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AMD XC6VLX130T-2FFG784I
- Part No.:
- XC6VLX130T-2FFG784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-2FFG784I.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,196
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Product details
Overview
XC6VLX130T-2FFG784I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.5 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-2FFG784I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic cell count, block RAM capacity, speed grade timing margin, and FFG784 package thermal and routing constraints.
Technical Context
The XC6VLX130T-2FFG784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and high-speed serial transceivers compliant with PCIe Gen2, SATA, and SRIO standards. It integrates clock management tiles (CMTs) with DCMs and PLLs for multi-domain clock synthesis.
It supports SelectIO™ technology with programmable I/O standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per pin. Configuration is performed via JTAG, Master SPI, or Slave SelectMAP modes using external flash or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 1,200 × DSP48E1 - enables parallel multiply-accumulate operations for filtering, FFT, and matrix math |
| Block RAM | 16.5 Mb - provides on-chip memory for FIFOs, buffers, lookup tables, and local data storage |
| Transceiver Speed | 6.6 Gb/s - supports PCIe Gen2 x8, SATA II, and SRIO 1x/2x protocols without external retimers |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core voltage with worst-case industrial temperature derating |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II, TMDS - enables direct interface to ADCs, DACs, memory, and video PHYs |
| Configuration Mode | Master SPI / Slave SelectMAP / JTAG - allows flexible boot sources and field updates via microcontroller or host processor |
Pinout & Package
The XC6VLX130T-2FFG784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG784) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu finish. Thermal pad on underside requires PCB thermal via array for industrial temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for CLBs, DSP, and interconnect; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, JTAG, and select I/O banks; shared across multiple banks |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank; sets voltage level and compatible I/O standards for that bank |
| MR | Master reset input | Active-low asynchronous reset to clear configuration state and initialize internal logic |
| CCLK | Configuration clock | Drives internal configuration shift register during Master SPI mode; frequency ≤ 50 MHz |
| INIT_B | Configuration status | Open-drain output indicating configuration progress and error condition during startup |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 40 nm HKMG process | Enables higher logic density and lower dynamic power vs. previous 65 nm Virtex-5 generation |
| Dual-register flip-flops per LUT | Increases register-to-register timing performance and supports high-frequency pipelining |
| Integrated PCIe Gen2 Endpoint Block | Reduces external component count and simplifies compliance testing for host-facing interfaces |
| AXI4-compliant interconnect | Provides standardized, scalable, and synthesizable bus protocol for SoC-style IP integration |
| Partial Reconfiguration Support | Allows dynamic module swapping without full device reboot-critical for mission-critical runtime adaptation |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: High-throughput data path orchestrator with deterministic latency for ADC sample ingestion, FFT computation, and CFAR detection. Use Value: 128K logic cells and 1.2K DSP slices enable concurrent multi-channel processing at 100+ MSPS input rates. | Use Scenario: Accelerating reconstruction algorithms (e.g., iterative CT, MRI parallel imaging) in portable ultrasound and PET/CT systems. IC Role / Device Role / Timing Role: Co-processor tightly coupled to ARM-based host, offloading compute-intensive kernels via AXI4 interconnect. Use Value: On-chip 16.5 Mb block RAM eliminates external DDR bottleneck for large kernel coefficient storage and image tile buffering. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control data aggregation units. IC Role / Device Role / Timing Role: Protocol-aware packet router with deterministic jitter control and time-stamped I/O for synchronized sensor fusion. Use Value: SelectIO™ support for 1.25 Gb/s differential I/O and integrated clock management ensure sub-5 ns timestamp resolution. | Use Scenario: Bit-error-rate testing (BERT) and protocol validation for 10G Ethernet, CPRI, and JESD204B links. IC Role / Device Role / Timing Role: Programmable pattern generator and analyzer with precise phase-aligned sampling clocks and PRBS engines. Use Value: 6.6 Gb/s transceivers and -2 speed grade guarantee stable eye opening and jitter tolerance under production test conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX75T-2FFG484I | Fewer logic cells (75K), no transceivers, smaller FFG484 package | Suitable for cost-sensitive embedded control where serial I/O is handled externally | Select when transceiver count and logic density are not required; reduces BOM and PCB layer count |
| XCKU040-2FFVA1156I | Kintex UltraScale architecture, 198K logic cells, 16.3 Gb/s transceivers, larger FFG1156 package | Targets next-generation designs requiring higher bandwidth and lower power per logic unit | Choose for migration paths beyond Virtex-6 lifecycle; requires new PCB layout and toolchain upgrade |
Compared with XC6VLX75T-2FFG484I, the XC6VLX130T-2FFG784I delivers 71% more logic and integrated 6.6 Gb/s transceivers; versus XCKU040-2FFVA1156I, it offers mature toolchain support and proven qualification for long-lifecycle avionics deployments.
Availability
XC6VLX130T-2FFG784I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-2FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance, high-bandwidth system acceleration in aerospace, defense, and wired communications infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-2FFG784I?
The XC6VLX130T-2FFG784I supports transceiver line rates up to 6.6 Gb/s per channel. This enables native compliance with PCIe Gen2, SATA II, and Serial RapidIO 1x/2x protocols. The transceiver architecture includes built-in clock data recovery (CDR), pre-emphasis, and receiver equalization to maintain signal integrity at this rate under industrial temperature conditions.
Does XC6VLX130T-2FFG784I support partial reconfiguration?
Yes, the XC6VLX130T-2FFG784I supports partial reconfiguration through Xilinx ISE Design Suite tools. This capability allows dynamic replacement of specific logic modules while the rest of the design remains operational-enabling runtime adaptation in radar, test equipment, and communication systems without full device reset or interruption of active data paths.
What I/O standards are supported by XC6VLX130T-2FFG784I?
The XC6VLX130T-2FFG784I supports LVDS, SSTL-18/25, HSTL-I/II, and TMDS across its I/O banks. Each bank is independently powered (VCCO = 1.2–3.3 V), allowing mixed-voltage operation. Differential standards support data rates up to 1.25 Gb/s per pin pair, enabling direct interfacing with high-speed ADCs, memory controllers, and display interfaces.
What is the operating temperature range for XC6VLX130T-2FFG784I?
The XC6VLX130T-2FFG784I is rated for industrial temperature operation from –40°C to +100°C. This rating applies to the full speed grade –2 specification and requires adherence to thermal guidelines-including use of the exposed thermal pad and recommended PCB via array-to maintain junction temperature within safe limits under sustained logic and transceiver activity.
Is XC6VLX130T-2FFG784I pin-compatible with other Virtex-6 devices?
No, the XC6VLX130T-2FFG784I is not pin-compatible with other Virtex-6 devices due to differences in I/O bank arrangement, power pin distribution, and transceiver placement in the FFG784 package. Migration between Virtex-6 variants requires PCB redesign. Pin compatibility is only guaranteed within the same density and package variant group, such as XC6VLX130T-2FFG784C/I.
XC6VLX130T-2FFG784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-2FFG784I FAQ
1.How can I place an order for XC6VLX130T-2FFG784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-2FFG784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-2FFG784I reliable?
The price and inventory of XC6VLX130T-2FFG784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-2FFG784I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-2FFG784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-2FFG784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-2FFG784I?
XC6VLX130T-2FFG784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-2FFG784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-2FFG784I?
For technical support, including XC6VLX130T-2FFG784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-2FFG784I requirements.
6.How does Aetrix verify that XC6VLX130T-2FFG784I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-2FFG784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-2FFG784I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-2FFG784I?
All XC6VLX130T-2FFG784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-2FFG784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-2FFG784I part is unused and in its original packaging.
Return procedure for XC6VLX130T-2FFG784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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