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AMD XC6VLX130T-2FFG484I
- Part No.:
- XC6VLX130T-2FFG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX130T-2FFG484I.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,620
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Product details
Overview
XC6VLX130T-2FFG484I from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 128,000 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe® Gen2 x8 endpoint support. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VLX130T-2FFG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (364 user I/Os), transceiver lane count (16 lanes), block RAM capacity (5,040 kbits), and thermal performance in compact carrier board designs.
Technical Context
The XC6VLX130T-2FFG484I implements a 40nm low-power process architecture with configurable logic blocks (CLBs), 18×25 DSP48E1 slices, and dual-register 6-input LUTs. It supports SelectIO™ standards up to 1.25 Gbps and includes dedicated clock management tiles with MMCM and PLL resources.
Its transceivers comply with IEEE 802.3ap, SATA, and CPRI protocols, and the device integrates hardened PCI Express v2.0 endpoint logic with AXI-Stream interface support for direct integration into SoC interconnect fabrics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic density for protocol stack implementation |
| User I/O Pins | 364 - supports high-pin-count parallel interfaces such as DDR3 memory controllers and video pixel buses |
| Block RAM | 5,040 kbits - enables large on-chip buffering for packet reordering or frame storage in telecom line cards |
| Transceiver Lanes | 16 - provides full-duplex serial links for multi-channel SFP+ or CPRI baseband processing |
| Max Transceiver Rate | 12.8 Gb/s - meets line-rate requirements for 10G Ethernet KR/KR4 and OTU2/OTU3 framing |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case voltage/temperature margin |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncooled outdoor wireless base station enclosures |
Pinout & Package
XC6VLX130T-2FFG484I is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 29×29 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant finish. The package supports thermal dissipation up to 12 W under forced-air cooling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply (1.0V) - must be filtered with ≤10 µF ceramic + 100 nF local decoupling per power rail |
| A17 | VCCAUX | Auxiliary supply (2.5V) - powers configuration logic, JTAG, and transceiver reference clocks |
| P14 | VCCO_0 | I/O bank 0 supply (1.2–3.3V) - sets voltage level for LVDS, SSTL, or HSTL interfaces on Bank 0 |
| T10 | MRCC | Main reference clock input - accepts differential LVDS or single-ended LVCMOS for primary clock domain |
| R11 | SRCC | Secondary reference clock input - enables dual-clock domain operation for jitter-tolerant data acquisition |
| M15 | CLKOUT | Dedicated clock output - drives external clock distribution networks without routing through fabric |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint Hard IP | Reduces RTL integration effort by eliminating need for soft PCIe controller synthesis and verification |
| DSP48E1 Slices | 18×25 architecture enables real-time FIR filtering and FFT computation for 4G/5G physical layer processing |
| SelectIO Technology | Supports 21 I/O standards including SSTL-18, HSTL-I, and LVDS with programmable drive strength and slew rate |
| MMCM Clock Management | Generates up to 7 output clocks per tile with ±10 ps jitter (12 kHz–20 MHz) for deterministic timing closure |
| Configuration via SPIx4 | Enables fast, secure bitstream loading from quad-SPI flash with CRC validation and fallback support |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel estimation in LTE-A and 5G NR macrocell base stations. IC Role / Device Role / Timing Role: FPGA fabric executes Layer 1 PHY algorithms while hard PCIe endpoint interfaces with host CPU for control plane messaging. Use Value: 12.8 Gb/s transceivers enable direct connection to multiple RFICs via CPRI or eCPRI, reducing latency versus backplane-based architectures. | Use Scenario: High-precision signal generation and analysis in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: Configurable digital pattern generator and high-speed comparator with sub-nanosecond timestamping. Use Value: 364 user I/Os support parallel multi-site testing of SoCs, while MMCM-generated clocks ensure deterministic skew across 64+ channels. |
| Avionics Data Concentrators | Optical Transport Line Cards |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Deterministic switch fabric with time-triggered scheduling and built-in CRC error detection. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliable operation in non-pressurized avionics bays without active cooling. | Use Scenario: OTN framing, GFP mapping, and FEC encoding/decoding in 10G/40G optical line interface modules. IC Role / Device Role / Timing Role: Line-side packet processor interfacing with SERDES and host-side PCIe Gen2 x8 for backplane communication. Use Value: Hardened PCIe endpoint eliminates software driver dependencies and reduces host CPU load during high-throughput traffic bursts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX75T-2FFG484I | Fewer logic cells (75,000), same package and speed grade, reduced transceiver count (8 lanes) | Suitable for cost-sensitive 10G client-side optics where full 16-lane capacity is unused | Select when design fits within 75K LC budget and requires only half the serial bandwidth |
| XCKU060-2FFVA1156I | UltraScale architecture, higher logic density (444K LC), 20 Gb/s transceivers, larger 1156-pin package | Required for next-gen 400G coherent transport where 12.8 Gb/s per lane is insufficient | Choose for new designs targeting >25 Gb/s line rates or needing >2× logic capacity with forward-compatible toolchain |
Compared with XC6VLX130T-2FFG484I, the XC6VLX75T-2FFG484I offers lower cost and power at reduced capacity, while the XCKU060-2FFVA1156I delivers scalable bandwidth and logic for migration beyond 10G/40G infrastructure.
Availability
XC6VLX130T-2FFG484I is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-2FFG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms for data center, AI, and high-performance embedded markets.
The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in wired communications, military radar, and scientific instrumentation where deterministic timing and hardened IP are critical.
FAQ
What is the maximum supported data rate per transceiver lane in XC6VLX130T-2FFG484I?
The XC6VLX130T-2FFG484I supports up to 12.8 Gb/s per transceiver lane, validated per IEEE 802.3ap Annex 58 for 10GBASE-KR and compliant with CPRI Option 7. This rate is guaranteed at -2 speed grade under industrial temperature conditions with proper reference clock jitter specifications met.
Does XC6VLX130T-2FFG484I include a hard PCIe endpoint block?
Yes, the XC6VLX130T-2FFG484I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It supports both root complex and endpoint roles, includes AXI-Stream interface, and requires no external PHY for basic link training and enumeration.
What I/O standards are supported by XC6VLX130T-2FFG484I banks?
XC6VLX130T-2FFG484I supports 21 SelectIO standards including LVDS, SSTL-18, HSTL-I, DIFF_HSTL_I, and MIPI D-PHY. Each I/O bank is independently configurable for voltage (1.2V–3.3V), drive strength, and slew rate, with termination resistors programmable per pin.
Is XC6VLX130T-2FFG484I qualified for industrial temperature operation?
Yes, the XC6VLX130T-2FFG484I is rated for industrial temperature range (-40°C to +100°C) and specified for continuous operation at full speed grade under these conditions. Thermal derating is not required up to 100°C ambient with appropriate PCB copper pour and airflow.
How many block RAM columns does XC6VLX130T-2FFG484I contain?
The XC6VLX130T-2FFG484I contains 126 block RAM columns, each providing 36 kbits of true dual-port memory. Total usable block RAM capacity is 5,040 kbits, with independent read/write ports and byte-write enable capability per column.
XC6VLX130T-2FFG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX130T-2FFG484I FAQ
1.How can I place an order for XC6VLX130T-2FFG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FFG484I reliable?
The price and inventory of XC6VLX130T-2FFG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG484I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FFG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FFG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FFG484I?
XC6VLX130T-2FFG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FFG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FFG484I?
For technical support, including XC6VLX130T-2FFG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FFG484I requirements.
6.How does Aetrix verify that XC6VLX130T-2FFG484I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FFG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG484I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FFG484I?
All XC6VLX130T-2FFG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FFG484I part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FFG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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