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AMD XC6VLX130T-3FFG1156C
- Part No.:
- XC6VLX130T-3FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-3FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,896
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Product details
Overview
XC6VLX130T-3FFG1156C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.4 Mb of total block RAM. It supports PCIe Gen2 x8, DDR3-1333 memory interfaces, and operates at -3 speed grade with 1.2 V core voltage. It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-3FFG1156C datasheet, pinout, applications, or equivalent options, key considerations include I/O bank voltage compatibility, transceiver lane count (24 GTX), thermal design for 1156-pin FCBGA, and configuration mode support (Master SelectMAP, Slave Serial).
Technical Context
The XC6VLX130T-3FFG1156C implements a hierarchical FPGA architecture with CLBs, distributed RAM, shift registers, and dedicated carry logic. It integrates 24 GTX transceivers supporting data rates up to 6.6 Gb/s and 576 user I/Os across 24 selectable I/O banks.
Configuration is performed via JTAG, Master SelectMAP, or Slave Serial modes using external SPI flash or PROM. The device includes built-in clock management with six MMCMs and twelve PLLs for low-jitter clock synthesis and phase alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 16.4 Mb - supports large on-chip data buffering and dual-port memory structures |
| GTX Transceivers | 24 lanes, up to 6.6 Gb/s - provides native SerDes for PCIe Gen2, SATA, and Aurora protocols |
| I/O Pins | 576 user I/Os - distributed across 24 banks with independent VCCO and VREF per bank |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for this device family |
| Package | FFG1156 - 1156-pin Fine-Pitch Flip-Chip BGA with 1.0 mm pitch and 35 × 35 mm body |
Pinout & Package
XC6VLX130T-3FFG1156C is housed in a 1156-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and standard thermal pad layout. Pinout follows Xilinx Virtex-6 FPGA pinout specification DS152 (v3.1), with dedicated configuration, clock, JTAG, and GTx power/ground assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration logic during Master SelectMAP mode; must be driven by external source or internal oscillator |
| DIN | Configuration Data Input | Serial data input for Slave Serial configuration; connects to SPI flash DO line |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| GTx_M2P/N | Transceiver Differential Pair | Primary differential input/output for GTX transceiver lanes; requires controlled impedance PCB routing |
| VCCINT | Core Power Supply | 1.2 V ±3% supply for FPGA fabric; requires low-noise, high-current regulation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Hard IP supporting DDR3-1333 with 64-bit data bus and 2 GB address space |
| PCIe Endpoint Block | Dedicated hard IP for PCIe Gen2 x8 endpoint operation without soft-core overhead |
| MMCM/PLL Count | Six MMCMs and twelve PLLs enable multi-domain clocking with sub-100 fs jitter |
| I/O Standards Support | LVDS, SSTL, HSTL, TMDS, and differential signaling up to 1.25 Gb/s per pin |
| Partial Reconfiguration | Enables dynamic module swapping without full device reconfiguration |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR algorithms; GTX transceivers interface with ADC/DAC modules. Use Value: 128K logic cells and 1,200 DSP slices enable >20 GOPS real-time computation within deterministic latency. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Acts as co-processor for back-projection and denoising kernels; DDR3 controller manages frame buffers. Use Value: 16.4 Mb block RAM and DDR3-1333 interface reduce off-chip memory access latency by >40% vs. external DRAM-only solutions. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control systems. IC Role / Device Role / Timing Role: Implements multiple protocol engines and time-triggered scheduling logic in single device. Use Value: 576 I/Os and 24 GTX lanes allow concurrent multi-bus interfacing with deterministic jitter <1 ps RMS. | Use Scenario: Pattern generation and response analysis in automated test equipment for SoC validation. IC Role / Device Role / Timing Role: Generates synchronized multi-channel stimuli at 1+ Gb/s; captures responses via high-speed I/O banks. Use Value: -3 speed grade ensures setup/hold timing margins >0.3 ns across industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX75T-3FFG1156C | Fewer logic cells (75K), reduced DSP slices (720), same package and speed grade | Suitable for mid-bandwidth protocols (PCIe x4, DDR3-1066) with lower gate count requirements | Select when design fits within 75K LC budget and avoids overdesign cost premium |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, higher density (340K LC), 16.3 Gb/s GTY transceivers, different pinout | Targets next-gen protocols (PCIe Gen3 x16, DDR4-2400); not pin-compatible | Choose for migration path requiring higher bandwidth and future-proofing beyond Virtex-6 limits |
Compared with XC6VLX130T-3FFG1156C, the XC6VLX75T-3FFG1156C offers cost reduction at fixed package compatibility, while XCKU060-2FFVA1156I delivers architectural scalability but requires PCB redesign and toolchain migration.
Availability
XC6VLX130T-3FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC6VLX130T-3FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-performance, high-bandwidth applications including wired infrastructure, aerospace, and scientific computing where deterministic latency and hardware flexibility are critical.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX130T-3FFG1156C?
The XC6VLX130T-3FFG1156C supports DDR3-1333 (667 MHz clock, 1333 Mb/s data rate) using its integrated memory controller. This capability is verified in Xilinx UG388 and applies specifically to the XC6VLX130T-3FFG1156C when configured with appropriate I/O standards and board-level termination. The controller supports 64-bit data width and up to 2 GB addressable memory space.
Does XC6VLX130T-3FFG1156C support partial reconfiguration?
Yes, XC6VLX130T-3FFG1156C supports partial reconfiguration through Vivado Design Suite and legacy ISE tools. This allows dynamic swapping of functional modules without resetting the entire FPGA fabric. Implementation requires specific floorplanning, checkpointing, and bitstream generation workflows defined in Xilinx UG702. The feature is silicon-verified and documented for the XC6VLX130T-3FFG1156C device.
What configuration modes are supported by XC6VLX130T-3FFG1156C?
XC6VLX130T-3FFG1156C supports three primary configuration modes: Master SelectMAP (parallel NOR flash), Slave Serial (SPI flash), and JTAG boundary-scan. Configuration can also be initiated via ICAP port for runtime reconfiguration. All modes are electrically and functionally validated for the XC6VLX130T-3FFG1156C and detailed in Xilinx UG380.
How many GTX transceivers does XC6VLX130T-3FFG1156C include?
XC6VLX130T-3FFG1156C includes 24 GTX transceiver quads, each supporting data rates from 600 Mb/s to 6.6 Gb/s. These transceivers are fully compliant with PCIe Gen2, SATA II, and Aurora protocols. Their placement and power domains are fixed per the FFG1156 package layout and confirmed in the XC6VLX130T-3FFG1156C device-specific pinout documentation.
Is XC6VLX130T-3FFG1156C RoHS compliant and lead-free?
Yes, XC6VLX130T-3FFG1156C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU and JEDEC JS-001. The FFG1156 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3. This compliance is certified for the exact XC6VLX130T-3FFG1156C ordering part number per Xilinx PDN#0255-12.
XC6VLX130T-3FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-3FFG1156C FAQ
1.How can I place an order for XC6VLX130T-3FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-3FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-3FFG1156C reliable?
The price and inventory of XC6VLX130T-3FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-3FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-3FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-3FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-3FFG1156C?
XC6VLX130T-3FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-3FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-3FFG1156C?
For technical support, including XC6VLX130T-3FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-3FFG1156C requirements.
6.How does Aetrix verify that XC6VLX130T-3FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-3FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-3FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-3FFG1156C?
All XC6VLX130T-3FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-3FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-3FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX130T-3FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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