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AMD XC6VLX130T-2FFG784C
- Part No.:
- XC6VLX130T-2FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-2FFG784C.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,232
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Product details
Overview
XC6VLX130T-2FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.5 Mb of block RAM. It supports PCIe Gen2 x8, DDR3-1333 memory interfaces, and operates at -2 speed grade with 1.2 V core voltage. Used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-2FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (528 user I/Os), transceiver line rate (6.6 Gb/s), thermal design power (15.2 W typical), and package footprint compatibility with FFG784 flip-chip BGA.
Technical Context
The XC6VLX130T-2FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates 24 multi-gigabit transceivers supporting protocols including SATA, SRIO, and CPRI.
Configuration is performed via JTAG, Master SelectMAP, or Slave Serial modes using external SPI flash or PROM. The device supports partial reconfiguration and includes built-in system monitoring for on-chip temperature and supply voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations up to 25 GMAC/s at 250 MHz |
| Block RAM | 16.5 Mb - supports large on-die data buffering and FIFO construction without external memory |
| User I/O Pins | 528 - provides high-density interface routing for multi-protocol connectivity and board-level signal fanout |
| Transceiver Speed | 6.6 Gb/s - enables single-lane CPRI v6.0 or dual-lane SATA 3.0 physical layer operation |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply with worst-case junction temperature of 85°C |
| Package | FFG784 - 29×29 mm flip-chip BGA with 1.0 mm pitch, compatible with standard reflow profiles |
Pinout & Package
XC6VLX130T-2FFG784C is housed in a 784-pin flip-chip fine-pitch BGA (FFG784) package with 29×29 mm body size and 1.0 mm ball pitch. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary power supply | 1.8 V input for configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank enabling mixed-voltage interface support |
| MR | Master reset | Active-low asynchronous reset that clears configuration memory and halts startup sequence |
| CCLK | Configuration clock | Input clock for Master SelectMAP configuration mode; frequency ≤ 100 MHz |
| GTXREFCLK | Transceiver reference clock | Differential input driving PLLs for multi-gigabit transceiver lanes |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset, reducing system downtime in telecom baseband processing |
| Integrated System Monitor | On-die ADC measures die temperature and supply voltages (VCCINT/VCCAUX/VCCO) with ±5°C accuracy |
| PCIe Gen2 x8 Endpoint | Hard IP block compliant with PCI Express Base Spec 2.0, eliminating need for soft-core implementation |
| DDR3 Memory Controller | Hard macro supporting 1333 Mbps data rates across up to 16-bit wide interfaces with calibration logic |
| Multi-Gigabit Transceivers | 24 GTX transceivers with programmable pre-emphasis and receiver equalization for channel loss compensation |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 128K logic cells and 1.2 GHz DSP throughput enable sub-millisecond processing cycles for adaptive waveform generation. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Reconfigurable accelerator offloading compute-intensive back-projection and denoising kernels from host CPU. Use Value: 16.5 Mb block RAM buffers full k-space datasets while 24 GTX transceivers stream raw sensor data at 5.0 Gb/s per lane. |
| Wireless Baseband Unit | High-Speed Test Equipment |
Use Scenario: LTE-A and 5G NR Layer 1 processing in macrocell and small-cell base stations. IC Role / Device Role / Timing Role: Implements configurable OFDM modulation/demodulation, channel coding, and MIMO precoding pipelines. Use Value: PCIe Gen2 x8 interface connects to host processor for control plane traffic while GTX lanes handle fronthaul CPRI/Ethernet links. | Use Scenario: Protocol-aware bit error rate testing and jitter tolerance validation for SerDes devices. IC Role / Device Role / Timing Role: Generates and analyzes high-fidelity PRBS patterns with sub-100 ps timing resolution using deterministic clocking. Use Value: -2 speed grade ensures setup/hold margin for 6.6 Gb/s transceiver operation under industrial temperature conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-2FFG1156C | Higher logic density (240K LC), larger FFG1156 package (35×35 mm), 36 GTX transceivers | Required for designs needing >128K logic or >24 transceivers; higher TDP (22.1 W) | Select when XC6VLX130T-2FFG784C resource utilization exceeds 90% in critical paths |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 421K logic cells, 20 GTY transceivers (16.3 Gb/s), different pinout and configuration scheme | Targets next-generation designs requiring higher bandwidth and lower latency; not pin-compatible | Choose for migration paths where PCIe Gen3 x16 or DDR4-2400 support is mandatory |
Compared with XC6VLX130T-2FFG784C, XC6VLX240T-2FFG1156C offers scalable resources within the same Virtex-6 family but requires PCB redesign, while XCKU060-2FFVA1156I delivers architectural advancement at the cost of toolchain and firmware requalification.
Availability
XC6VLX130T-2FFG784C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and wireless baseband unit development requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-2FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Virtex-6 family was originally designed by Xilinx for high-performance logic, DSP, and serial connectivity in aerospace, defense, and wired/wireless infrastructure applications.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX130T-2FFG784C?
The XC6VLX130T-2FFG784C supports DDR3 memory interfaces up to 1333 Mbps (667 MHz clock). This capability is implemented via hard memory controller macros optimized for timing closure and signal integrity across 16-bit wide buses, and is validated in Xilinx UG388 for the Virtex-6 family. The XC6VLX130T-2FFG784C achieves this rate using calibrated output drivers and on-die termination matching JEDEC specifications.
Does XC6VLX130T-2FFG784C include built-in transceivers?
Yes, XC6VLX130T-2FFG784C integrates 24 GTX multi-gigabit transceivers capable of line rates from 600 Mb/s to 6.6 Gb/s. Each transceiver supports protocols including PCIe Gen2, SATA, SRIO, and CPRI. These are hard silicon blocks-not soft IP-ensuring deterministic latency and reduced power versus FPGA fabric-based implementations. The XC6VLX130T-2FFG784C transceivers include programmable pre-emphasis and receiver equalization.
What configuration modes does XC6VLX130T-2FFG784C support?
XC6VLX130T-2FFG784C supports three primary configuration modes: JTAG for debugging and programming, Master SelectMAP for parallel loading from external memory, and Slave Serial for SPI flash-based boot. Configuration bitstreams can be stored in external SPI PROM or loaded dynamically. The XC6VLX130T-2FFG784C also supports fallback and dual-boot configurations using external memory addressing schemes defined in UG380.
Is XC6VLX130T-2FFG784C qualified for automotive applications?
No, XC6VLX130T-2FFG784C is specified for commercial and industrial temperature ranges only (0°C to 85°C junction). It does not meet AEC-Q100 requirements nor is it offered in an automotive-grade screening flow. For automotive use cases, designers should consider AMD's XA series or newer Versal ACAP derivatives. The XC6VLX130T-2FFG784C remains appropriate for industrial control, test equipment, and communications infrastructure.
What thermal management guidance applies to XC6VLX130T-2FFG784C?
XC6VLX130T-2FFG784C has a maximum junction temperature of 100°C and typical thermal design power of 15.2 W. AMD recommends a 4-layer PCB with internal ground/power planes, thermal vias under the FFG784 package's exposed thermal pad, and forced-air cooling for sustained operation above 70°C ambient. Thermal simulation using Xilinx XPE is advised. The XC6VLX130T-2FFG784C includes on-die temperature sensors accessible via the System Monitor interface.
XC6VLX130T-2FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-2FFG784C FAQ
1.How can I place an order for XC6VLX130T-2FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FFG784C reliable?
The price and inventory of XC6VLX130T-2FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FFG784C?
XC6VLX130T-2FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FFG784C?
For technical support, including XC6VLX130T-2FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FFG784C requirements.
6.How does Aetrix verify that XC6VLX130T-2FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FFG784C?
All XC6VLX130T-2FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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