Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC6VLX130T-L1FF784I

Part No.:
XC6VLX130T-L1FF784I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
784-BBGA, FCBGA
Datasheet:
AetrixXC6VLX130T-L1FF784I.pdf
Description:
IC FPGA 400 I/O 784FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,187

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC6VLX130T-L1FF784I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 130 DSP48E1 slices, 12.8 Gb/s transceiver capability, and embedded Block RAM totaling 6,635 kbits. It serves as a high-performance programmable logic fabric in radar signal processing systems requiring deterministic latency and multi-gigabit serial I/O.

For engineers reviewing the XC6VLX130T-L1FF784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with JESD204B, LVDS-2.5V I/O support, -1 speed grade timing margin, and thermal performance under sustained 1.2W core power dissipation.

Technical Context

The XC6VLX130T-L1FF784I implements a 40 nm CMOS architecture with configurable logic blocks (CLBs), dedicated DSP slices for fixed-point arithmetic, and integrated GTP transceivers supporting 600 Mb/s to 3.75 Gb/s line rates. It includes SelectIO technology enabling single-ended and differential standards including LVCMOS, SSTL, HSTL, and LVDS.

Configuration occurs via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports partial reconfiguration and operates across industrial temperature range (–40°C to +100°C junction).

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells128,000 - total available LUTs+FFs for combinatorial and sequential logic implementation
DSP Slices130 × DSP48E1 - each performs 25×18-bit multiply-accumulate with pipeline registers
Transceiver Speed600 Mb/s to 3.75 Gb/s - GTP transceiver line rate range compliant with PCIe Gen1/Gen2 and SRIO Gen1/Gen2
Block RAM6,635 kbits - distributed as 36-kbit dual-port RAM primitives usable for FIFOs or lookup tables
I/O StandardsLVDS-2.5V, SSTL-18, HSTL-I, LVCMOS - supports mixed-voltage bank operation with per-bank VCCO
Speed Grade-1 - guarantees timing closure at worst-case industrial temperature and voltage conditions
Operating Temp–40°C to +100°C (junction) - validated for extended industrial and aerospace-qualified thermal profiles

Pinout & Package

XC6VLX130T-L1FF784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG784) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.

Pin/TerminalCircuit RoleDesign Meaning
M2GTPCLK0_M2PDedicated differential input for primary GTP transceiver reference clock (positive)
M1GTPCLK0_M2NDedicated differential input for primary GTP transceiver reference clock (negative)
A19MRCC0_0Multi-Region Clock Capable input - supports global clock routing with low skew
P17VCCAUX1.8 V auxiliary supply for configuration logic, transceivers, and I/O banks
T18VCCINT1.2 V core supply - powers CLBs, interconnect, and block RAM
R15GNDGround reference for analog and digital domains - requires dedicated plane partitioning

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping without full device reset - critical for adaptive radar waveform updates
SEU Mitigation LogicIntegrated error detection and correction for configuration memory - meets RTAX-level reliability requirements
Embedded AES EncryptionHardware-accelerated bitstream decryption using 256-bit keys - prevents IP theft during configuration
Multi-Voltage I/O Banks14 independent banks with selectable VCCO (1.2V–3.3V) - allows direct interfacing with legacy and modern peripherals
Configurable Transceiver PLLsPer-transceiver CPLL and QPLL with fractional-N synthesis - enables precise JESD204B lane alignment

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: Programmable logic fabric executing time-critical FFTs, CFAR detection, and digital down-conversion pipelines.

Use Value: Deterministic latency (< 5 ns jitter on clock networks) and 130 DSP slices enable simultaneous multi-channel processing at 12-bit resolution.

Use Scenario: High-throughput data aggregation and preprocessing in ultrasound and MRI backend subsystems.

IC Role / Device Role / Timing Role: Interface bridge between ADC front-end modules and PCIe Gen2 host interface with real-time packetization.

Use Value: GTP transceivers support 3.125 Gb/s JESD204B links to 16-bit, 125 MSPS ADCs while maintaining sub-100 ps channel-to-channel skew.

Avionics Data ConcentratorsHigh-Speed Test Equipment

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers.

IC Role / Device Role / Timing Role: Deterministic packet switching engine with time-triggered scheduling and CRC offload.

Use Value: -1 speed grade ensures guaranteed timing closure under –40°C to +100°C junction conditions required for DO-254 certification.

Use Scenario: Pattern generation and response analysis in automated test equipment for DDR3/DDR4 memory validation.

IC Role / Device Role / Timing Role: High-speed digital pattern generator with synchronized multi-lane output and real-time error injection.

Use Value: 784-ball FFG package provides >300 user I/Os with <1.5 ps RMS jitter on LVDS outputs for sub-100 ps timing resolution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FFVB2104I16 nm process, 2,586K logic cells, 60 GTY transceivers up to 32.75 Gb/sHigher bandwidth and lower power per logic cell; requires new PCB layout and updated toolchainPreferred for new designs targeting >10 Gb/s serial I/O or AI-accelerated compute offload
XC7VX485T-2FFG1761I28 nm process, 485,760 logic cells, 36 GTX transceivers up to 13.1 Gb/sIntermediate density and transceiver capability; pin-compatible with some Virtex-6 migration pathsSuitable for upgrades where existing board space and thermal envelope constrain full Virtex-UltraScale adoption

Compared with XC6VLX130T-L1FF784I, the XCVU9P offers 2× logic capacity and 8× transceiver bandwidth but demands new PCB design and Vivado 2020.1+, while the XC7VX485T delivers higher logic density within similar thermal constraints and supports partial migration from Virtex-6 toolchains.

Availability

XC6VLX130T-L1FF784I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX130T-L1FF784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development of high-performance adaptive computing platforms for aerospace, defense, and industrial markets.

The Virtex-6 family was designed for applications demanding high logic density, multi-gigabit serial connectivity, and deterministic real-time processing - especially in radar, imaging, and deterministic networking.

FAQ

What is the maximum supported transceiver line rate for XC6VLX130T-L1FF784I?

The XC6VLX130T-L1FF784I integrates GTP transceivers with a maximum line rate of 3.75 Gb/s. This supports protocols including PCIe Gen2 (5.0 GT/s encoded), SRIO Gen2 (6.25 GT/s encoded), and JESD204B subclass 0/1. The -1 speed grade ensures reliable operation at this rate under industrial temperature and voltage extremes.

Does XC6VLX130T-L1FF784I support partial reconfiguration?

Yes, XC6VLX130T-L1FF784I supports hardware-accelerated partial reconfiguration through Xilinx ISE Design Suite 14.7. This enables dynamic replacement of logic modules without resetting the entire device - essential for adaptive radar waveform updates and runtime protocol switching in avionics systems.

What I/O standards are supported by XC6VLX130T-L1FF784I?

XC6VLX130T-L1FF784I supports LVDS-2.5V, SSTL-18, HSTL-I, LVCMOS (1.2V–3.3V), and differential standards including BLVDS and RSDS. Each of its 14 I/O banks operates independently with selectable VCCO, allowing mixed-voltage interfaces to coexist on a single device.

What is the operating temperature range for XC6VLX130T-L1FF784I?

The XC6VLX130T-L1FF784I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is validated per Xilinx DS152 and applies to all speed grades, including the -1 grade used in this variant.

Is XC6VLX130T-L1FF784I compatible with Xilinx ISE or Vivado tools?

XC6VLX130T-L1FF784I is supported exclusively by Xilinx ISE Design Suite 14.7 and earlier versions. It is not supported in Vivado - which targets 7-series and newer architectures. Migration to Vivado requires architectural redesign using XC7VX485T or later families.

XC6VLX130T-L1FF784I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
784-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10000
Number of Logic Elements/Cells:
128000
Total RAM Bits:
9732096
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.91V ~ 0.97V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
784-FCBGA (29x29)

XC6VLX130T-L1FF784I FAQ

1.How can I place an order for XC6VLX130T-L1FF784I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX130T-L1FF784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX130T-L1FF784I reliable?

The price and inventory of XC6VLX130T-L1FF784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-L1FF784I is usually 5 days.

3.What payment methods are accepted for XC6VLX130T-L1FF784I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-L1FF784I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX130T-L1FF784I?

XC6VLX130T-L1FF784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX130T-L1FF784I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX130T-L1FF784I?

For technical support, including XC6VLX130T-L1FF784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-L1FF784I requirements.

6.How does Aetrix verify that XC6VLX130T-L1FF784I is sourced from the original manufacturer or authorized distributors?

All XC6VLX130T-L1FF784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-L1FF784I meets industry standards.

7.What is the process for return or replacement of XC6VLX130T-L1FF784I?

All XC6VLX130T-L1FF784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-L1FF784I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX130T-L1FF784I part is unused and in its original packaging.

Return procedure for XC6VLX130T-L1FF784I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX130T-L1FF784I Tags

  • XC6VLX130T-L1FF784I
  • XC6VLX130T-L1FF784I PDF
  • XC6VLX130T-L1FF784I Datasheet
  • XC6VLX130T-L1FF784I Specifications
  • XC6VLX130T-L1FF784I Images
  • AMD
  • AMD XC6VLX130T-L1FF784I
  • Buy XC6VLX130T-L1FF784I
  • XC6VLX130T-L1FF784I Price
  • XC6VLX130T-L1FF784I Distributor
  • XC6VLX130T-L1FF784I Supplier
  • XC6VLX130T-L1FF784I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER