AMD XC6VLX130T-L1FFG1156C
- Part No.:
- XC6VLX130T-L1FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-L1FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX130T-L1FFG1156C from AMD is a Virtex-6 LX family FPGA with 130,944 logic cells, 12.8 Gb/s transceiver capability, and -1 speed grade, designed for high-performance serial connectivity in wired infrastructure and test equipment.
For engineers reviewing the XC6VLX130T-L1FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (600), transceiver lane count (24), block RAM capacity (6,840 kbits), and thermal performance in FFG1156 package.
Technical Context
The XC6VLX130T-L1FFG1156C implements a 40 nm CMOS architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It features dedicated DSP48E1 slices for high-speed arithmetic and configurable clock management tiles with PLLs and MMCMs.
Configuration is performed via SelectMAP, JTAG, or SPI interface with dual-boot support. The device supports partial reconfiguration and includes hardened Ethernet MAC blocks for 10/100/1000BASE-T applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 130,944 - total configurable LUTs + flip-flops for logic implementation |
| I/O Pins | 600 - user-configurable single-ended or differential I/O in FFG1156 package |
| Transceivers | 24 lanes @ up to 12.8 Gb/s - supports PCIe Gen2 x8, SATA II, SRIO 2.1 |
| Block RAM | 6,840 kbits - distributed as 144 x 36-kbit RAMB18E1 and 72 x 72-kbit RAMB36E1 |
| DSP Slices | 640 - each with 25×18 multiplier, 48-bit accumulator, and pipeline registers |
| Speed Grade | -1 - guaranteed timing performance at industrial temperature range (0°C to 85°C) |
Pinout & Package
XC6VLX130T-L1FFG1156C is housed in a 1156-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs |
| VCCAUX | Auxiliary power supply | 2.5 V ±3% supply for configuration, clocking, and transceivers |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank for interface voltage level matching |
| M0–M2 | Configuration mode pins | Set boot mode (e.g., Master SelectMAP, JTAG, SPI) |
| CCLK | Configuration clock | Input clock for slave parallel or serial configuration |
| INIT_B | Configuration status | Open-drain output indicating configuration status and error flag |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express® Endpoint | Hard IP block supporting Gen2 x1/x2/x4/x8 with AXI interface |
| Low-power 40 nm process | Reduces dynamic and static power vs. 65 nm Virtex-5, enabling higher density at same thermal envelope |
| Partial Reconfiguration | Enables runtime logic updates without full device reset or system interruption |
| Multi-Standard Transceivers | Single transceiver lane configurable for PCIe, SATA, SRIO, or custom protocols |
| Advanced Clock Management | Each CMT contains one PLL and two MMCMs for jitter filtering and phase alignment |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and MIMO signal processing in LTE/5G remote radio units. IC Role / Device Role / Timing Role: Programmable baseband processor implementing adaptive filtering, FFT, and channel estimation pipelines. Use Value: 640 DSP48E1 slices enable concurrent 4×4 MIMO matrix inversion at >100 MHz clock rate with deterministic latency. | Use Scenario: High-accuracy bit-error-rate testing of 10 GbE and Fibre Channel links. IC Role / Device Role / Timing Role: Protocol-aware pattern generator and error detector with embedded PRBS engines and eye diagram analysis logic. Use Value: 24 transceiver lanes support simultaneous multi-port stress testing without external muxing or retiming. |
| Medical Imaging Backend | Avionics Data Concentrators |
Use Scenario: Real-time image reconstruction and beamforming in ultrasound and MRI systems. IC Role / Device Role / Timing Role: High-throughput data aggregator and accelerator interfacing with ADCs, DDR3 memory, and display controllers. Use Value: 600 I/O pins allow direct connection to >16 high-speed ADC channels plus dual DDR3 interfaces at 800 Mbps. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic network interface controller with time-triggered scheduling and redundancy management. Use Value: Hardened Ethernet MACs and deterministic clocking ensure sub-1 µs jitter for AFDX end-system timing compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 350K logic cells, 28 Gb/s transceivers, -2L speed grade | Higher bandwidth and lower latency for 5G fronthaul and AI inference acceleration | Better suited when migrating to 16 nm node for power/performance scaling beyond Virtex-6 limits |
| XC7VX485T-2FFG1761I | 7-series architecture, 485K logic cells, 13.1 Gb/s transceivers, -2 speed grade, industrial temp | Enhanced SERDES reliability and extended temperature operation for harsh environments | Preferred for new designs requiring long-term availability and qualification for aerospace/industrial use |
Compared with XC6VLX130T-L1FFG1156C, the XCVU3P-2FFVD1760E delivers 2.7× more logic and 2.2× higher transceiver speed but requires board redesign; the XC7VX485T-2FFG1761I offers 3.7× more logic and improved thermal margin while maintaining similar I/O voltage flexibility and configuration compatibility.
Availability
XC6VLX130T-L1FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-L1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Virtex-6 family was engineered for wireline communications, military/aerospace signal processing, and high-end test instrumentation demanding deterministic timing and multi-protocol serial connectivity.
FAQ
What is the maximum supported transceiver data rate for XC6VLX130T-L1FFG1156C?
The XC6VLX130T-L1FFG1156C supports transceiver data rates up to 12.8 Gb/s per lane. This enables compliance with PCIe Gen2, SATA II, and SRIO 2.1 standards. All 24 transceiver lanes in the XC6VLX130T-L1FFG1156C are rated for this maximum rate under industrial temperature conditions and -1 speed grade timing constraints.
Does XC6VLX130T-L1FFG1156C support partial reconfiguration?
Yes, the XC6VLX130T-L1FFG1156C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This allows dynamic logic updates in designated regions without resetting the entire device or interrupting active I/O or transceiver operations, a capability confirmed in UG372 and validated in production deployments of wireless baseband systems using XC6VLX130T-L1FFG1156C.
What configuration modes are supported by XC6VLX130T-L1FFG1156C?
The XC6VLX130T-L1FFG1156C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from external flash, host processor, or boundary-scan chain, with fallback support enabled via INIT_B assertion handling.
Is XC6VLX130T-L1FFG1156C qualified for industrial temperature operation?
Yes, the XC6VLX130T-L1FFG1156C is specified for industrial temperature range (0°C to +85°C ambient) per its -1 speed grade designation. Thermal performance validation includes junction temperature monitoring under worst-case power dissipation scenarios, and the FFG1156 package provides sufficient thermal resistance for passive cooling in typical 1U chassis environments.
What I/O standards are supported by XC6VLX130T-L1FFG1156C?
The XC6VLX130T-L1FFG1156C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, BLVDS, RSDS, and TMDS I/O standards. Each of its 600 I/O pins is assignable to one of 24 selectable I/O banks, with independent VCCO and reference voltage settings per bank to enable mixed-voltage interface designs.
XC6VLX130T-L1FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX130T-L1FFG1156C FAQ
1.How can I place an order for XC6VLX130T-L1FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-L1FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-L1FFG1156C reliable?
The price and inventory of XC6VLX130T-L1FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-L1FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-L1FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-L1FFG1156C transactions.
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XC6VLX130T-L1FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-L1FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-L1FFG1156C?
For technical support, including XC6VLX130T-L1FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-L1FFG1156C requirements.
6.How does Aetrix verify that XC6VLX130T-L1FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-L1FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-L1FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-L1FFG1156C?
All XC6VLX130T-L1FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-L1FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-L1FFG1156C part is unused and in its original packaging.
Return procedure for XC6VLX130T-L1FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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