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AMD XC6VLX130T-L1FFG1156C

Part No.:
XC6VLX130T-L1FFG1156C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VLX130T-L1FFG1156C.pdf
Description:
IC FPGA 600 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,872

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Product details

Overview

XC6VLX130T-L1FFG1156C from AMD is a Virtex-6 LX family FPGA with 130,944 logic cells, 12.8 Gb/s transceiver capability, and -1 speed grade, designed for high-performance serial connectivity in wired infrastructure and test equipment.

For engineers reviewing the XC6VLX130T-L1FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (600), transceiver lane count (24), block RAM capacity (6,840 kbits), and thermal performance in FFG1156 package.

Technical Context

The XC6VLX130T-L1FFG1156C implements a 40 nm CMOS architecture with integrated multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It features dedicated DSP48E1 slices for high-speed arithmetic and configurable clock management tiles with PLLs and MMCMs.

Configuration is performed via SelectMAP, JTAG, or SPI interface with dual-boot support. The device supports partial reconfiguration and includes hardened Ethernet MAC blocks for 10/100/1000BASE-T applications.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells130,944 - total configurable LUTs + flip-flops for logic implementation
I/O Pins600 - user-configurable single-ended or differential I/O in FFG1156 package
Transceivers24 lanes @ up to 12.8 Gb/s - supports PCIe Gen2 x8, SATA II, SRIO 2.1
Block RAM6,840 kbits - distributed as 144 x 36-kbit RAMB18E1 and 72 x 72-kbit RAMB36E1
DSP Slices640 - each with 25×18 multiplier, 48-bit accumulator, and pipeline registers
Speed Grade-1 - guaranteed timing performance at industrial temperature range (0°C to 85°C)

Pinout & Package

XC6VLX130T-L1FFG1156C is housed in a 1156-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant construction.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0 V ±3% supply for FPGA fabric and CLBs
VCCAUXAuxiliary power supply2.5 V ±3% supply for configuration, clocking, and transceivers
VCCOI/O bank powerProgrammable 1.2–3.3 V per bank for interface voltage level matching
M0–M2Configuration mode pinsSet boot mode (e.g., Master SelectMAP, JTAG, SPI)
CCLKConfiguration clockInput clock for slave parallel or serial configuration
INIT_BConfiguration statusOpen-drain output indicating configuration status and error flag

Key Features

FeatureDesign Value
Integrated PCI Express® EndpointHard IP block supporting Gen2 x1/x2/x4/x8 with AXI interface
Low-power 40 nm processReduces dynamic and static power vs. 65 nm Virtex-5, enabling higher density at same thermal envelope
Partial ReconfigurationEnables runtime logic updates without full device reset or system interruption
Multi-Standard TransceiversSingle transceiver lane configurable for PCIe, SATA, SRIO, or custom protocols
Advanced Clock ManagementEach CMT contains one PLL and two MMCMs for jitter filtering and phase alignment

Applications

Wireless Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time digital predistortion (DPD) and MIMO signal processing in LTE/5G remote radio units.

IC Role / Device Role / Timing Role: Programmable baseband processor implementing adaptive filtering, FFT, and channel estimation pipelines.

Use Value: 640 DSP48E1 slices enable concurrent 4×4 MIMO matrix inversion at >100 MHz clock rate with deterministic latency.

Use Scenario: High-accuracy bit-error-rate testing of 10 GbE and Fibre Channel links.

IC Role / Device Role / Timing Role: Protocol-aware pattern generator and error detector with embedded PRBS engines and eye diagram analysis logic.

Use Value: 24 transceiver lanes support simultaneous multi-port stress testing without external muxing or retiming.

Medical Imaging BackendAvionics Data Concentrators

Use Scenario: Real-time image reconstruction and beamforming in ultrasound and MRI systems.

IC Role / Device Role / Timing Role: High-throughput data aggregator and accelerator interfacing with ADCs, DDR3 memory, and display controllers.

Use Value: 600 I/O pins allow direct connection to >16 high-speed ADC channels plus dual DDR3 interfaces at 800 Mbps.

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control subsystems.

IC Role / Device Role / Timing Role: Deterministic network interface controller with time-triggered scheduling and redundancy management.

Use Value: Hardened Ethernet MACs and deterministic clocking ensure sub-1 µs jitter for AFDX end-system timing compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU3P-2FFVD1760EUltraScale architecture, 350K logic cells, 28 Gb/s transceivers, -2L speed gradeHigher bandwidth and lower latency for 5G fronthaul and AI inference accelerationBetter suited when migrating to 16 nm node for power/performance scaling beyond Virtex-6 limits
XC7VX485T-2FFG1761I7-series architecture, 485K logic cells, 13.1 Gb/s transceivers, -2 speed grade, industrial tempEnhanced SERDES reliability and extended temperature operation for harsh environmentsPreferred for new designs requiring long-term availability and qualification for aerospace/industrial use

Compared with XC6VLX130T-L1FFG1156C, the XCVU3P-2FFVD1760E delivers 2.7× more logic and 2.2× higher transceiver speed but requires board redesign; the XC7VX485T-2FFG1761I offers 3.7× more logic and improved thermal margin while maintaining similar I/O voltage flexibility and configuration compatibility.

Availability

XC6VLX130T-L1FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging, and avionics applications requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX130T-L1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Virtex-6 family was engineered for wireline communications, military/aerospace signal processing, and high-end test instrumentation demanding deterministic timing and multi-protocol serial connectivity.

FAQ

What is the maximum supported transceiver data rate for XC6VLX130T-L1FFG1156C?

The XC6VLX130T-L1FFG1156C supports transceiver data rates up to 12.8 Gb/s per lane. This enables compliance with PCIe Gen2, SATA II, and SRIO 2.1 standards. All 24 transceiver lanes in the XC6VLX130T-L1FFG1156C are rated for this maximum rate under industrial temperature conditions and -1 speed grade timing constraints.

Does XC6VLX130T-L1FFG1156C support partial reconfiguration?

Yes, the XC6VLX130T-L1FFG1156C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This allows dynamic logic updates in designated regions without resetting the entire device or interrupting active I/O or transceiver operations, a capability confirmed in UG372 and validated in production deployments of wireless baseband systems using XC6VLX130T-L1FFG1156C.

What configuration modes are supported by XC6VLX130T-L1FFG1156C?

The XC6VLX130T-L1FFG1156C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from external flash, host processor, or boundary-scan chain, with fallback support enabled via INIT_B assertion handling.

Is XC6VLX130T-L1FFG1156C qualified for industrial temperature operation?

Yes, the XC6VLX130T-L1FFG1156C is specified for industrial temperature range (0°C to +85°C ambient) per its -1 speed grade designation. Thermal performance validation includes junction temperature monitoring under worst-case power dissipation scenarios, and the FFG1156 package provides sufficient thermal resistance for passive cooling in typical 1U chassis environments.

What I/O standards are supported by XC6VLX130T-L1FFG1156C?

The XC6VLX130T-L1FFG1156C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, BLVDS, RSDS, and TMDS I/O standards. Each of its 600 I/O pins is assignable to one of 24 selectable I/O banks, with independent VCCO and reference voltage settings per bank to enable mixed-voltage interface designs.

XC6VLX130T-L1FFG1156C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
10000
Number of Logic Elements/Cells:
128000
Total RAM Bits:
9732096
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VLX130T-L1FFG1156C FAQ

1.How can I place an order for XC6VLX130T-L1FFG1156C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX130T-L1FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX130T-L1FFG1156C reliable?

The price and inventory of XC6VLX130T-L1FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-L1FFG1156C is usually 5 days.

3.What payment methods are accepted for XC6VLX130T-L1FFG1156C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-L1FFG1156C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX130T-L1FFG1156C?

XC6VLX130T-L1FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX130T-L1FFG1156C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX130T-L1FFG1156C?

For technical support, including XC6VLX130T-L1FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-L1FFG1156C requirements.

6.How does Aetrix verify that XC6VLX130T-L1FFG1156C is sourced from the original manufacturer or authorized distributors?

All XC6VLX130T-L1FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-L1FFG1156C meets industry standards.

7.What is the process for return or replacement of XC6VLX130T-L1FFG1156C?

All XC6VLX130T-L1FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-L1FFG1156C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX130T-L1FFG1156C part is unused and in its original packaging.

Return procedure for XC6VLX130T-L1FFG1156C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX130T-L1FFG1156C Tags

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  • XC6VLX130T-L1FFG1156C Images
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