My Inquiry
My Account
AMD XC6VLX130T-L1FFG484C
- Part No.:
- XC6VLX130T-L1FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX130T-L1FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,205
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6VLX130T-L1FFG484C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.5 Mb of block RAM. It operates at -1 speed grade, supports 1.2 V core voltage, and is packaged in a 484-pin FCBGA with 240 user I/Os. It targets high-performance digital signal processing in radar baseband systems.
For engineers reviewing the XC6VLX130T-L1FFG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, DSP slice count, I/O voltage support (1.2V/1.5V/1.8V/2.5V/3.3V), transceiver line rate (up to 6.6 Gb/s), and thermal performance in conduction-cooled enclosures.
Technical Context
The XC6VLX130T-L1FFG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for multiply-accumulate operations, and high-speed serial transceivers compliant with PCIe Gen1/Gen2, SATA, and SRIO standards. It integrates clock management tiles (CMT) with DCMs and PLLs for precise clock synthesis and phase alignment.
It supports SelectIO technology with programmable I/O standards including LVCMOS, SSTL, HSTL, and differential standards such as LVDS and TMDS. Configuration is performed via JTAG, Master SPI, or Slave SelectMAP interfaces, with bitstream encryption available using AES-256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 1,200 DSP48E1 - enables parallel execution of 25×18-bit multiply-accumulate operations per slice at up to 550 MHz |
| Block RAM | 16.5 Mb - provides on-chip memory for FIFOs, coefficient storage, and frame buffers without external DRAM |
| Transceiver Speed | 6.6 Gb/s - supports full-rate PCIe Gen2 x8 links and dual-lane SRIO 2.1 interconnects |
| User I/O Count | 240 - enables direct connection to multiple ADCs, DACs, memory controllers, and peripheral buses |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption and thermal design |
| Speed Grade | -1 - guarantees timing closure at specified maximum frequencies for CLB, RAM, and I/O paths under industrial temperature |
Pinout & Package
XC6VLX130T-L1FFG484C is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 29×29 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu surface finish. Thermal characteristics include θJA = 10.5°C/W and θJB = 2.7°C/W (JEDEC Std 51-2, 4-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Delivers regulated 1.2 V to CLBs, DSP slices, and internal routing fabric |
| VCCAUX | Auxiliary power supply | Supplies 1.8 V to configuration logic, clock management, and transceiver reference circuits |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface interoperability |
| HR_IO_Lx | High-range I/O | Supports 3.3 V tolerant signaling and all SelectIO standards up to 1.8 V |
| HP_IO_Lx | High-performance I/O | Optimized for 1.2–1.5 V operation with sub-1 ns output skew and calibrated input delay |
| GTX_CLK | Transceiver reference clock | Accepts differential input (20–670 MHz) for PLL-based serial data recovery and transmission |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint Block | Hard IP supporting Gen1/Gen2 x1/x2/x4/x8 configurations with AXI4-Stream interface and DMA engine |
| Multi-Gigabit Transceivers | 24 GTX transceivers with built-in 8B/10B encoder/decoder, elastic buffer, and PRBS generator/checker |
| Advanced Clock Management | DCM + PLL per clock region enabling independent frequency synthesis, phase shifting, and jitter filtering |
| System Monitor | On-die analog-to-digital converter measuring die temperature, supply voltages, and external analog inputs |
| AES Bitstream Encryption | Hardware-accelerated 256-bit AES decryption with HMAC authentication prevents unauthorized configuration and cloning |
Applications
| Radar Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems with >1000-channel ADC front-ends. IC Role / Device Role / Timing Role: FPGA fabric implements synchronized multi-channel FFT engines, CFAR detection, and SAR image reconstruction pipelines. Use Value: 128K logic cells and 1.2 GHz DSP throughput enable sub-millisecond latency for adaptive waveform generation and target tracking loops. | Use Scenario: High-fidelity CT and MRI scanner data acquisition with simultaneous 64+ channel digitization at 20 MSPS per channel. IC Role / Device Role / Timing Role: XC6VLX130T-L1FFG484C serves as the central data concentrator, time-aligning ADC samples and compressing raw voxel streams via lossless entropy coding. Use Value: 240 user I/Os directly interface to ADC ASICs and DDR3 memory controllers, eliminating glue logic and reducing BOM count by 37%. |
| Avionics Data Concentrators | Industrial Protocol Gateways |
Use Scenario: ARINC 664 (AFDX) end-system aggregation in flight control computers requiring deterministic latency < 50 μs. IC Role / Device Role / Timing Role: Implements AFDX endpoint with hardware timestamping, virtual link scheduling, and redundant port failover logic. Use Value: Integrated PCIe endpoint and deterministic timing allow direct coupling to PowerPC or ARM host processors without external bridge ICs. | Use Scenario: Multi-protocol fieldbus gateway bridging PROFIBUS DP, EtherCAT, and CANopen in factory automation PLC backplanes. IC Role / Device Role / Timing Role: XC6VLX130T-L1FFG484C hosts dual-port memory-mapped protocol stacks with cycle-accurate timing control for bus arbitration and frame serialization. Use Value: 16.5 Mb block RAM stores protocol state machines and message buffers, enabling concurrent handling of 128+ device connections with < 100 ns jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5× higher logic density (336K LUTs), 16.3 Gb/s transceivers, but requires 0.85 V core and different packaging | Targets next-gen 5G massive MIMO and AI inference acceleration where XC6VLX130T-L1FFG484C lacks bandwidth | Select when migrating legacy Virtex-6 designs to higher throughput and lower power per operation |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485K logic cells, 13.1 Gb/s transceivers, backward-compatible I/O standards but no native PCIe hard IP | Suitable for compute-intensive video analytics where PCIe endpoint offload is not required | Choose when needing higher logic capacity and transceiver speed while retaining similar PCB footprint constraints |
Compared with XC6VLX130T-L1FFG484C, the XCVU9P-2FLGA2104I delivers 2.5× more logic and 2.5× faster serial I/O but demands new power delivery and thermal design; the XC7VX485T-2FFG1761I offers greater density and speed with familiar Virtex pin compatibility yet requires soft PCIe implementation.
Availability
XC6VLX130T-L1FFG484C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging data acquisition, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX130T-L1FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU technologies for data center, aerospace, and industrial markets.
The Virtex-6 family was originally designed by Xilinx for high-throughput, low-latency signal processing in defense electronics, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC6VLX130T-L1FFG484C?
The XC6VLX130T-L1FFG484C has a maximum operating junction temperature of 100°C, validated under industrial temperature range (-40°C to +100°C). This rating applies when using the FFG484 package with recommended PCB thermal vias and copper pour. The device's System Monitor reports real-time die temperature, allowing thermal-aware runtime throttling in safety-critical applications like avionics and medical imaging where XC6VLX130T-L1FFG484C is deployed.
Does XC6VLX130T-L1FFG484C support JTAG boundary-scan testing?
Yes, XC6VLX130T-L1FFG484C fully supports IEEE 1149.1 JTAG boundary-scan testing through dedicated TDI, TDO, TMS, and TCK pins. The BSCAN_VIRTEX6 primitive enables access to internal registers and I/O pins for manufacturing test and in-system diagnostics. This capability is used during board-level validation of radar and medical systems where XC6VLX130T-L1FFG484C serves as the primary signal processor, ensuring interconnect integrity before functional bring-up.
Can XC6VLX130T-L1FFG484C be configured via SPI flash memory?
Yes, XC6VLX130T-L1FFG484C supports Master SPI configuration mode using standard quad-SPI flash devices (e.g., Micron MT25QL series). The FPGA boots automatically after power-up when CONFIG_MODE pins are set to SPI mode, loading the bitstream into configuration memory. This method is widely adopted in medical imaging and avionics systems where XC6VLX130T-L1FFG484C must achieve deterministic startup within 100 ms and support field-upgradable firmware.
What I/O standards are supported by XC6VLX130T-L1FFG484C?
XC6VLX130T-L1FFG484C supports LVCMOS (1.2 V to 3.3 V), SSTL (I and II), HSTL (I and III), LVDS, BLVDS, RSDS, Differential SSTL, and TMDS across its HP and HR I/O banks. Each bank is independently configurable for voltage and standard, enabling mixed-signal interfacing with ADCs, memory, and display controllers. In radar baseband systems where XC6VLX130T-L1FFG484C is used, this flexibility allows direct connection to 1.8 V ADCs and 3.3 V legacy control buses without level shifters.
Is XC6VLX130T-L1FFG484C qualified for automotive applications?
No, XC6VLX130T-L1FFG484C is not AEC-Q100 qualified and is rated only for industrial temperature range (-40°C to +100°C), not automotive grades. It lacks automotive-specific reliability testing, failure mode analysis, and PPAP documentation. While used in ground transportation subsystems, XC6VLX130T-L1FFG484C is not approved for safety-critical ADAS or powertrain applications. Engineers selecting XC6VLX130T-L1FFG484C should verify system-level qualification requirements before deployment in vehicle platforms.
XC6VLX130T-L1FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX130T-L1FFG484C FAQ
1.How can I place an order for XC6VLX130T-L1FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-L1FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-L1FFG484C reliable?
The price and inventory of XC6VLX130T-L1FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-L1FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-L1FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-L1FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-L1FFG484C?
XC6VLX130T-L1FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-L1FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-L1FFG484C?
For technical support, including XC6VLX130T-L1FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-L1FFG484C requirements.
6.How does Aetrix verify that XC6VLX130T-L1FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-L1FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-L1FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-L1FFG484C?
All XC6VLX130T-L1FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-L1FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-L1FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX130T-L1FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VLX130T-L1FFG484C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
