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AMD XC6VLX195T-2FF1156C
- Part No.:
- XC6VLX195T-2FF1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VLX195T-2FF1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,341
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Product details
Overview
XC6VLX195T-2FF1156C from AMD (formerly Xilinx) is a high-performance 40 nm FPGA featuring 195,120 logic cells, 12.8 Gb/s transceiver capability, and integrated Block RAM (7,898 kbits). It operates at -2 speed grade with 1.0 V core voltage and supports PCIe Gen2 x8 endpoint functionality in industrial control systems.
For engineers reviewing the XC6VLX195T-2FF1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600), transceiver lane count (16), embedded memory depth, thermal performance in FF1156 package, and PCIe Gen2 compliance for high-speed interface design.
Technical Context
The XC6VLX195T-2FF1156C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18×18 multipliers, and DSP48E1 slices supporting 250+ MHz signal processing. It integrates 16 RocketIO GTP transceivers with programmable equalization and clock correction.
Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two external SPI flash devices. The device includes dedicated PCI Express hard IP blocks compliant with PCIe Base Specification v2.0 for endpoint operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,120 - determines maximum combinational/sequential logic capacity for complex digital functions |
| Block RAM | 7,898 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory |
| Transceivers | 16 × GTP - enables up to 16 serial lanes at 1.25–3.75 Gb/s for SerDes-based protocols |
| I/O Pins | 600 - supports high-pin-count parallel interfaces and multi-voltage bank operation (1.2–3.3 V) |
| PCIe Support | Gen2 x8 Endpoint - delivers 4 GB/s bidirectional bandwidth with integrated hard IP and no soft-core overhead |
| Speed Grade | -2 - guarantees timing closure at 1.0 V core supply with specified junction temperature limits |
Pinout & Package
XC6VLX195T-2FF1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FF1156) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for industrial-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog transceiver power | Supplies 1.2 V to GTP analog circuitry; requires low-noise regulation and local decoupling |
| MGTAVTT | Transceiver termination | Provides 1.2 V termination voltage for differential transceiver outputs |
| VRP/VRN | Reference voltage pair | Defines I/O threshold for differential standards (e.g., LVDS, RSDS) in associated banks |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential clocks up to 800 MHz for global clock network distribution |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Reduces FPGA resource usage by eliminating soft-core implementation; ensures protocol compliance and deterministic latency |
| 16 GTP Transceivers | Enables multi-protocol SerDes connectivity (SATA, CPRI, Aurora) without external PHYs |
| Dual-Boot Configuration | Supports field-upgradable firmware images with fail-safe fallback to known-good configuration |
| Multi-Voltage I/O Banks | Allows direct interfacing to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in high-resolution endoscopy systems. IC Role / Device Role / Timing Role: FPGA fabric processes pixel data streams from CMOS sensors while managing DDR3 memory buffering and HDMI output timing. Use Value: 195K logic cells enable concurrent Bayer demosaicing, noise reduction, and gamma correction; PCIe Gen2 x8 connects to host PC for rapid frame transfer. | Use Scenario: Ultrasound beamforming subsystem with 128-channel analog front-end synchronization. IC Role / Device Role / Timing Role: Configurable logic implements time-aligned sampling control and digital down-conversion; GTP transceivers serialize ADC data to back-end processor. Use Value: 16 GTP lanes provide deterministic 3.125 Gb/s links per channel group; Block RAM stores calibration coefficients and FIR filter taps. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation unit in flight control computers. IC Role / Device Role / Timing Role: Hardened logic implements protocol state machines and time-stamped message routing; PCIe interface relays consolidated data to central processor. Use Value: -2 speed grade ensures reliable operation across -40°C to +100°C; 600 I/O pins support mixed-voltage legacy avionics interfaces. | Use Scenario: High-speed digital pattern generator with synchronized multi-channel output. IC Role / Device Role / Timing Role: FPGA fabric generates precise stimulus waveforms; GTP transceivers deliver 3.75 Gb/s serialized patterns to DUT via SMA connectors. Use Value: DSP48E1 slices perform real-time jitter analysis; 7,898 kbits Block RAM stores extended test vectors with sub-nanosecond timing resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX240T-2FF1156C | 240,000 logic cells, +23% CLB count, same package and transceiver count | Required when design exceeds 195K LC utilization or needs additional DSP slices | Select only if resource margin is insufficient; higher cost and static power |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 270K logic cells, 20 Gb/s GTY transceivers, different pinout | Used for next-generation designs requiring higher bandwidth or lower power per function | Not pin-compatible; requires PCB redesign and toolchain migration |
Compared with XC6VLX195T-2FF1156C, the XC6VLX240T offers headroom for larger logic implementations within identical thermal and board constraints, while the XCKU060 enables architectural upgrades at the cost of full hardware and software requalification.
Availability
XC6VLX195T-2FF1156C is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX195T-2FF1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-6 family, including XC6VLX195T-2FF1156C, was engineered for high-throughput, low-latency system integration in wired infrastructure, defense electronics, and scientific instrumentation.
FAQ
What is the maximum operating junction temperature for XC6VLX195T-2FF1156C?
The XC6VLX195T-2FF1156C has a maximum allowable junction temperature of +100°C under industrial temperature grade conditions. This rating is validated per Xilinx DS152 specification and applies to continuous operation with proper thermal management using the FF1156 package's thermal lid and recommended PCB copper pour. Thermal derating curves are provided in the Virtex-6 DC and Switching Characteristics datasheet.
Does XC6VLX195T-2FF1156C support JTAG boundary-scan testing?
Yes, XC6VLX195T-2FF1156C fully supports IEEE 1149.1 JTAG boundary-scan testing through its dedicated TDI, TDO, TMS, and TCK pins. The device implements a 4-bit instruction register and supports EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. Boundary-scan capability is enabled during configuration and remains active in user mode for board-level diagnostics.
Can XC6VLX195T-2FF1156C be configured using SPI flash memory?
Yes, XC6VLX195T-2FF1156C supports Master SPI configuration mode, allowing boot from standard quad-SPI or dual-SPI flash devices. Configuration bitstream is loaded automatically on power-up when MODE pins are set to 001, and the device supports dual-flash fallback for fail-safe updates. Xilinx UG380 documents supported flash vendors and timing requirements.
What I/O standards are supported by XC6VLX195T-2FF1156C banks?
XC6VLX195T-2FF1156C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL/HSTL, LVDS, RSDS, BLVDS, and TMDS across its 24 selectable I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V. Bank-specific VRP/VRN references enable precise threshold control for differential signaling standards.
Is XC6VLX195T-2FF1156C compatible with Vivado Design Suite?
No, XC6VLX195T-2FF1156C is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 as the final and only officially supported toolchain. Synthesis, implementation, and bitstream generation must be performed using ISE; no migration path exists to Vivado due to architectural differences between Virtex-6 and 7-series+ families.
XC6VLX195T-2FF1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 15600
- Number of Logic Elements/Cells:
- 199680
- Total RAM Bits:
- 12681216
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VLX195T-2FF1156C FAQ
1.How can I place an order for XC6VLX195T-2FF1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX195T-2FF1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX195T-2FF1156C reliable?
The price and inventory of XC6VLX195T-2FF1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX195T-2FF1156C is usually 5 days.
3.What payment methods are accepted for XC6VLX195T-2FF1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX195T-2FF1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX195T-2FF1156C?
XC6VLX195T-2FF1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX195T-2FF1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX195T-2FF1156C?
For technical support, including XC6VLX195T-2FF1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX195T-2FF1156C requirements.
6.How does Aetrix verify that XC6VLX195T-2FF1156C is sourced from the original manufacturer or authorized distributors?
All XC6VLX195T-2FF1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX195T-2FF1156C meets industry standards.
7.What is the process for return or replacement of XC6VLX195T-2FF1156C?
All XC6VLX195T-2FF1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX195T-2FF1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX195T-2FF1156C part is unused and in its original packaging.
Return procedure for XC6VLX195T-2FF1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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