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AMD XC6VLX130T-L1FF1156I
- Part No.:
- XC6VLX130T-L1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-L1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC6VLX130T-L1FF1156I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.8 Mb of block RAM. It supports PCIe Gen2 x8, DDR3-1333 memory interfaces, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing systems for radar and software-defined radio.
For engineers reviewing the XC6VLX130T-L1FF1156I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (600 user I/Os), transceiver line rate (6.6 Gb/s), thermal design power (17.5 W typical), and configuration interface (SPIx4, SelectMAP).
Technical Context
The XC6VLX130T-L1FF1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 multi-gigabit transceivers supporting protocols including SATA, SRIO, and CPRI.
Configuration is performed via Master SPI or Slave SelectMAP mode using external PROM or processor. JTAG boundary-scan supports IEEE 1149.1 compliance for testing and programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational/sequential logic capacity |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations for filtering and FFT |
| Block RAM | 16.8 Mb - supports large on-chip data buffering and FIFO implementation |
| User I/Os | 600 - provides high-density interface connectivity to external peripherals and memory |
| Transceiver Speed | 6.6 Gb/s - enables serial links for high-speed interconnects like CPRI and SRIO |
| Speed Grade | -1 - specifies timing performance margin for worst-case industrial temperature operation |
| Operating Temp | -40°C to +100°C - validated for extended industrial environments without derating |
Pinout & Package
The XC6VLX130T-L1FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) package with 35×35 mm body size and 1.0 mm ball pitch. It features four banks of high-speed differential I/Os, dedicated configuration pins (INIT_B, CCLK, DONE), and 24 MGT transceiver pairs routed to specific ball rows/columns.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during Master SPI mode |
| INIT_B | Configuration Initialization | Active-low signal indicating PROM readiness and clearing configuration memory |
| DONE | Configuration Completion | Open-drain output confirming successful bitstream loading and device initialization |
| MGTAVCC | Analog Transceiver Supply | 1.0 V supply for analog circuitry in multi-gigabit transceivers |
| VRP/VRN | Reference Voltage Terminals | Provide termination reference for differential I/O standards (e.g., LVDS, TMDS) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP block enabling direct root-complex–compatible endpoint functionality without soft-core overhead |
| DDR3-1333 Interface | Dedicated memory controller supporting 16-bit/32-bit wide interfaces up to 1333 Mb/s data rate |
| 24 MGT Transceivers | Each supports 600 Mb/s–6.6 Gb/s line rates with built-in 8B/10B encoding and clock correction |
| Configurable I/O Standards | Supports LVCMOS, SSTL, HSTL, LVDS, and TMDS across all banks with per-bank voltage control |
| Partial Reconfiguration | Enables dynamic module swapping in runtime without full device reset or system interruption |
Applications
| Radar Signal Processing | Software-Defined Radio (SDR) |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: XC6VLX130T-L1FF1156I serves as the primary baseband processing engine, synchronizing ADC/DAC sampling clocks and managing high-throughput data flow between RF front-end and host processor. Use Value: 1,200 DSP48E1 slices enable concurrent 256-point FFTs at 100 MHz update rate; 600 I/Os support parallel LVDS links to multiple ADCs. | Use Scenario: Multi-band, multi-standard wireless base station transceivers requiring protocol agility and spectral efficiency. IC Role / Device Role / Timing Role: XC6VLX130T-L1FF1156I implements channelization filters, digital up/down converters, and MAC-layer offload functions with deterministic latency. Use Value: 24 MGT transceivers handle eight independent 3.072 Gb/s CPRI lanes; PCIe Gen2 x8 enables low-latency backhaul to host CPU. |
| Medical Imaging Backend | High-Speed Test Equipment |
Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanners using raw k-space or projection data. IC Role / Device Role / Timing Role: XC6VLX130T-L1FF1156I executes iterative reconstruction algorithms while interfacing with high-speed frame grabbers and GPU co-processors. Use Value: 16.8 Mb block RAM buffers full-frame sinogram data; DDR3-1333 interface sustains 10.6 GB/s memory bandwidth for streaming compute kernels. | Use Scenario: Automated test equipment (ATE) for semiconductor wafer probing requiring sub-nanosecond timing resolution and pattern generation. IC Role / Device Role / Timing Role: XC6VLX130T-L1FF1156I acts as the pattern generator and response analyzer core, synchronizing multiple precision timing channels and DUT interface logic. Use Value: -1 speed grade guarantees setup/hold timing closure at 500 MHz system clock; 600 I/Os drive 128-channel parallel test vectors with programmable slew rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5× more logic cells, higher transceiver density (48 GTY), but requires new PCB layout | Targets next-gen 5G massive MIMO and AI-accelerated imaging where XC6VLX130T-L1FF1156I lacks throughput headroom | Select when migrating legacy designs needing >200 Gb/s aggregate I/O bandwidth and PCIe Gen3/Gen4 support |
| XC6SLX150T-3FGG900C | Lower density (147K LC), no MGT transceivers, only 333 MHz max I/O speed, commercial temp range (0°C to +85°C) | Suitable for cost-sensitive industrial control or video processing where serial interconnects are not required | Select only if design fits within reduced logic and memory resources and does not require high-speed serial links or industrial temperature operation |
Compared with XC6VLX130T-L1FF1156I, the XCVU9P-2FLGA2104I delivers significantly higher throughput but demands full hardware redesign, while the XC6SLX150T-3FGG900C offers lower cost and power at the expense of transceiver capability and thermal robustness - making XC6VLX130T-L1FF1156I the optimal balance for established high-speed serial applications in harsh environments.
Availability
XC6VLX130T-L1FF1156I is available at Aetrix Electronics and suitable for radar signal processing, software-defined radio, and medical imaging backend systems requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX130T-L1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI processors for data center, edge, and embedded markets.
The Virtex-6 family was designed for high-performance logic, signal processing, and serial connectivity in aerospace, defense, and medical imaging applications where reliability and deterministic timing are critical.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX130T-L1FF1156I?
The XC6VLX130T-L1FF1156I supports DDR3 memory interfaces up to 1333 Mb/s data rate using its integrated memory controller. This is validated across all I/O banks configured for SSTL15 standards and requires proper board-level termination and timing closure per UG373. The XC6VLX130T-L1FF1156I achieves this rate with 16- or 32-bit bus widths and supports both single-ended and differential clocking schemes.
Does XC6VLX130T-L1FF1156I support partial reconfiguration?
Yes, the XC6VLX130T-L1FF1156I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This allows dynamic swapping of functional modules-such as filter banks or protocol engines-without resetting the entire device. The XC6VLX130T-L1FF1156I requires use of Xilinx ISE Design Suite 14.7 or later with appropriate floorplanning constraints to implement secure, timing-predictable partial bitstreams.
What configuration modes are supported by XC6VLX130T-L1FF1156I?
The XC6VLX130T-L1FF1156I supports Master SPI, Slave SelectMAP, JTAG, and System ACE configuration modes. Master SPI uses an internal oscillator to clock external serial PROM; Slave SelectMAP enables processor-controlled loading via parallel bus. All modes are electrically and functionally verified per DS152 specification. The XC6VLX130T-L1FF1156I requires correct INIT_B and DONE pin handling regardless of mode selected.
Is XC6VLX130T-L1FF1156I qualified for automotive applications?
No, the XC6VLX130T-L1FF1156I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and enhanced ESD/latch-up immunity required for automotive ECUs. For automotive use, designers must select Xilinx Automotive-grade Virtex-6 variants (e.g., XC6VLX130T-1FF1156I with -A suffix) or newer AMD Versal derivatives with formal automotive qualification.
What is the thermal design power (TDP) of XC6VLX130T-L1FF1156I under typical operating conditions?
The XC6VLX130T-L1FF1156I has a typical thermal design power of 17.5 W when operating at full utilization with DDR3 and transceivers active. This value is derived from Xilinx Power Estimator (XPE) v14.7 using default settings for industrial temperature and -1 speed grade. Actual power varies with design utilization, I/O activity, and voltage scaling; the XC6VLX130T-L1FF1156I requires a heatsink with ≤ 12°C/W junction-to-ambient thermal resistance for reliable operation at maximum ambient temperature.
XC6VLX130T-L1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-L1FF1156I FAQ
1.How can I place an order for XC6VLX130T-L1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-L1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-L1FF1156I reliable?
The price and inventory of XC6VLX130T-L1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-L1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-L1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-L1FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-L1FF1156I?
XC6VLX130T-L1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-L1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-L1FF1156I?
For technical support, including XC6VLX130T-L1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-L1FF1156I requirements.
6.How does Aetrix verify that XC6VLX130T-L1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-L1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-L1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-L1FF1156I?
All XC6VLX130T-L1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-L1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-L1FF1156I part is unused and in its original packaging.
Return procedure for XC6VLX130T-L1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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