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AMD XC6VLX130T-L1FFG784I
- Part No.:
- XC6VLX130T-L1FFG784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX130T-L1FFG784I.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,685
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Product details
Overview
XC6VLX130T-L1FFG784I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 128,000 logic cells, 1,200 DSP48E1 slices, and 16.5 Mb of block RAM. It supports transceivers up to 6.6 Gb/s and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC6VLX130T-L1FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (528 user I/Os), transceiver lane count (24 lanes), voltage supply requirements (1.0V core, 1.8V/2.5V I/O), and thermal design implications of the FFG784 flip-chip BGA package.
Technical Context
The XC6VLX130T-L1FFG784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 multi-gigabit transceivers compliant with PCIe Gen2, SATA, and SRIO standards.
Configuration is performed via JTAG or SelectMAP interface using external SPI or BPI flash. The device supports partial reconfiguration and includes built-in system monitoring for on-chip temperature and supply voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 128,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 1,200 DSP48E1 - enables parallel multiply-accumulate operations for filtering and FFT engines |
| Block RAM | 16.5 Mb - supports large on-die data buffering and FIFOs without external memory |
| Transceiver Speed | 6.6 Gb/s - meets line rates for 10G Ethernet KR, PCIe Gen2 x8, and CPRI interfaces |
| User I/O Count | 528 - provides high pin density for complex board-level interconnect and protocol bridging |
| Speed Grade | -1 - specifies worst-case timing performance at industrial temperature and voltage conditions |
| Operating Temp | -40°C to +100°C - qualifies for deployment in uncooled industrial and aerospace environments |
Pinout & Package
The XC6VLX130T-L1FFG784I is housed in a 784-pin flip-chip fine-pitch BGA (FFG784) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal and mechanical design must accommodate center power/ground array and perimeter I/O ball layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering CLBs, DSP, and RAM blocks |
| VCCAUX | Auxiliary supply | 2.5V supply for configuration logic, JTAG, and transceiver reference circuitry |
| VCCO | I/O bank supply | Configurable per-bank (1.2V–3.3V) enabling mixed-voltage interface support |
| MRCC / SRCC | Multi-/Single-ended clock input | Dedicated differential clock pins with internal termination and phase alignment |
| GTX_CLK | Transceiver reference clock | Low-jitter input for GTX transceiver PLLs; requires <1.5 ps RMS jitter |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and restarts boot process |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reboot-critical for mission-critical runtime adaptation |
| Integrated System Monitor | On-die ADC measures die temperature and supply voltages, feeding real-time telemetry to configuration logic |
| DSP48E1 Slice Architecture | Includes pre-adder, multiplier, accumulator, and pattern detector-optimized for radar and communications algorithms |
| PCIe Gen2 Endpoint Logic | Hard IP block supporting x1/x2/x4/x8 link widths with integrated TLP parsing and error reporting |
| Transceiver Clock Correction | Automatic elastic buffer management for frequency-mismatched serial links (e.g., CPRI, OBSAI) |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing adaptive filtering, FFT, and CFAR detection pipelines. Use Value: 128K logic cells and 1.2K DSP slices enable concurrent multi-channel processing at >1 GHz sample rates. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive back-projection and denoising kernels from host CPU. Use Value: 16.5 Mb block RAM supports full-frame buffering and on-chip coefficient storage for GPU-like throughput. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic protocol gateway with hardware timestamping and latency-controlled packet scheduling. Use Value: 528 user I/Os and -1 speed grade ensure sub-200 ns end-to-end latency across mixed-bus interfaces. | Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and Fibre Channel links. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with precise jitter injection and eye diagram analysis. Use Value: 24 GTX transceivers operating at 6.6 Gb/s provide native physical-layer stimulus and capture capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX75T-L1FFG484I | Fewer logic cells (75K), reduced DSP count (720), smaller 484-pin FFG package, lower I/O count (240) | Suitable for mid-complexity protocols and compact form factor designs where full LX130T resources are unused | Select when cost, power, or board space constraints outweigh need for maximum transceiver or memory bandwidth |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, higher logic density (444K LUTs), 20 Gb/s transceivers, different pinout and configuration flow | Targets next-generation systems requiring higher throughput, lower latency, and advanced memory interfaces (DDR4, CCIX) | Choose for new designs needing scalability beyond Virtex-6 capabilities; not drop-in compatible |
Compared with XC6VLX75T-L1FFG484I, the XC6VLX130T-L1FFG784I delivers 71% more logic and 67% more DSP resources in a larger package; versus XCKU060-2FFVA1156I, it offers mature toolchain support and proven reliability in legacy aerospace deployments but lacks UltraScale's SerDes and memory controller enhancements.
Availability
XC6VLX130T-L1FFG784I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend acceleration, avionics data concentration, and high-speed test equipment requiring stable component supply over extended product lifecycles.
Supply support for XC6VLX130T-L1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and AI processors for data center, edge, and embedded markets.
The Virtex-6 family was designed for high-performance, high-bandwidth reconfigurable systems in aerospace, defense, and scientific instrumentation where deterministic latency and long-term obsolescence resilience are critical.
FAQ
What is the maximum transceiver data rate supported by the XC6VLX130T-L1FFG784I?
The XC6VLX130T-L1FFG784I supports GTX transceivers with a maximum line rate of 6.6 Gb/s. This enables compliance with PCIe Gen2, 10G Ethernet KR, CPRI Option 3, and Serial RapidIO Gen2 standards. The XC6VLX130T-L1FFG784I achieves this rate under industrial temperature conditions with appropriate reference clock jitter and PCB interconnect design.
Does the XC6VLX130T-L1FFG784I support partial reconfiguration?
Yes, the XC6VLX130T-L1FFG784I supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This allows dynamic replacement of logic modules while maintaining operation of the rest of the design. The XC6VLX130T-L1FFG784I requires Vivado-compatible bitstream generation tools and careful floorplanning to isolate reconfigurable regions.
What are the core and I/O voltage requirements for the XC6VLX130T-L1FFG784I?
The XC6VLX130T-L1FFG784I requires a 1.0V ±3% core supply (VCCINT), 2.5V auxiliary supply (VCCAUX), and programmable I/O bank supplies (VCCO) ranging from 1.2V to 3.3V depending on interface standard. These values are specified in the XC6VLX130T-L1FFG784I DC and switching characteristics datasheet and must be maintained within tolerance across all operating temperatures.
Is the XC6VLX130T-L1FFG784I qualified for industrial temperature operation?
Yes, the XC6VLX130T-L1FFG784I is rated for industrial temperature range (-40°C to +100°C) and carries the 'I' suffix indicating this qualification. Thermal management must account for power dissipation up to 12 W under typical high-utilization scenarios, and the XC6VLX130T-L1FFG784I requires a thermally enhanced PCB layout with adequate copper pour and thermal vias.
How many user I/O pins does the XC6VLX130T-L1FFG784I provide?
The XC6VLX130T-L1FFG784I provides 528 user-configurable I/O pins in its FFG784 package. These are organized into 16 I/O banks supporting LVCMOS, LVDS, SSTL, and HSTL signaling standards. The XC6VLX130T-L1FFG784I allows per-bank voltage selection and on-die termination configuration to match diverse interface requirements.
XC6VLX130T-L1FFG784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 10000
- Number of Logic Elements/Cells:
- 128000
- Total RAM Bits:
- 9732096
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX130T-L1FFG784I FAQ
1.How can I place an order for XC6VLX130T-L1FFG784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX130T-L1FFG784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX130T-L1FFG784I reliable?
The price and inventory of XC6VLX130T-L1FFG784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX130T-L1FFG784I is usually 5 days.
3.What payment methods are accepted for XC6VLX130T-L1FFG784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX130T-L1FFG784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX130T-L1FFG784I?
XC6VLX130T-L1FFG784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX130T-L1FFG784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX130T-L1FFG784I?
For technical support, including XC6VLX130T-L1FFG784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX130T-L1FFG784I requirements.
6.How does Aetrix verify that XC6VLX130T-L1FFG784I is sourced from the original manufacturer or authorized distributors?
All XC6VLX130T-L1FFG784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX130T-L1FFG784I meets industry standards.
7.What is the process for return or replacement of XC6VLX130T-L1FFG784I?
All XC6VLX130T-L1FFG784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX130T-L1FFG784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX130T-L1FFG784I part is unused and in its original packaging.
Return procedure for XC6VLX130T-L1FFG784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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