as JESD204B subclass 1 interfaces rely on this guaranteed performance for deterministic latency in ADC/DAC links.
Does XC6VLX130T-2FFG1156I include hard IP for PCI Express?
Yes, XC6VLX130T-2FFG1156I integrates a hard PCIe Gen2 x8 endpoint block. This dedicated IP eliminates soft-core implementation overhead and ensures timing closure without custom RTL. It supports root complex and endpoint modes, and is configurable via Xilinx Core Generator with AXI4 streaming interface.
What I/O standards are supported by XC6VLX130T-2FFG1156I?
XC6VLX130T-2FFG1156I supports LVDS, LVPECL, SSTL-18, SSTL-2, HSTL-I, HSTL-II, and differential signaling standards via its SelectIO technology. Each of the 600 user I/Os is grouped into banks with independent VCCO supplies, allowing simultaneous use of multiple I/O standards within a single design.
Is XC6VLX130T-2FFG1156I qualified for industrial temperature operation?
Yes, the XC6VLX130T-2FFG1156I is rated for industrial temperature range (-40°C to +100°C) and is marked with the 'I' suffix to indicate this qualification. Thermal management must account for 1156-ball FFG package power dissipation, especially under full transceiver and DSP utilization.
What configuration mode does XC6VLX130T-2FFG1156I support?
XC6VLX130T-2FFG1156I supports Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Configuration bitstream is loaded via dedicated configuration pins (CCLK, DIN, PROG_B), and supports fallback mechanisms using dual-bitstream storage in external SPI flash. Bitstream encryption is available via AES-256.
XC6VLX130T-2FFG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-2FFG1156I FAQ
1.How can I place an order for XC6VLX130T-2FFG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FFG1156I reliable?
The price and inventory of XC6VLX130T-2FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FFG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FFG1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FFG1156I?
XC6VLX130T-2FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FFG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FFG1156I?
For technical support, including XC6VLX130T-2FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FFG1156I requirements.
6.How does Aetrix verify that XC6VLX130T-2FFG1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FFG1156I?
All XC6VLX130T-2FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FFG1156I part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FFG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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