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AMD XC6VLX130T-2FFG484C
- Part No.:
- XC6VLX130T-2FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX130T-2FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,404
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Product details
Overview
XC6VLX130T-2FFG484C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 128,000 logic cells, 13.2 Mb of block RAM, 640 DSP48E1 slices, and 484-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging. It operates at -2 speed grade (1.2 V core, 1.25 GHz maximum I/O toggle rate) and targets high-performance serial connectivity and signal processing in wired infrastructure.
For engineers reviewing the XC6VLX130T-2FFG484C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (24 GTP), I/O voltage support (1.2–3.3 V), thermal performance (100°C junction), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
The XC6VLX130T-2FFG484C implements a hierarchical FPGA architecture with Configurable Logic Blocks (CLBs), dedicated DSP slices, and integrated multi-gigabit transceivers (GTP). It supports PCI Express Gen1/Gen2 endpoints and root complexes via hard IP blocks.
Configuration is performed through Master SPI or SelectMAP modes using external flash or processor control. The device includes built-in clock management with eight mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for jitter reduction and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for custom datapaths |
| Block RAM | 13.2 Mb - supports large on-chip buffering, FIFOs, and coefficient storage without external memory |
| DSP Slices | 640 × DSP48E1 - enables parallel multiply-accumulate operations up to 25 GMAC/s at 250 MHz |
| GTP Transceivers | 24 × 3.125 Gbps - provides SerDes lanes for SGMII, PCIe Gen1/2, and CPRI interfaces |
| I/O Pins | 360 user-configurable - supports LVDS, SSTL, HSTL, and differential signaling standards |
| Speed Grade | -2 - guarantees timing closure at 1.25 GHz I/O toggle rate and 500 MHz system clock under worst-case conditions |
| Operating Temp | 0°C to 85°C ambient - validated for commercial temperature range operation in enclosed systems |
Pinout & Package
XC6VLX130T-2FFG484C uses a 484-ball Flip-Chip Fine-Pitch BGA (FFG) package with 27 × 27 mm body size, 1.0 mm ball pitch, and thermal lid. Pin assignment follows Xilinx UG373 v1.11 and includes dedicated configuration, clock, JTAG, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during Master SPI mode; requires 50 MHz max frequency |
| DIN | Serial Configuration Data Input | Accepts bitstream from SPI flash; supports x1/x2/x4 modes per UG380 |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| MGTAVCC | Analog Transceiver Supply | 1.0 V ±3% supply for GTP analog circuitry; requires low-noise filtering per UG373 |
| VRP/VRN | Reference Voltage Terminals | Provide termination reference for differential I/O standards including LVDS and TMDS |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTP Transceivers | 24 lanes supporting 600 Mbps–3.125 Gbps with embedded 8B/10B encoding and elastic buffers |
| Hard PCI Express Block | Configurable as Gen1 x1/x2/x4 or Gen2 x1/x2 endpoint with AXI interface and DMA engine |
| MMCM Clock Management | Eight MMCMs provide sub-100 fs jitter synthesis, dynamic phase shift, and fractional division |
| System Monitor | On-die temperature and supply voltage sensor with I²C interface for real-time health monitoring |
| SelectIO Technology | Supports 21 I/O standards including SSTL-18, HSTL-I, and differential LVDS with programmable drive strength |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and MIMO signal conditioning in LTE-Advanced macro base stations. IC Role / Device Role / Timing Role: Programmable baseband processor implementing adaptive filter pipelines and high-throughput FFT engines. Use Value: 640 DSP48E1 slices enable concurrent 2048-point FFTs at 200 MHz, reducing latency versus fixed ASIC solutions. | Use Scenario: Pattern generation and analysis in automated test equipment for DDR4 and PCIe Gen3 compliance validation. IC Role / Device Role / Timing Role: Reconfigurable protocol-aware pattern engine with deterministic timing alignment across 360 I/O pins. Use Value: 24 GTP transceivers support simultaneous multi-lane capture at 3.125 Gbps, eliminating need for external serializer/deserializer chips. |
| Avionics Data Concentrators | Medical Imaging Back-End Processors |
Use Scenario: ARINC 664 (AFDX) end-system aggregation and time-triggered Ethernet switching in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic packet scheduler with hardware timestamping and redundant path failover logic. Use Value: MMCM-based clock networks achieve <5 ns inter-port skew across 360 I/Os, meeting AFDX jitter requirements. | Use Scenario: Real-time image reconstruction pipeline for CT and MRI scanners requiring low-latency pixel data flow. IC Role / Device Role / Timing Role: High-bandwidth memory controller interfacing DDR3 at 800 MHz and feeding parallel processing engines. Use Value: 13.2 Mb block RAM buffers full-frame projection data while DSP slices execute iterative reconstruction algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX75T-2FFG484C | Fewer logic cells (75K), reduced DSP count (400), same GTP count and package | Suitable for lower-complexity SerDes+processing tasks where full LX130T resources are unused | Select when design fits within 75K CLBs and requires identical footprint and transceiver count |
| XCVU3P-2FFVD1760E | UltraScale architecture, 355K logic cells, 24 GTY transceivers (12.5 Gbps), different package (1760-pin) | Targets next-generation 10G+ protocols and higher algorithmic complexity with greater bandwidth | Choose for migration paths requiring >3.125 Gbps line rates or >128K logic resources |
Compared with XC6VLX130T-2FFG484C, the XC6VLX75T-2FFG484C offers identical pinout and transceiver capability at lower cost and power, while the XCVU3P-2FFVD1760E delivers higher serial bandwidth and logic density but requires PCB redesign and new power delivery planning.
Availability
XC6VLX130T-2FFG484C is available at Aetrix Electronics and suitable for wireless infrastructure, test instrumentation, avionics data concentrators, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for XC6VLX130T-2FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance serial connectivity and compute-intensive signal processing in wired and wireless infrastructure equipment.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-2FFG484C?
The XC6VLX130T-2FFG484C integrates 24 GTP transceivers each supporting data rates from 600 Mbps to 3.125 Gbps. These transceivers implement 8B/10B encoding, elastic buffers, and clock correction logic. The 3.125 Gbps limit applies to all GTP lanes in this device and is validated per Xilinx UG371 v1.12. Higher rates require UltraScale or Versal devices.
Does XC6VLX130T-2FFG484C support PCI Express Gen2 x4 endpoint functionality?
Yes, XC6VLX130T-2FFG484C includes a hard PCI Express Gen2 endpoint block configurable as x1, x2, or x4 lane width. It supports AXI4 streaming interface, MSI/MSI-X interrupt delivery, and DMA read/write operations. Configuration is handled via dedicated PCIe configuration space registers mapped into the device's address space, as defined in UG371.
What configuration modes are supported by XC6VLX130T-2FFG484C?
XC6VLX130T-2FFG484C supports Master SPI, Slave Serial, Slave Parallel (SelectMAP), and JTAG configuration modes. Master SPI is most common for single-flash boot; SelectMAP enables processor-controlled reconfiguration. All modes use the same dedicated configuration pins (CCLK, DIN, INIT_B, PROGRAM_B) and are selected via mode pin strapping per UG380 v1.9.
What is the operating junction temperature range for XC6VLX130T-2FFG484C?
The XC6VLX130T-2FFG484C is rated for 0°C to 100°C junction temperature under commercial-grade (-2 speed grade) operation. Ambient temperature limits depend on board-level thermal design; typical derating begins above 85°C ambient. Thermal data, including θJA and θJC values, is provided in Xilinx UG373 Table 1-12 for FFG484 package.
How many block RAM columns does XC6VLX130T-2FFG484C contain?
XC6VLX130T-2FFG484C contains 288 block RAM primitives, each 36 Kb in size, totaling 13.2 Mb of distributed block RAM. These are arranged in 144 dual-port RAMB36E1 columns, supporting independent read/write ports and true dual-port operation. Memory initialization is supported via bitstream or runtime write access.
XC6VLX130T-2FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX130T-2FFG484C FAQ
1.How can I place an order for XC6VLX130T-2FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FFG484C reliable?
The price and inventory of XC6VLX130T-2FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FFG484C?
XC6VLX130T-2FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FFG484C?
For technical support, including XC6VLX130T-2FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FFG484C requirements.
6.How does Aetrix verify that XC6VLX130T-2FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FFG484C?
All XC6VLX130T-2FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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