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AMD XC6VLX130T-3FFG784C
- Part No.:
- XC6VLX130T-3FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-3FFG784C.pdf
- Description:
- IC FPGA 240 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC6VLX130T-3FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.5 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -3 speed grade with 1.2 V core voltage. It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-3FFG784C datasheet, pinout, applications, or equivalent options, key considerations include I/O bank voltage support (1.2–3.3 V), transceiver compliance with PCIe Gen2 and SATA, thermal design for 784-pin FFG package, and configuration interface options (SPI/BPI).
Technical Context
The XC6VLX130T-3FFG784C implements a hierarchical FPGA architecture with CLBs, distributed RAM, shift registers, and dedicated carry logic. It integrates 24 RocketIO GTP transceivers supporting 1.25–6.6 Gb/s data rates and compliant with PCIe Gen2, SATA, and Serial RapidIO standards.
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG, with support for multi-boot and fallback modes. The device uses 40 nm process technology and includes integrated clock management tiles (CMTs) with DCMs and PLLs for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 × DSP48E1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 16.5 Mb - supports large on-chip data buffering and FIFOs without external memory |
| Transceiver Speed | 1.25–6.6 Gb/s - enables native interface to PCIe Gen2 x4, SATA II, and SRIO 1.2 |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR2/DDR3 memory and ADC/DAC peripherals |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
Pinout & Package
The XC6VLX130T-3FFG784C is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires PCB thermal via array per Xilinx UG373.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI/BPI/JTAG) and bus width during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated or internally derived |
| DIN / DOUT | Serial Configuration Data | Carries bitstream during Master SPI mode; bidirectional in Slave SelectMAP |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration success or error |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and restarts boot sequence |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for GTP transceiver banks; must meet jitter and slew rate specs per UG371 |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management (CMT) | Two DCMs + one PLL per CMT enable independent clock domain generation and phase alignment |
| PCIe Gen2 Endpoint Support | Hard IP blocks reduce RTL integration effort and guarantee protocol compliance without soft-core overhead |
| Partial Reconfiguration Capability | Allows dynamic module swapping in-system without full reconfiguration, reducing downtime |
| Advanced Power Management | Multiple power rails (VCCINT, VCCAUX, VCCO) with independent sequencing control minimize inrush current |
| Multi-Boot with Fallback | Enables field-upgradable designs with verified backup configuration stored in SPI flash |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: XC6VLX130T-3FFG784C serves as the primary reconfigurable compute engine, synchronizing ADC sampling, FFT execution, and CFAR detection pipelines. Use Value: 1,200 DSP48E1 slices deliver >200 GOPS peak throughput for adaptive filtering under deterministic latency constraints. | Use Scenario: High-speed image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: XC6VLX130T-3FFG784C hosts custom back-projection and denoising kernels, interfacing directly with 16-bit ADCs and DDR3 frame buffers. Use Value: 16.5 Mb block RAM enables full-slice matrix storage, eliminating off-chip memory bottlenecks during reconstruction loops. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control systems. IC Role / Device Role / Timing Role: XC6VLX130T-3FFG784C implements deterministic time-triggered communication stacks with hardware timestamping and CRC acceleration. Use Value: 24 GTP transceivers support concurrent AFDX (100 Mbps) and discrete avionics bus interfaces with sub-microsecond jitter. | Use Scenario: Bit-error-rate testing and protocol validation for 3 Gb/s serial links. IC Role / Device Role / Timing Role: XC6VLX130T-3FFG784C generates and analyzes PRBS patterns while embedding real-time eye-diagram sampling logic. Use Value: Transceiver PMA/PMD calibration registers allow per-lane equalization tuning to match channel loss profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-3FFG1156C | Higher logic density (240K LC), larger FFG1156 package, +20% DSP slices, same architecture and toolchain | Required when design exceeds XC6VLX130T routing resources or needs >16.5 Mb on-chip memory | Select if scalability beyond 128K LC is needed; verify PCB redesign for 1156-ball footprint |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 20 nm process, higher DSP efficiency, no native PCIe Gen2 hard IP (requires soft IP) | Suitable for new designs targeting lower power per GOPS and migration path to UltraScale+ | Choose for greenfield projects prioritizing power efficiency and long-term roadmap; not drop-in compatible |
Compared with XC6VLX130T-3FFG784C, the XC6VLX240T offers scalable capacity within the same Virtex-6 family, while the XCKU060 represents a generational shift with improved power efficiency but requires architectural re-evaluation and toolchain migration.
Availability
XC6VLX130T-3FFG784C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentration requiring stable component supply across extended production lifecycles.
Supply support for XC6VLX130T-3FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-6 family was designed for high-performance, bandwidth-intensive applications such as wired communications infrastructure, defense signal processing, and scientific computing where deterministic latency and hardware flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-3FFG784C?
The XC6VLX130T-3FFG784C supports transceiver data rates from 1.25 Gb/s up to 6.6 Gb/s using its integrated RocketIO GTP transceivers. This range enables compliance with PCIe Gen2 (5.0 GT/s), SATA II (3.0 Gb/s), and Serial RapidIO 1.2 (3.125–6.25 Gb/s) protocols. Performance is guaranteed at speed grade -3 under specified voltage and temperature conditions per Xilinx UG371.
Does XC6VLX130T-3FFG784C support partial reconfiguration?
Yes, XC6VLX130T-3FFG784C supports partial reconfiguration through dedicated ICAP (Internal Configuration Access Port) and PCIe-based configuration interfaces. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling runtime adaptation in radar and test equipment applications. Implementation requires Vivado Design Suite 2019.1 or later with appropriate license.
What configuration modes are supported by XC6VLX130T-3FFG784C?
XC6VLX130T-3FFG784C supports Master SPI, Slave SelectMAP, JTAG, and system-level configuration via ICAP. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is commonly used for single-flash boot; Slave SelectMAP enables high-speed parallel loading from microcontrollers. All modes support multi-boot and fallback recovery per Xilinx UG380.
What is the I/O voltage range supported by XC6VLX130T-3FFG784C banks?
XC6VLX130T-3FFG784C supports I/O voltages from 1.2 V to 3.3 V across configurable banks, enabling direct interface with DDR2/DDR3 memory, CMOS sensors, and legacy TTL peripherals. Each bank is independently powered, allowing mixed-voltage operation. Bank-specific settings are defined in the UCF or XDC constraint files during implementation.
Is XC6VLX130T-3FFG784C pin-compatible with other Virtex-6 devices?
No, XC6VLX130T-3FFG784C is not pin-compatible with other Virtex-6 devices due to differing package footprints and I/O bank arrangements. For example, XC6VLX240T uses FFG1156, while XC6VLX75T uses FFG484. Migration between Virtex-6 variants requires PCB redesign. Pin compatibility is only maintained within identical package variants (e.g., XC6VLX130T-3FFG784C vs. -2FFG784C).
XC6VLX130T-3FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-3FFG784C FAQ
1.How can I place an order for XC6VLX130T-3FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-3FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-3FFG784C reliable?
The price and inventory of XC6VLX130T-3FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-3FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-3FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-3FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-3FFG784C?
XC6VLX130T-3FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-3FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-3FFG784C?
For technical support, including XC6VLX130T-3FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-3FFG784C requirements.
6.How does Aetrix verify that XC6VLX130T-3FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-3FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-3FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-3FFG784C?
All XC6VLX130T-3FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-3FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-3FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX130T-3FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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