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AMD XC6VLX195T-1FFG1156I

Part No.:
XC6VLX195T-1FFG1156I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC6VLX195T-1FFG1156I.pdf
Description:
IC FPGA 600 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,220

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Product details

Overview

XC6VLX195T-1FFG1156I from AMD (formerly Xilinx) is a high-performance 40 nm Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -1 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-bandwidth wired communications infrastructure.

For engineers reviewing the XC6VLX195T-1FFG1156I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage flexibility, embedded memory depth, and PCIe endpoint compliance for protocol-aware system integration.

Technical Context

The XC6VLX195T-1FFG1156I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), DSP48E1 slices, and multi-gigabit transceivers (MGTs). It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per single-ended I/O.

Its transceivers comply with PCIe Gen2 (5.0 GT/s), SATA II (3.0 Gb/s), and CPRI v6.0 protocols. The device includes dual-core PowerPC 440 microprocessors in LX195T variants with hard IP, though XC6VLX195T-1FFG1156I is a logic-only configuration without embedded processors.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells195,168 - total available LUT-based programmable resources for custom digital logic implementation
Block RAM10,368 kbits - distributed on-chip memory for FIFOs, buffers, or lookup tables without external memory
Transceiver Line Rate6.6 Gb/s - maximum serial data rate per MGT lane, enabling 10G Ethernet PHY or CPRI interfaces
I/O Pins600 - user-configurable bidirectional pins across 24 I/O banks supporting mixed-voltage operation
Speed Grade-1 - guaranteed timing performance at industrial temperature range with defined setup/hold margins
PCIe InterfaceGen2 x8 endpoint - hardware-accelerated root complex or endpoint functionality compliant with PCIe Base Spec 2.0

Pinout & Package

XC6VLX195T-1FFG1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal and mechanical design requires controlled PCB stack-up and thermal vias under the die area.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supply1.0 V ±3% supply for FPGA logic fabric; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V supply for configuration circuitry, JTAG, and transceiver reference clocks
VCCO_0I/O bank powerProgrammable 1.2–3.3 V output driver voltage per bank; enables mixed-standard interface coexistence
MRMaster resetActive-low asynchronous reset that clears configuration memory and halts startup sequence
CLK_INDedicated clock inputSingle-ended or differential global clock input routed to MMCM/PLL for clock synthesis and deskew

Key Features

FeatureDesign Value
Multi-Gigabit Transceivers24 MGT lanes supporting 600 Mb/s–6.6 Gb/s rates with built-in 8B/10B encoding and elastic buffers
Embedded Memory10,368 kbits of true dual-port BRAM with byte-write enable and parity support for safety-critical buffering
SelectIO TechnologySupport for 18 I/O standards including LVDS, TMDS, and RSDS with programmable slew rate and drive strength
PCIe Gen2 Hard IPIntegrated endpoint block with DMA engine, TLP parser, and MSI-X interrupt controller-no soft-core overhead
Configuration SecurityBitstream encryption via AES-256 and HMAC authentication to prevent cloning and reverse engineering

Applications

Wireless Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time baseband signal processing in LTE-Advanced macrocell and small-cell radio units.

IC Role / Device Role / Timing Role: FPGA fabric implements channel coding, FFT/IFFT, and digital pre-distortion (DPD) algorithms with deterministic latency.

Use Value: 6.6 Gb/s transceivers interface directly to RFICs via JESD204B, eliminating external serializer/deserializer chips.

Use Scenario: High-precision automated test equipment requiring synchronized multi-channel waveform generation and capture.

IC Role / Device Role / Timing Role: Timing and pattern generator core with sub-nanosecond jitter control and deterministic I/O delay calibration.

Use Value: 600 user I/O pins enable parallel stimulus/response across 16+ analog channels while maintaining tight skew alignment.

Avionics Data ConcentratorsIndustrial Imaging Systems

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data concentrator in flight control systems.

IC Role / Device Role / Timing Role: Protocol-aware bridging and time-triggered scheduling engine with hardware timestamping.

Use Value: PCIe Gen2 x8 endpoint connects to host processor for real-time telemetry upload without CPU polling overhead.

Use Scenario: Multi-sensor machine vision system with simultaneous CMOS sensor readout and real-time image preprocessing.

IC Role / Device Role / Timing Role: Pixel pipeline accelerator with pixel-level filtering, histogram generation, and ROI extraction.

Use Value: 10,368 kbits of block RAM provides frame buffering for four 12-bit 10 MP sensors at 30 fps without external DRAM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104I16 nm process, 2.5× higher logic density, 25.6 Gb/s transceivers, no native PCIe Gen2 hard IPRequires soft PCIe core; better suited for AI inference acceleration and 400G Ethernet line cardsChoose when migrating to newer process node and needing higher bandwidth, accepting increased design complexity
XC7VX485T-2FFG1761I28 nm process, 485K logic cells, PCIe Gen3 x16 endpoint, same 6.6 Gb/s transceiver max rateHigher logic capacity but larger footprint; supports Gen3 protocol for next-gen host interconnectChoose when requiring more CLBs and PCIe Gen3 compatibility while retaining similar transceiver performance

Compared with XC6VLX195T-1FFG1156I, the XC7VX485T-2FFG1761I offers greater logic capacity and PCIe Gen3 support but increases board area and power; the XCVU9P-2FLGA2104I delivers superior bandwidth and density at 16 nm but removes native PCIe Gen2 hard IP, shifting protocol handling to soft logic.

Availability

XC6VLX195T-1FFG1156I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended product lifecycles.

Supply support for XC6VLX195T-1FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-6 family was designed for high-performance logic, serial connectivity, and embedded processing in wired communications, military, and aerospace systems.

FAQ

What is the operating temperature range for XC6VLX195T-1FFG1156I?

The XC6VLX195T-1FFG1156I is rated for industrial temperature operation from –40°C to +100°C. This range is validated across all I/O banks, transceivers, and logic fabric under specified voltage and loading conditions. The "I" suffix in the part number explicitly denotes industrial-grade qualification, and thermal derating curves are provided in DS152 for junction temperature management in sealed enclosures.

Does XC6VLX195T-1FFG1156I include embedded PowerPC processors?

No, the XC6VLX195T-1FFG1156I is a logic-optimized Virtex-6 device and does not integrate PowerPC 440 cores. Only the Virtex-6 SX and HXT families include hard processor subsystems. This part contains only programmable logic, DSP48E1 slices, block RAM, and transceivers-making it ideal for pure digital signal processing and protocol bridging where soft-core processors are implemented in fabric.

What configuration modes does XC6VLX195T-1FFG1156I support?

The XC6VLX195T-1FFG1156I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Configuration is performed via dedicated CCLK, DIN, and INIT_B pins, with bitstream loading from SPI flash or external processor. Bitstream encryption and HMAC authentication are enabled during configuration to ensure secure boot integrity for the XC6VLX195T-1FFG1156I.

Can XC6VLX195T-1FFG1156I operate with multiple I/O voltage standards simultaneously?

Yes, XC6VLX195T-1FFG1156I supports concurrent operation across 24 independent I/O banks, each configurable for VCCO voltages from 1.2 V to 3.3 V. This allows simultaneous LVDS (2.5 V), SSTL-18 (1.8 V), and HSTL (1.5 V) signaling on the same device-critical for interfacing with heterogeneous memory, ADCs, and legacy peripherals without level-shifting components.

Is PCIe Gen2 x8 support in XC6VLX195T-1FFG1156I implemented in hard IP or soft logic?

The PCIe Gen2 x8 endpoint in XC6VLX195T-1FFG1156I is implemented as hardened silicon IP, not soft logic. It includes dedicated physical layer (PHY), data link layer (DLL), and transaction layer logic with integrated DMA engine and MSI-X interrupt controller-reducing resource usage and ensuring deterministic latency and full compliance with PCI-SIG specifications for the XC6VLX195T-1FFG1156I.

XC6VLX195T-1FFG1156I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
15600
Number of Logic Elements/Cells:
199680
Total RAM Bits:
12681216
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC6VLX195T-1FFG1156I FAQ

1.How can I place an order for XC6VLX195T-1FFG1156I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX195T-1FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX195T-1FFG1156I reliable?

The price and inventory of XC6VLX195T-1FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-1FFG1156I is usually 5 days.

3.What payment methods are accepted for XC6VLX195T-1FFG1156I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-1FFG1156I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX195T-1FFG1156I?

XC6VLX195T-1FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX195T-1FFG1156I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX195T-1FFG1156I?

For technical support, including XC6VLX195T-1FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-1FFG1156I requirements.

6.How does Aetrix verify that XC6VLX195T-1FFG1156I is sourced from the original manufacturer or authorized distributors?

All XC6VLX195T-1FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-1FFG1156I meets industry standards.

7.What is the process for return or replacement of XC6VLX195T-1FFG1156I?

All XC6VLX195T-1FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-1FFG1156I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX195T-1FFG1156I part is unused and in its original packaging.

Return procedure for XC6VLX195T-1FFG1156I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX195T-1FFG1156I Tags

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