AMD XC6VLX195T-1FFG784C
- Part No.:
- XC6VLX195T-1FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-1FFG784C.pdf
- Description:
- IC FPGA 400 I/O 784FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VLX195T-1FFG784C from AMD (formerly Xilinx) is a high-performance 40nm Virtex-6 FPGA featuring 195,168 logic cells, 12.8 Gb/s transceiver capability, and integrated PCIe Gen2 x8 endpoint support. It operates at -1 speed grade with 1.0V core voltage and targets high-bandwidth wired infrastructure and military-grade reconfigurable computing systems.
For engineers reviewing the XC6VLX195T-1FFG784C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), block RAM depth (36 Kb per BRAM), and deterministic timing closure for aerospace avionics interfaces.
Technical Context
The XC6VLX195T-1FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18×25 multipliers, and dual-port 36 Kb block RAMs. It supports DDR3 memory interfaces up to 800 MHz and includes dedicated clock management tiles with MMCM and PLL for low-jitter clock synthesis.
This device integrates 24 GTX transceivers capable of 600 Mb/s to 6.6 Gb/s operation, compliant with PCIe Gen2, SATA, and CPRI standards. Its SelectIO technology enables programmable I/O standards across 12 banks with independent VCCO and VREF per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,168 - determines maximum combinational/sequential logic capacity for protocol stack implementation |
| Block RAM | 11,712 Kb - supports large on-chip buffering for video frame stores or packet buffering in baseband processing |
| GTX Transceivers | 24 lanes - enables full-rate CPRI v6.1 links or dual 10GbE MAC+PHY implementations |
| I/O Pins | 400 user I/O - provides sufficient pins for parallel DDR3 x72 interface plus auxiliary control and status signals |
| Speed Grade | -1 - guarantees timing closure at 1.0V core supply with worst-case junction temperature of 85°C |
| Package | FFG784 - 29×29 mm flip-chip BGA with 1.0 mm pitch, qualified for extended temperature industrial use |
Pinout & Package
XC6VLX195T-1FFG784C uses a 784-pin Fine-Pitch Flip-Chip BGA (FFG) package with 400 user-configurable I/Os distributed across 12 I/O banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VREF pins per bank, supporting mixed-voltage system interfacing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% required for CLB and routing fabric; decoupling critical for signal integrity |
| VCCAUX | Auxiliary power supply | 1.8V for configuration logic, clock management, and transceiver analog circuitry |
| MR | Master reset input | Active-low asynchronous reset that clears configuration memory and halts state machines |
| CCLK | Configuration clock | Drives internal configuration shift register during slave serial or JTAG programming |
| INIT_B | Configuration status output | Open-drain indicator signaling successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP eliminates external bridge IC and reduces latency for host-FPGA data transfers |
| DDR3 Memory Controller | Hard macro supporting 800 MHz data rate with built-in calibration and error correction logic |
| MMCM Clock Management | Provides sub-100 fs jitter synthesis for high-speed SerDes and ADC/DAC sampling clocks |
| SelectIO Technology | Enables simultaneous LVDS, SSTL, HSTL, and single-ended I/O standards within one bank |
| Transceiver Power Gating | Per-lane shutdown reduces dynamic power by up to 40% when unused lanes are disabled |
Applications
| Radar Signal Processing | Avionics Data Concentrator |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne AESA radar systems requiring low-latency FFT and beamforming. IC Role / Device Role / Timing Role: Configurable hardware accelerator implementing fixed-point arithmetic pipelines synchronized to 125 MHz system clock. Use Value: Delivers deterministic 2.1 μs latency from RF sample input to target detection output using 192 CLBs and 48 BRAMs. | Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and AFDX endpoints in flight control computers. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with guaranteed 1.5 μs end-to-end latency under 99.999% load. Use Value: Enables DO-254 DAL-A compliance via traceable RTL and static timing analysis across all 12 I/O banks. |
| 5G Baseband Unit | Military SATCOM Modem |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations operating in 3.5 GHz TDD bands with 100 MHz channel bandwidth. IC Role / Device Role / Timing Role: Reconfigurable OFDM modulator/demodulator with 24 GTX lanes handling 4×4 MIMO IQ streams at 245.76 Msps. Use Value: Achieves EVM < 2.1% at 256-QAM using integrated 18×25 multipliers and 36 Kb BRAM-based FFT buffers. | Use Scenario: Adaptive waveform generation and demodulation for anti-jam satellite terminals using DVB-S2X and proprietary waveforms. IC Role / Device Role / Timing Role: Cryptographically secure channel processor with AES-256 engine and low-jitter 106.25 MHz reference clock for QPSK carrier recovery. Use Value: Maintains BER < 1e-12 over 120 dB path loss using adaptive equalization implemented in 142,000 LUTs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm process, 2,586K logic cells, higher transceiver density (64 GTY), but requires 0.85V core supply | Targets next-gen 400G Ethernet line cards where power efficiency and bandwidth density outweigh legacy pin compatibility | Choose only if redesigning PCB for advanced packaging and migrating from 40nm design constraints |
| XC7VX690T-2FFG1927I | 28 nm process, 693,120 logic cells, same FFG package footprint but 1927-pin count vs. 784-pin | Suitable for migration paths requiring higher logic density while retaining similar I/O voltage flexibility and PCIe Gen3 support | Requires board redesign due to incompatible ball map and thermal pad layout despite shared FFG prefix |
Compared with XC6VLX195T-1FFG784C, the XCVU9P offers 3.2× more logic and 2.7× more transceivers but mandates new power delivery and thermal design; the XC7VX690T provides 3.5× logic increase in larger package without changing voltage domain architecture.
Availability
XC6VLX195T-1FFG784C is available at Aetrix Electronics and suitable for radar signal processing, avionics data concentrators, and 5G baseband units requiring stable component supply throughout long-life military and aerospace programs.
Supply support for XC6VLX195T-1FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms for data center, AI, and embedded markets.
The Virtex-6 family was originally designed by Xilinx for high-performance wired infrastructure and defense electronics requiring deterministic timing, radiation-tolerant configuration, and multi-standard serial connectivity.
FAQ
What is the maximum supported DDR3 data rate for XC6VLX195T-1FFG784C?
The XC6VLX195T-1FFG784C supports DDR3 interfaces up to 800 MHz data rate (1600 MT/s) using its hard memory controller IP. This capability is validated across all I/O banks with VCCO = 1.5V and requires board-level impedance matching to 40 Ω single-ended or 80 Ω differential traces. The XC6VLX195T-1FFG784C includes built-in write leveling and read leveling calibration logic to maintain timing margins across temperature and voltage variation.
Does XC6VLX195T-1FFG784C support PCIe Gen3?
No, XC6VLX195T-1FFG784C does not support PCIe Gen3. It integrates hard PCIe Gen2 x8 endpoint logic compliant with PCI Express Base Specification Revision 2.0. The GTX transceivers operate up to 6.6 Gb/s, which meets Gen2 requirements (5.0 GT/s) but falls short of Gen3's 8.0 GT/s minimum. For PCIe Gen3 designs, engineers must consider Virtex-7 or newer families such as the XC6VLX195T-1FFG784C's successor devices.
What is the operating temperature range for XC6VLX195T-1FFG784C?
The XC6VLX195T-1FFG784C is rated for commercial (0°C to 85°C) and industrial (-40°C to 100°C) temperature ranges, with the "C" suffix indicating commercial grade. Its FFG784 package is qualified to JEDEC JESD22-A104 reliability standards for 1000 cycles of temperature cycling. The XC6VLX195T-1FFG784C maintains timing closure across this range using on-die temperature sensors and adaptive voltage scaling in the MMCM.
How many GTX transceivers are available on XC6VLX195T-1FFG784C?
The XC6VLX195T-1FFG784C contains 24 GTX transceiver quads, each supporting data rates from 600 Mb/s to 6.6 Gb/s. These transceivers are grouped into four banks (GTX0–GTX3), with six quads per bank. Each quad includes dedicated TX/RX phase alignment circuits and shared reference clock inputs. The XC6VLX195T-1FFG784C supports protocols including CPRI, SATA II, and PCIe Gen2 without external retimers.
Is XC6VLX195T-1FFG784C pin-compatible with other Virtex-6 devices?
XC6VLX195T-1FFG784C is not pin-compatible with other Virtex-6 devices due to unique ball mapping optimized for its 195K logic cell count and I/O bank distribution. While it shares the FFG784 package outline with smaller Virtex-6 variants like XC6VLX75T, the power, configuration, and transceiver pin assignments differ significantly. Migration to XC6VLX195T-1FFG784C requires full PCB redesign and signal integrity validation.
XC6VLX195T-1FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX195T-1FFG784C FAQ
1.How can I place an order for XC6VLX195T-1FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-1FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-1FFG784C reliable?
The price and inventory of XC6VLX195T-1FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-1FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-1FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-1FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-1FFG784C?
XC6VLX195T-1FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-1FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-1FFG784C?
For technical support, including XC6VLX195T-1FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-1FFG784C requirements.
6.How does Aetrix verify that XC6VLX195T-1FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-1FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-1FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-1FFG784C?
All XC6VLX195T-1FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-1FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-1FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX195T-1FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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