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AMD XC6VLX195T-1FFG784I

Part No.:
XC6VLX195T-1FFG784I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
784-BBGA, FCBGA
Datasheet:
AetrixXC6VLX195T-1FFG784I.pdf
Description:
IC FPGA 400 I/O 784FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,564

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Product details

Overview

XC6VLX195T-1FFG784I from AMD (formerly Xilinx) is a Virtex-6 FPGA with 195,168 logic cells, 12.8 Gb/s transceiver capability, and 128 DSP48E1 slices, deployed in high-speed serial communication systems such as 10G Ethernet line cards and optical transport equipment.

For engineers reviewing the XC6VLX195T-1FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (24 GTx), thermal performance (-40°C to +100°C junction), and configuration interface (SPI x4, SelectMAP).

Technical Context

The XC6VLX195T-1FFG784I implements a 40 nm bulk CMOS architecture with integrated Block RAM (up to 14,544 Kbits), Clock Management Tiles (CMT) containing DCMs and PLLs, and configurable I/O banks supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and BLVDS.

It supports multi-gigabit transceivers compliant with PCIe Gen2, SATA, and SRIO protocols, with programmable pre-emphasis and receiver equalization per lane, and includes dedicated PCI Express® Endpoint hard IP blocks for Gen1/Gen2 operation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells195,168 - determines maximum combinational and sequential logic capacity for custom digital design implementation
Block RAM14,544 Kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory interface
Transceivers24 GTx lanes @ up to 11.18 Gb/s - enables 10G Ethernet, CPRI, and Serial RapidIO physical layer connectivity
DSP Slices128 DSP48E1 - delivers fixed-point arithmetic throughput for filtering, FFT, and modulation/demodulation functions
I/O StandardsSSTL-18/25, HSTL-I/II, LVCMOS, LVDS, BLVDS - supports direct interfacing to DDR2/3, memory controllers, and high-speed serdes PHYs
Operating Temp-40°C to +100°C (junction) - qualified for industrial and telecom infrastructure environments
ConfigurationMaster SPI x4, Slave SelectMAP, JTAG - enables flexible, secure, and field-upgradable bitstream loading

Pinout & Package

XC6VLX195T-1FFG784I is housed in a 784-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant construction. The package supports thermal dissipation via exposed thermal pad and provides 448 user I/O pins distributed across 24 I/O banks.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration clock inputDrives internal configuration logic during master SPI or SelectMAP mode; requires stable 50 MHz max clock
DINSerial configuration data inputCarries bitstream during SPI configuration; tied high when unused in SelectMAP mode
PROGRAM_BActive-low configuration resetForces reconfiguration and clears internal state; asynchronous, debounced externally
INIT_BConfiguration status outputIndicates readiness for configuration or detects CRC error during bitstream load
GTX_CLK0_M2C_P/NDifferential transceiver reference clock inputProvides low-jitter clock source for GTx quads; must meet phase noise <1.5 ps RMS (12 kHz–20 MHz)

Key Features

FeatureDesign Value
Integrated PCIe Gen2 EndpointHard IP block reduces RTL integration effort and guarantees protocol compliance for host-facing interfaces
Multi-Voltage I/O BanksEach of 24 banks independently configurable for 1.2 V to 3.3 V, enabling mixed-voltage system interfacing
Advanced Clock ManagementEach CMT contains two DCMs and one PLL for jitter reduction, frequency synthesis, and phase alignment across domains
Transceiver Adaptive EqualizationReceiver-based CTLE and decision feedback equalization compensate for channel loss up to 20 dB at Nyquist
Partial Reconfiguration SupportEnables dynamic module swapping without full device reset, critical for runtime protocol adaptation

Applications

Wireless Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time baseband signal processing in LTE-A and 5G NR macrocell radios requiring adaptive modulation and MIMO precoding.

IC Role / Device Role / Timing Role: XC6VLX195T-1FFG784I serves as the primary programmable baseband processor, hosting PHY-layer algorithms and managing JESD204B links to ADC/DACs.

Use Value: 128 DSP48E1 slices and 24 GTx lanes enable concurrent wideband channelization and deterministic low-latency fronthaul transport.

Use Scenario: Automated test systems performing high-accuracy parametric measurements on ASICs and SoCs using pattern generation and response analysis.

IC Role / Device Role / Timing Role: XC6VLX195T-1FFG784I acts as the real-time pattern engine and timing controller, synchronizing multi-site parallel test vectors with sub-nanosecond skew.

Use Value: 448 user I/O pins and programmable delay elements allow precise per-pin timing control and simultaneous multi-channel stimulus/response capture.

Optical Transport NetworkingAvionics Data Concentrators

Use Scenario: Line cards in OTN switches and DWDM multiplexers handling OC-192/STM-64 and OTU2/OTU3 framing.

IC Role / Device Role / Timing Role: XC6VLX195T-1FFG784I implements OTN framer/mapper logic and manages 10G serial interfaces via integrated GTx lanes.

Use Value: Built-in 64B/66B encoder/decoder and FEC logic offload protocol processing from host CPU while maintaining <100 ns latency.

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data concentrators in flight control and mission computing systems.

IC Role / Device Role / Timing Role: XC6VLX195T-1FFG784I functions as deterministic network interface controller with time-triggered scheduling and dual-redundant link management.

Use Value: -40°C to +100°C operating range and SEU-hardened configuration memory ensure reliability in extended temperature avionics bays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-speed serial interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6VLX240T-1FFG1156I240,000 logic cells, 28 GTx lanes, larger FFG1156 package (37×37 mm, 1.0 mm pitch)Higher gate count and transceiver density suit multi-protocol line cards requiring >24 lanesSelect when additional logic capacity or transceiver count is required beyond XC6VLX195T-1FFG784I limits
XCKU060-2FFVA1156IKintex UltraScale architecture, 48 GTy transceivers (16.3 Gb/s), 340K logic cells, different pinout and configuration flowTargets next-generation 25G/100G systems where higher bandwidth and lower power per Gb are criticalChoose for new designs needing higher serial bandwidth and advanced memory interface support (DDR4, RLDRAM3)

Compared with XC6VLX195T-1FFG784I, XC6VLX240T-1FFG1156I offers scalable capacity within the same Virtex-6 family, while XCKU060-2FFVA1156I represents a generational upgrade with superior transceiver speed and memory interface capability-neither is pin-compatible, requiring board redesign.

Availability

XC6VLX195T-1FFG784I is available at Aetrix Electronics and suitable for wireless infrastructure, optical networking, and avionics systems requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX195T-1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Virtex-6 family was originally designed by Xilinx for high-performance, serial I/O–intensive applications in wired communications, military systems, and scientific instrumentation.

FAQ

What is the maximum transceiver data rate supported by XC6VLX195T-1FFG784I?

The XC6VLX195T-1FFG784I supports GTX transceivers with a maximum data rate of 11.18 Gb/s per lane. This rating is validated under specified voltage (1.0V core, 2.5V auxiliary) and temperature (-40°C to +100°C) conditions, and applies to protocols including 10GBASE-R, CPRI, and SRIO Gen2. The XC6VLX195T-1FFG784I achieves this using adaptive equalization and low-jitter clocking structures integrated into each GTx quad.

Does XC6VLX195T-1FFG784I support partial reconfiguration?

Yes, the XC6VLX195T-1FFG784I supports partial reconfiguration through its configuration logic and frame-based bitstream architecture. This allows dynamic replacement of functional modules without resetting the entire device, enabling runtime protocol switching or feature updates. Implementation requires use of Xilinx ISE Design Suite 14.7 or later with PlanAhead tools, and the XC6VLX195T-1FFG784I must be configured in slave parallel or JTAG mode to enable PR access.

What configuration modes are available for XC6VLX195T-1FFG784I?

The XC6VLX195T-1FFG784I supports three primary configuration modes: Master SPI (using on-chip oscillator), Slave SelectMAP (parallel synchronous), and JTAG boundary-scan. It also supports fallback configuration and multi-bitstream storage in external flash. Configuration is initiated via PROGRAM_B assertion, and status is monitored using INIT_B and DONE signals. The XC6VLX195T-1FFG784I does not support passive serial (Slave Serial) mode.

Is XC6VLX195T-1FFG784I qualified for automotive applications?

No, the XC6VLX195T-1FFG784I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure rate reporting, and qualification testing required for passenger vehicle ECUs. While used in some aerospace and defense platforms, the XC6VLX195T-1FFG784I is intended for telecom infrastructure, test equipment, and industrial control-not automotive safety-critical systems.

What I/O standards does XC6VLX195T-1FFG784I support in bank 15?

Bank 15 of the XC6VLX195T-1FFG784I supports LVDS_25, BLVDS_25, RSDS_25, and mini-LVDS standards when powered at 2.5 V, and LVCMOS25 when powered at 2.5 V. It does not support SSTL or HSTL in this bank. Voltage tolerance is ±0.3 V, and differential standards require matched trace lengths ≤5 mm. These capabilities are documented in the Virtex-6 FPGA Packaging and Pinout Product Specification (UG371 v1.12).

XC6VLX195T-1FFG784I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-6 LXT
Package/Case:
784-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
15600
Number of Logic Elements/Cells:
199680
Total RAM Bits:
12681216
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
784-FCBGA (29x29)

XC6VLX195T-1FFG784I FAQ

1.How can I place an order for XC6VLX195T-1FFG784I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6VLX195T-1FFG784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6VLX195T-1FFG784I reliable?

The price and inventory of XC6VLX195T-1FFG784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-1FFG784I is usually 5 days.

3.What payment methods are accepted for XC6VLX195T-1FFG784I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-1FFG784I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6VLX195T-1FFG784I?

XC6VLX195T-1FFG784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6VLX195T-1FFG784I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6VLX195T-1FFG784I?

For technical support, including XC6VLX195T-1FFG784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-1FFG784I requirements.

6.How does Aetrix verify that XC6VLX195T-1FFG784I is sourced from the original manufacturer or authorized distributors?

All XC6VLX195T-1FFG784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-1FFG784I meets industry standards.

7.What is the process for return or replacement of XC6VLX195T-1FFG784I?

All XC6VLX195T-1FFG784I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-1FFG784I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6VLX195T-1FFG784I part is unused and in its original packaging.

Return procedure for XC6VLX195T-1FFG784I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6VLX195T-1FFG784I Tags

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