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AMD XC6VLX130T-3FF784C
- Part No.:
- XC6VLX130T-3FF784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-3FF784C.pdf
- Description:
- IC FPGA 240 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,764
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Product details
Overview
XC6VLX130T-3FF784C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of total block RAM. It supports PCIe Gen2 x8, DDR3-800 memory interfaces, and operates at -3 speed grade with 0°C to 85°C industrial temperature range. Used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-3FF784C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (544 user I/Os), transceiver capability (24 GTP transceivers up to 3.75 Gb/s), power supply requirements (1.0V core, 2.5V/3.3V I/O), and thermal design for FF784 flip-chip BGA package.
Technical Context
The XC6VLX130T-3FF784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 GTP serial transceivers supporting protocols including SATA, SRIO, and CPRI, plus integrated PCI Express v2.0 endpoint hard IP.
It delivers 1,200 DSP48E1 slices for high-speed arithmetic, supports DDR3 memory controllers with 800 Mb/s data rates, and includes clock management tiles with MMCM and PLL for low-jitter clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations for filtering, FFT, and math-intensive algorithms |
| Block RAM | 16.4 Mb - supports large on-chip data buffering, FIFOs, and memory-mapped register files without external RAM |
| User I/O Pins | 544 - provides high-density interface connectivity for parallel buses, memory, and peripheral control |
| GTP Transceivers | 24 × 3.75 Gb/s - enables multi-protocol serial links including SATA, SRIO, and CPRI without external PHYs |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths in industrial temperature range |
| Operating Temp | 0°C to +85°C - validated for sustained operation in industrial environments without derating |
Pinout & Package
XC6VLX130T-3FF784C is housed in a 784-pin flip-chip fine-pitch BGA (FF784) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/Cu-Ni-Au surface finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG373.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary power supply | 2.5V supply for configuration circuitry, JTAG, and select I/O banks |
| VCCO_0 | I/O bank voltage | Programmable 1.2V–3.3V output driver voltage for Bank 0 I/Os |
| MR | Master reset | Active-low asynchronous reset that clears configuration memory and state machines |
| CLK_IN | Dedicated clock input | Low-skew global clock routing path into MMCM/PLL for system timing reference |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Hard IP Endpoint | Integrated endpoint logic eliminates need for soft-core PCIe controller and reduces latency by >30% vs. fabric-based implementations |
| DDR3 Memory Controller | Hard macro supporting 800 Mb/s data rate across up to 16-bit wide interfaces with built-in calibration and training |
| MMCM Clock Management | Multi-stage phase-shifting and frequency synthesis enabling sub-100 fs jitter performance for high-speed SerDes and ADC sampling clocks |
| Transceiver Power Gating | Selective shutdown of unused GTP lanes reduces dynamic power by up to 45% in burst-mode applications |
| Partial Reconfiguration Support | Enables runtime module swapping without full device reboot-critical for mission-critical communication and radar systems |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: High-throughput data path accelerator with deterministic latency for ADC sample ingestion and FFT computation. Use Value: 128K logic cells and 1.2K DSP slices enable concurrent processing of 16 independent receive channels at 125 MSPS. | Use Scenario: Image reconstruction pipeline in MRI and CT scanners requiring low-latency pixel data aggregation and filtering. IC Role / Device Role / Timing Role: Reconfigurable image co-processor interfacing with multiple ADCs and high-speed DDR3 frame buffers. Use Value: 544 user I/Os support simultaneous connection to 8× 16-bit ADCs and dual 16-bit DDR3 interfaces running at 800 Mb/s. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Deterministic packet routing and protocol translation engine with time-triggered scheduling. Use Value: Integrated PCIe Gen2 endpoint enables direct host CPU offload while GTP transceivers handle AFDX line-rate traffic at 100 Mbps. | Use Scenario: Bit-error-rate testing and protocol validation for 3G/4G baseband components. IC Role / Device Role / Timing Role: Programmable pattern generator and analyzer with precise timing control over multi-lane parallel interfaces. Use Value: MMCM-based clock synthesis achieves <150 fs RMS jitter, meeting JEDEC JESD204B subclass 1 timing compliance for 6.4 Gbps ADC/DAC links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-3FF1156C | Higher density: 240K logic cells, 2,080 DSP slices, 26.5 Mb BRAM, 720 user I/Os, larger FF1156 package | Required for designs exceeding 128K LC capacity or needing >24 transceivers; higher power and board area cost | Select when XC6VLX130T-3FF784C resource utilization exceeds 90% in critical paths or I/O count is insufficient |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture: 484K logic cells, 2,040 DSP slices, 32.1 Mb BRAM, 520 GTY transceivers up to 16.3 Gb/s, different pinout and power sequencing | Targets next-generation protocols (PCIe Gen3/Gen4, DDR4, 100G Ethernet); not pin-compatible; requires new PCB layout | Choose for migration paths requiring higher bandwidth, lower latency, or newer memory/interconnect standards beyond Virtex-6 capabilities |
Compared with XC6VLX130T-3FF784C, XC6VLX240T-3FF1156C offers scalable resources within the same architecture and toolflow, while XCKU060-2FFVA1156I delivers generational improvements in throughput and integration but demands full hardware redesign and Vivado-based development.
Availability
XC6VLX130T-3FF784C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-3FF784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. Xilinx pioneered high-performance programmable logic and remains a leader in adaptive computing solutions.
The Virtex-6 family was designed for demanding high-speed digital signal processing, wired communications infrastructure, and military/aerospace systems requiring deterministic timing and long-term reliability.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX130T-3FF784C?
The XC6VLX130T-3FF784C supports DDR3 memory interfaces up to 800 Mb/s per pin using its integrated hard memory controller. This capability is verified in Xilinx UG388 and applies to all I/O banks configured for SSTL15. The controller includes automatic write-leveling and read-leveling calibration sequences essential for stable operation at this rate.
Does XC6VLX130T-3FF784C include a built-in PCIe Gen2 endpoint?
Yes, XC6VLX130T-3FF784C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. This dedicated IP eliminates the need for soft-core implementations and guarantees timing closure for endpoint functions without consuming logic resources. Configuration is managed via dedicated AXI-lite interface.
What is the I/O voltage range supported by XC6VLX130T-3FF784C?
XC6VLX130T-3FF784C supports I/O voltages from 1.2V to 3.3V across its 14 configurable I/O banks. Each bank is independently powered, allowing mixed-voltage operation-for example, 1.8V for memory interfaces and 3.3V for legacy peripherals. VCCO levels must be set before configuration and remain stable during operation.
How many GTP transceivers does XC6VLX130T-3FF784C have, and what protocols do they support?
XC6VLX130T-3FF784C includes 24 GTP transceivers, each capable of 600 Mb/s to 3.75 Gb/s operation. Supported protocols include SATA I/II, Serial RapidIO 1.x, CPRI, and custom 8B/10B or 64B/66B encoded links. Protocol selection is configured via GT wizard and requires appropriate reference clock sources per UG371.
Is XC6VLX130T-3FF784C compatible with Xilinx ISE Design Suite?
Yes, XC6VLX130T-3FF784C is fully supported in Xilinx ISE Design Suite 14.7, the final release supporting Virtex-6 devices. Synthesis, place-and-route, and bitstream generation are validated for this tool version. Migration to Vivado is not supported for this part due to architectural differences and lack of device definition files.
XC6VLX130T-3FF784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-3FF784C FAQ
1.How can I place an order for XC6VLX130T-3FF784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-3FF784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-3FF784C reliable?
The price and inventory of XC6VLX130T-3FF784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-3FF784C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-3FF784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-3FF784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-3FF784C?
XC6VLX130T-3FF784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-3FF784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-3FF784C?
For technical support, including XC6VLX130T-3FF784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-3FF784C requirements.
6.How does Aetrix verify that XC6VLX130T-3FF784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-3FF784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-3FF784C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-3FF784C?
All XC6VLX130T-3FF784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-3FF784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-3FF784C part is unused and in its original packaging.
Return procedure for XC6VLX130T-3FF784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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